Abstract: According to one embodiment, a battery includes a battery group, a case, a metal plate, an insulator and an electrical connection path. The battery group includes a plurality of batteries, and each of the batteries includes an electrode group and a metal exterior container made in which the electrode group is housed. The metal plate is provided between the battery group and the base and forms a clearance between the metal plate and the base. The insulator has plasticity and an electrical insulating property, and is sandwiched between the battery group and the metal plate. The insulator electrically insulates between the exterior container of each of the batteries and the metal plate. The electrical connection path electrically connects the metal plate to the base.

Abstract: According to one embodiment, a battery connection structure for connecting a cylindrical electrode terminal provided on a battery cell, includes a connection member formed of conductive material, which integrally includes a connection part and a cylindrical engagement part extending from the connection part and to be engaged in an inner hole of the electrode terminal; and a spring member which is fitted in the inner hole of the engagement part and presses the engagement part against an inner surface of the electrode terminal.

Abstract: According to one embodiment, a secondary battery device includes a plurality of secondary battery cells and a resin case including a plurality of wall portions defining a plurality of accommodation sections, which are configured to individually accommodate the secondary battery cells. At least one of the wall portions defining each of the accommodation sections includes a plurality of pressure springs molded integrally with the wall portion from a synthetic resin and configured to press and position each of the secondary battery cells accommodated in the accommodation sections.

Abstract: According to one embodiment provides an assembled battery which comprises electric cells each having a protruding electrode terminal, a bus bar which is connected to the electrode terminal, also electrically connected to the electrode terminal, and comprises an accommodating portion that has an opening and accommodates the electrode terminal along a protruding direction of the protruding portion from the opening, and a protruding portion which is formed on one of a peripheral surface of the electrode terminal along the protruding direction and an inner surface of the accommodating portion along the protruding direction, protrudes toward the other of the peripheral surface and the inner surface, extends in the protruding direction, and comes into contact with the other.

Abstract: A battery includes a plurality of electrode members each having a positive electrode, a negative electrode and an insulating separator arranged between the positive electrode and the negative electrode, bus bars each electrically connected to electrode members, and a battery case that houses the electrode members.

Abstract: According to one embodiment, a battery includes, an electrode body includes a positive electrode plate, a negative electrode plate, and an insulating separator disposed between the positive and negative electrode plates, a lead electrically connected to the electrode body, and a metal terminal includes a cavity electrically connected to the lead at any one point.

Abstract: According to one embodiment, a secondary battery device includes a secondary battery cell, a case configured to accommodate the secondary battery cell, and foam coating layers sandwiched between an outer surface of the secondary battery cell and an inner surface of the case and configured to hold the secondary battery cell.

Abstract: An in-mold forming apparatus including a first mold and a second mold for injection molding and a film feeding mechanism for feeding in-mold foil between the first mold and the second mold. A transfer foil is formed on the in-mold foil. The in-mold forming apparatus further includes a mold closing mechanism for closing the first mold and the second mold, thereby to fix the in-mold foil inside a cavity formed between the first mold and the second mold, a resin injection forming mechanism for injecting fused resin into the cavity, thereby to unit the transfer foil formed on the in-mold foil with the resin, and a charger arranged in the neighborhood of at least one of the first mold, the second mold, and the in-mold foil. The charger includes a charging unit for freeing ions and charging particles in the neighborhood of the in-mold foil, and an electrode for adsorbing the particles charged by the ions.

Abstract: An in-mold forming apparatus including a first mold and a second mold for injection molding and a film feeding mechanism for feeding in-mold foil between the first mold and the second mold. A transfer foil is formed on the in-mold foil. The in-mold forming apparatus further includes a mold closing mechanism for closing the first mold and the second mold, thereby to fix the in-mold foil inside a cavity formed between the first mold and the second mold, a resin injection forming mechanism for injecting fused resin into the cavity, thereby to unit the transfer foil formed on the in-mold foil with the resin, and a charger arranged in the neighborhood of at least one of the first mold, the second mold, and the in-mold foil. The charger includes a charging unit for freeing ions and charging particles in the neighborhood of the in-mold foil, and an electrode for adsorbing the particles charged by the ions.

Abstract: A semiconductor device has: a semiconductor substrate having a surface which has a predetermined pattern, in which an insulating layer is embedded; an interlayer insulator film formed on the substrate, the interlayer insulator film having a protective coat for protecting the substrate; and an electrode formed on the interlayer insulator film. In addition, a method for manufacturing a semiconductor device comprises the steps of: forming a semiconductor substrate having a surface which has a groove in which an insulating layer is embedded; forming a protective coat for protecting the surface of the semiconductor substrate, on the upper surface of the insulating layer embedded in the groove; and forming an electrode on the protective coat.

Abstract: A radio communication equipment having a battery compartment and a battery pack provided in the battery compartment, the equipment including a first connector block having a female portion provided at the battery pack, and the first connector block having a first contact with a first contact portion and a second contact portion facing the first contact portion, and a second connector block having a male portion provided at the battery, and the second connector block having a second contact having elasticity with a third contact portion and a fourth contact portion facing the third contact portion, wherein the second connector block is engaged with the first connector block, and the third contact portion is pressed against the first contact portion and the fourth contact portion is pressed against the second contact portion by the elasticity of the second contact.

Abstract: A radio communication equipment including a housing and a battery pack to be attached to said housing, said radio communication equipment having a male connector of a floating connector provided on said housing, and a female connector the floating connector provided on said battery pack to engage with said male connector.

Abstract: A mobile radio terminal device is of such a double-backing type as to connect an upper casing and lower casing to each other by a hinge. The lower casing includes an input section and a battery. The upper casing includes an antenna, a circuit board having a CPU, a semiconductor memory and a radio circuit, and an interface connectable to various kinds of devices including an external antenna. By a connection line pattern of the circuit board, the antenna and interface are connected to the radio circuit.

Abstract: A semiconductor device has: a semiconductor substrate having a surface which has a predetermined pattern, in which an insulating layer is embedded; an interlayer insulator film formed on the substrate, the interlayer insulator film having a protective coat for protecting the substrate; and an electrode formed on the interlayer insulator film. In addition, a method for manufacturing a semiconductor device comprises the steps of: forming a semiconductor substrate having a surface which has a groove in which an insulating layer is embedded; forming a protective coat for protecting the surface of the semiconductor substrate, on the upper surface of the insulating layer embedded in the groove; and forming an electrode on the protective coat.

Abstract: A semiconductor device has: a semiconductor substrate having a surface which has a predetermined pattern, in which an insulating layer is embedded; an interlayer insulator film formed on the substrate, the interlayer insulator film having a protective coat for protecting the substrate; and an electrode formed on the interlayer insulator film. In addition, a method for manufacturing a semiconductor device comprises the steps of: forming a semiconductor substrate having a surface which has a groove in which an insulating layer is embedded; forming a protective coat for protecting the surface of the semiconductor substrate, on the upper surface of the insulating layer embedded in the groove; and forming an electrode on the protective coat.

Abstract: In the mobile communication terminal of the present invention, a free end portion of a rod type antenna is mounted to one of the longitudinal sides of the housing surface against which the ear is placed during communication such that the antenna can rotate freely between the position along said longitudinal side and the specific position at which the antenna reaches after rotating in a direction distant from the said housing surface against which the ear is placed. By this arrangement, in the non-communication state, the antenna can be held in a position along said longitudinal side of the housing, and in the state of communication, the antenna can be held in a position distant from the housing. By enabling the antenna to rotate in the above-mentioned manner, the antenna can be held away from the housing at the time of communication.

Abstract: A semiconductor device has: a semiconductor substrate having a surface which has a predetermined pattern, in which an insulating layer is embedded; an interlayer insulator film formed on the substrate, the interlayer insulator film having a protective coat for protecting the substrate; and an electrode formed on the interlayer insulator film. In addition, a method for manufacturing a semiconductor device comprises the steps of: forming a semiconductor substrate having a surface which has a groove in which an insulating layer is embedded; forming a protective coat for protecting the surface of the semiconductor substrate, on the upper surface of the insulating layer embedded in the groove; and forming an electrode on the protective coat.

Abstract: A semiconductor device has: a semiconductor substrate having a surface which has a predetermined pattern, in which an insulating layer is embedded; an interlayer insulator film formed on the substrate, the interlayer insulator film having a protective coat for protecting the substrate; and an electrode formed on the interlayer insulator film. In addition, a method for manufacturing a semiconductor device comprises the steps of: forming a semiconductor substrate having a surface which has a groove in which an insulating layer is embedded; forming a protective coat for protecting the surface of the semiconductor substrate, on the upper surface of the insulating layer embedded in the groove; and forming an electrode on the protective coat.

Abstract: A semiconductor device has: a substantially flat surface which is formed on a semiconductor substrate and has a predetermined pattern, in which an insulating layer is embedded; an interlayer insulator film formed on the surface, the interlayer insulator film having a protective layer for protecting the semiconductor substrate; and formed on the interlayer insulator film and adapted for bonding a wire thereto. In addition, a method for manufacturing a semiconductor device comprises the steps of: forming a semiconductor substrate having a surface which has a groove in which an insulating layer is embedded; forming a protective coat for protecting the surface of the semiconductor substrate, on the upper surface of the insulating layer embedded in the groove; and forming an electrode on the protective coat.

Abstract: A shield case for use in a electronic apparatus enclosed in a housing, includes a groove mating with a protruding portion of the housing. When the shield case is clamped between a PC board and the housing, the shield case is urged toward the PC board, and thereby contacts a ground pattern of the PC board.