Abstract: The objective of this invention is to provide an ultrasonic flip-chip mounting method with little variance in the formed electrode joints between a semiconductor chip and a substrate. The ultrasonic method for mounting a flip chip of the present invention may include a step for forming several bump electrodes (106) on the main surface of one side of a semiconductor chip (100) and a step for respectively bringing several projecting electrodes (106) into contact with the corresponding conductor patterns (132) on a substrate and for applying ultrasonic vibration to the semiconductor chip, where the ultrasonic vibration direction is oriented in a direction oblique to the electrode patterns (132). In this way, an effective width for joining formation W1 is greater than the width of the conductor patterns W of the electrode patterns (132).

Abstract: The objective of this invention is to present a semiconductor device manufacturing method with which the formation of voids inside an underfill resin can be prevented using a simple configuration.

Abstract: A method for creating electrical interconnects between a semiconductor die and package. In the preferred embodiment, an insulating material is applied over the die and extends to the substrate contact pads, leaving a portion of each contact pad exposed. Holes are then trimmed through the insulating material, exposing at least a portion of each die bond pad. A conductive material is then applied over the die, flowing into the holes, contacting the die bond pads, and extending out to contact at least a portion of each substrate contact pad. In another preferred embodiment, an electrically conductive bump may be formed on each die bond pad, protruding through said non-conductive material and at least partially through said conductive material. The conductive layer is then laser trimmed, forming conductive patches that serve as electrical interconnects between the die and package substrate.

Abstract: A method for creating electrical interconnects between a semiconductor die and package. In the preferred embodiment, an insulating material is applied over the die and extends to the substrate contact pads, leaving a portion of each contact pad exposed. Holes are then trimmed through the insulating material, exposing at least a portion of each die bond pad. A conductive material is then applied over the die, flowing into the holes, contacting the die bond pads, and extending out to contact at least a portion of each substrate contact pad. In another preferred embodiment, an electrically conductive bump may be formed on each die bond pad, protruding through said non-conductive material and at least partially through said conductive material. The conductive layer is then laser trimmed, forming conductive patches that serve as electrical interconnects between the die and package substrate.

Abstract: A method for creating electrical interconnects between a semiconductor die and package. In the preferred embodiment, an insulating material is applied over the die and extends to the substrate contact pads, leaving a portion of each contact pad exposed. Holes are then trimmed through the insulating material, exposing at least a portion of each die bond pad. A conductive material is then applied over the die, flowing into the holes, contacting the die bond pads, and extending out to contact at least a portion of each substrate contact pad. In another preferred embodiment, an electrically conductive bump may be formed on each die bond pad, protruding through said non-conductive material and at least partially through said conductive material. The conductive layer is then laser trimmed, forming conductive patches that serve as electrical interconnects between the die and package substrate.

Abstract: A centrifugal braking apparatus for a baitcasting reel comprises a spool, pivot shafts, brake levers, and a ring-shaped braking member. The spool is rotatably supported between both side plates of a reel main body. Each of the pivot shafts is disposed on the spool so as to be arranged apart from a rotation axis of the spool in a radius direction thereof and extended at right angles to a straight line parallel with the rotation axis of the spool. Each of the brake levers has a tip end portion and a root end portion that is pivotably supported by the pivot shaft so that the tip end portion of the brake lever is movable toward a standard plane, which includes a central axis of the pivot shaft and is perpendicular to the rotation axis of the spool, under a function of centrifugal force produced by rotation of the spool. The ring-shaped braking member is provided on the reel main body so that the tip end portion of the brake lever can be brought into contact with the ring-shaped braking member.

Abstract: A mineral absorption promoting agent containing oligouronic acid, e. g. oligogalacturonic acid or oligomannuronic acid ?degree of polymerization (n)=1 to 9! is described. Since this oligouronic acid ?polymerization degree (n)=1 to 9! forms a complex with mineral, it promotes absorption of minerals into living organisms by simply adding it to foods, drinks or pharmacentical compositions for oral use. Since the agent has no problem with safety, the agent is suitable for repeated eating, drinking or taking, and the agent is very effective.