Patents by Inventor Nobuaki Matsumoto

Nobuaki Matsumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250052818
    Abstract: Provided is a secondary battery diagnostic method that can evaluate a remaining life of a secondary battery more accurately than in the related art without disassembly of the secondary battery. The secondary battery diagnostic method includes estimating characteristic parameters of a secondary battery to be diagnosed at a time of diagnosis (step S1), obtaining a relationship between an electrolyte diffusion coefficient and a discharge capacity (step S2), determining, on the basis of the relationship between the electrolyte diffusion coefficient and the discharge capacity, a threshold value Dth of the electrolyte diffusion coefficient (step S3), and obtaining a difference ?D between the threshold value Dth and an electrolyte diffusion coefficient Dn at the time of diagnosis (step S4).
    Type: Application
    Filed: August 5, 2024
    Publication date: February 13, 2025
    Applicant: Maxell, Ltd.
    Inventors: Yuko Kishimi, Nobuaki Matsumoto
  • Patent number: 12202925
    Abstract: Provided are an excellently convenient ultraviolet-curable organopolysiloxane causing no surface curing inhibition even when cured in the atmosphere; a composition containing such organopolysiloxane; and a cured product of such composition. The organopolysiloxane is represented by the following formula (1): wherein each R1 independently represents a monovalent hydrocarbon group having 1 to 10 carbon atoms or a group represented by the following formula (2), each molecule has at least one group represented by the following formula (2), m is a number satisfying 1?m?10,000, wherein R2 represents a group having at least one of an acryloyl group, methacryloyl group, acryloyloxyalkyl group or methacryloyloxyalkyl group, R3 represents a divalent hydrocarbon group having 1 to 20 carbon atoms.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: January 21, 2025
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Nobuaki Matsumoto, Toshiyuki Ozai, Taichi Kitagawa, Kohei Otake, Mamoru Hagiwara
  • Patent number: 12180320
    Abstract: Provided are a low-viscosity ultraviolet curable silicone composition capable of being used even in a surface exposure method and a lift-up method etc.; and a cured product superior in tensile strength and elongation at break.
    Type: Grant
    Filed: December 29, 2023
    Date of Patent: December 31, 2024
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Nobuaki Matsumoto, Kohei Otake, Taichi Kitagawa, Tsuyoshi Matsuda, Toshiyuki Ozai
  • Patent number: 12168745
    Abstract: (A) an organopolysiloxane having, per molecule, two groups each represented by formula (1) (R1 represents a C1-20 monovalent hydrocarbon group, R2 represents an oxygen atom or the like, R3 represents an acryloyloxyalkyl group or the like, and p and a respectively represent numbers satisfying 0-10 and 1-3); (B) a monofunctional (meth)acrylate compound not including a siloxane structure; (C) an organopolysiloxane resin which comprises a unit (a) represented by formula (2) (R1, R2, R3, a, and p are identical to those described above), a R43SiO1/2 unit (b) (in the formula, R4 represents a monovalent hydrocarbon group having 1-10 carbon atoms), and a SiO4/2 unit (c), and in which the mole ratio of the total of units (a) and (b) to unit (c) is in a range of 0.4 to 1.2:1; and (D) a photoinitiator.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: December 17, 2024
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Kohei Otake, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Yoshinori Ogawa
  • Patent number: 12139571
    Abstract: Provided is an oxygen-curable silicone composition that cures at room temperature, the reaction being triggered by oxygen in the atmosphere, without requiring heat or UV irradiation at the time of use, and exhibits good mechanical strength after curing. A composition including (A) an organopolysiloxane (1) (R1 represents an alkyl group or the like but has at least one acryloyloxy group or the like in the molecule, R2 represents an oxygen atom or the like, and m and n represent numbers that satisfy 1?m+n?1,000.), (B) a silicone resin including (a) a unit of formula (2), (b) an R13SiO1/2 unit, and (c) an SiO4/2 unit, the molar ratio of [(a)+(b)]/(c) being 0.4-1.2, and the silicone resin having 0.005 mol/100 g or more Si—OH groups (R1 and R2 are the same as above. R3 represents an acryloyloxyalkyl group or the like, p represents 0-10, and 1 represents a number that satisfies 1-3.), and (C) an organoborane complex (3) (R4-R6 represent hydrocarbon groups.).
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: November 12, 2024
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Masayuki Ikeno
  • Patent number: 12109335
    Abstract: A composition for an acoustic wave probe, containing the following ingredients (A) to (D): (A) a linear polysiloxane having a vinyl group; (B) a linear polysiloxane having two or more Si—H groups in a molecular chain; (C) a polysiloxane resin; and (D) surface-treated silica particles having an average primary particle diameter more than 16 nm and less than 100 nm, as well as, a silicone resin for an acoustic wave probe, an acoustic wave probe, an ultrasound probe, an acoustic wave measurement apparatus, an ultrasound diagnostic apparatus, a photoacoustic wave measurement apparatus, and an ultrasound endoscope, using the composition for an acoustic wave probe.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: October 8, 2024
    Assignees: FUJIFILM Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshihiro Nakai, Shigeki Uehira, Taichi Kitagawa, Nobuaki Matsumoto
  • Publication number: 20240297336
    Abstract: An electrochemical device of the present invention includes a positive electrode, a negative electrode, a non-aqueous electrolyte, and a separator. The separator includes a first porous layer composed mainly of a thermoplastic resin and a second porous layer composed mainly of insulating particles with a heat resistant temperature of 150° C. or higher. The first porous layer is disposed to face the negative electrode.
    Type: Application
    Filed: April 26, 2024
    Publication date: September 5, 2024
    Applicant: Maxell, Ltd.
    Inventors: Hideaki KATAYAMA, Toshihiro ABE, Nobuaki MATSUMOTO
  • Patent number: 12051775
    Abstract: An electrochemical device of the present invention includes a positive electrode, a negative electrode, a non-aqueous electrolyte, and a separator. The separator includes a first porous layer composed mainly of a thermoplastic resin and a second porous layer composed mainly of insulating particles with a heat-resistant temperature of 150° C. or higher. The first porous layer is disposed to face the negative electrode.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: July 30, 2024
    Assignee: Maxell, Ltd.
    Inventors: Hideaki Katayama, Toshihiro Abe, Nobuaki Matsumoto
  • Publication number: 20240228687
    Abstract: Provided are a low-viscosity ultraviolet curable silicone composition capable of being used even in a surface exposure method and a lift-up method etc.; and a cured product superior in tensile strength and elongation at break.
    Type: Application
    Filed: December 29, 2023
    Publication date: July 11, 2024
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Nobuaki MATSUMOTO, Kohei OTAKE, Taichi KITAGAWA, Tsuyoshi MATSUDA, Toshiyuki OZAI
  • Publication number: 20240199815
    Abstract: Provided is a UV-curable silicone composition containing: (A) an organopolysiloxane having, in one molecule, two groups represented by formula (1) (R1 is a monovalent hydrocarbon group, R2 is an oxygen atom or an alkylene group, R3 is an acryloyloxyalkyl group, etc., p represents a number satisfying 0?p?10, and a represents a number satisfying 1?a?3.); (B) an organopolysiloxane resin which comprises (a) a unit represented by formula (2) (R1 to R3, a and p are the same as above), (b) a R43SiO1/2 unit (R4 represents a monovalent hydrocarbon group), and (c) a SiO4/2 unit, and in which a molar ratio of the sum of the unit (a) and the unit (b) and the unit (c) is 0.6 to 1.
    Type: Application
    Filed: March 31, 2022
    Publication date: June 20, 2024
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Nobuaki MATSUMOTO, Taichi KITAGAWA, Shinji KIMURA
  • Patent number: 12002792
    Abstract: A method for transferring alignment marks between substrate systems includes providing a substrate having semiconductor devices and alignment marks in precise alignment with the semiconductor devices; and physically transferring and bonding the semiconductor devices and the alignment marks to a temporary substrate of a first substrate system. The method can also include physically transferring and bonding the semiconductor devices and the alignment marks to a mass transfer substrate of a second substrate system; and physically transferring and bonding the semiconductor devices and the alignment marks to a circuitry substrate of a third substrate system. A system for transferring alignment marks between substrate systems includes the substrate having the semiconductor devices and the alignment marks in precise alignment with the semiconductor devices. The system also includes the first substrate system, and can include the second substrate system and the third substrate system.
    Type: Grant
    Filed: November 18, 2022
    Date of Patent: June 4, 2024
    Assignees: SemiLEDs Corporation, Shin-Etsu Chemical Co. Ltd.
    Inventors: David Trung Doan, Yoshinori Ogawa, Nobuaki Matsumoto
  • Publication number: 20240132648
    Abstract: Provided are a low-viscosity ultraviolet curable silicone composition capable of being used even in a surface exposure method and a lift-up method etc.; and a cured product superior in tensile strength and elongation at break.
    Type: Application
    Filed: December 29, 2023
    Publication date: April 25, 2024
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Nobuaki MATSUMOTO, Kohei OTAKE, Taichi KITAGAWA, Tsuyoshi MATSUDA, Toshiyuki OZAI
  • Publication number: 20240076434
    Abstract: Provided is an oxygen-curable silicone composition that cures at room temperature, the reaction being triggered by oxygen in the atmosphere, without requiring heat or UV irradiation at the time of use, and exhibits good mechanical strength after curing. A composition including (A) an organopolysiloxane (1) (R1 represents an alkyl group or the like but has at least one acryloyloxy group or the like in the molecule, R2 represents an oxygen atom or the like, and m and n represent numbers that satisfy 1?m+n 1,000.), (B) a silicone resin including (a) a unit of formula (2), (b) an R13SiO1/2 unit, and (c) an SiO4/2 unit, the molar ratio of [(a)+(b)]/(c) being 0.4-1.2, and the silicone resin having 0.005 mol/100 g or more Si-OH groups (R1 and R2 are the same as above. R3 represents an acryloyloxyalkyl group or the like, p represents 0-10, and 1 represents a number that satisfies 1-3.), and (C) an organoborane complex (3) (R4-R6 represent hydrocarbon groups.).
    Type: Application
    Filed: August 13, 2020
    Publication date: March 7, 2024
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Taichi KITAGAWA, Nobuaki MATSUMOTO, Toshiyuki OZAI, Masayuki IKENO
  • Publication number: 20240072203
    Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicants: SemiLEDs Corporation, SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
  • Publication number: 20240063339
    Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
    Type: Application
    Filed: October 26, 2023
    Publication date: February 22, 2024
    Applicants: SamiLEDs Corporation, SHIN-ETSU CHEMICAL. CO., LTD.
    Inventors: Chen-Fu Chu, SHIH-KAI CHAN, YI-FENG SHIH, DAVID TRUNG DOAN, TRUNG TRI DOAN, YOSHINORI OGAWA, KOHEI OTAKE, KAZUNORI KONDO, KEIJI OHORI, TAICHI KITAGAWA, NOBUAKI MATSUMOTO, TOSHIYUKI oZAI, SHUHEI UEDA
  • Patent number: 11862755
    Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: January 2, 2024
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
  • Patent number: 11862754
    Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
    Type: Grant
    Filed: May 10, 2022
    Date of Patent: January 2, 2024
    Assignees: SemiLEDs Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
  • Patent number: D1054388
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: December 17, 2024
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinori Ogawa, Kazunori Kondo, Nobuaki Tomura, Nobuaki Matsumoto, Akira Sakamoto, Taichi Kitagawa
  • Patent number: D1070795
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: April 15, 2025
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinori Ogawa, Kazunori Kondo, Nobuaki Tomura, Nobuaki Matsumoto, Akira Sakamoto, Taichi Kitagawa
  • Patent number: D1070796
    Type: Grant
    Filed: July 8, 2022
    Date of Patent: April 15, 2025
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinori Ogawa, Kazunori Kondo, Nobuaki Tomura, Nobuaki Matsumoto, Akira Sakamoto, Taichi Kitagawa