Patents by Inventor Nobuaki Matsumoto

Nobuaki Matsumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230018855
    Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate [30], and forming a plurality of die sized semiconductor structures [32] on the substrate [30]. The method also includes the steps of providing a receiving plate [42] having an elastomeric polymer layer [44], placing the substrate [30] and the receiving plate [42] in close proximity with a gap [101] therebetween, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate [30] to the semiconductor layer [50] at an interface with the substrate [30] to lift off the semiconductor structures [32] through the gap [101] onto the elastomeric polymer layer [44]. During the laser lift-off (LLO) process the elastomeric polymer layer [44] functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures [32] in place on the receiving plate [42].
    Type: Application
    Filed: August 3, 2022
    Publication date: January 19, 2023
    Applicants: SemiLEDs Corporation, SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: CHEN-FU CHU, SHIH-KAI CHAN, YI-FENG SHIH, DAVID TRUNG DOAN, TRUNG TRI DOAN, YOSHINORI OGAWA, KOHEI OTAKE, KAZUNORI KONDO, KEIJI OHORI, TAICHI KITAGAWA, NOBUAKI MATSUMOTO, TOSHIYUKI OZAI, SHUHEI UEDA, JUNYA ISHIZAKI
  • Patent number: 11545474
    Abstract: A method for transferring alignment marks between substrate systems includes providing a substrate having semiconductor devices and alignment marks in precise alignment with the semiconductor devices; and physically transferring and bonding the semiconductor devices and the alignment marks to a temporary substrate of a first substrate system. The method can also include physically transferring and bonding the semiconductor devices and the alignment marks to a mass transfer substrate of a second substrate system; and physically transferring and bonding the semiconductor devices and the alignment marks to a circuitry substrate of a third substrate system. A system for transferring alignment marks between substrate systems includes the substrate having the semiconductor devices and the alignment marks in precise alignment with the semiconductor devices. The system also includes the first substrate system, and can include the second substrate system and the third substrate system.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: January 3, 2023
    Assignees: SemiLEDs Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: David Trung Doan, Yoshinori Ogawa, Nobuaki Matsumoto
  • Publication number: 20220359785
    Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
    Type: Application
    Filed: July 20, 2022
    Publication date: November 10, 2022
    Applicants: SemiLEDS Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
  • Publication number: 20220315418
    Abstract: A method for transferring microstructures, comprising at least the steps of: (i) bonding a plurality of microstructures formed on one surface of a supplier substrate to a silicone-based rubber layer formed on a donor substrate; (ii) separating some or all of the plurality of microstructures from the supplier substrate and transferring the some or all of the plurality of microstructures to the donor substrate through the silicone-based rubber layer to produce the donor substrate having the to plurality of microstructures temporality fixed thereon; (iii) washing or neutralizing the donor substrate having the plurality of microstructures temporality fixed thereon; (iv) drying the washed or neutralized donor substrate having the plurality of microstructures temporality fixed thereon; and (v) transferring the dried donor substrate having the plurality of microstructures temporality fixed thereof so that the donor substrate can be subjected to a subsequent step.
    Type: Application
    Filed: July 6, 2020
    Publication date: October 6, 2022
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinori OGAWA, Keiji OHORI, Shuhei UEDA, Kazunori KONDO, Toshiyuki OZAI, Nobuaki MATSUMOTO, Taichi KITAGAWA, Kohei OTAKE, Minoru KAWAHARA
  • Publication number: 20220320366
    Abstract: A method for fabricating semiconductor light emitting devices (LEDs) includes forming a plurality of light emitting diode (LED) structures having sidewall P-N junctions on a growth substrate, and forming an isolation layer on the light emitting diode (LED) structures having corners at intersections of the epitaxial structures with the growth substrate. The method also includes forming an etchable covering channel layer on the isolation layer, forming a patterning protection layer on the covering channel layer, forming etching channels in the covering channel layer using a first etching process, and removing the corners of the isolation layer by etching the isolation layer using a second etching process. Following the second etching process the isolation layer covers the sidewall P-N junctions. The method can also include bonding the growth substrate to a carrier and separating the growth substrate from the light emitting diode (LED) structures using a laser lift off (LLO) process.
    Type: Application
    Filed: February 16, 2022
    Publication date: October 6, 2022
    Applicants: SemiLEDs Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: CHEN-FU CHU, SHIH-KAI CHAN, YI-FENG SHIH, TRUNG TRI DOAN, DAVID TRUNG DOAN, YOSHINORI OGAWA, KAZUNORI KONDO, TOSHIYUKI OZAI, NOBUAKI MATSUMOTO, TAICHI KITAGAWA
  • Patent number: 11435354
    Abstract: There is provided a simple and minimally invasive adenocarcinoma detection method. The adenocarcinoma detection method of the present invention includes a step of detecting in vitro a presence or absence of an abnormal cleavage in a specific protein in a test subject-derived sample. The abnormal cleavage in the specific protein is, for example, a cleavage resulting in one or more breaks in a peptide bond in the specific protein and/or a cleavage resulting in a deletion of one or two more amino acid residues at one or more sites of the specific protein. The adenocarcinoma detection method of the present invention includes a step of detecting a presence or amount of a protein having the abnormal cleavage or a decrease in an amount of a normal protein.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: September 6, 2022
    Assignees: UNIVERSITY OF MIYAZAKI, OSAKA UNIVERSITY
    Inventors: Masamitsu Nakazato, Nobuhiro Matsumoto, Yasuji Arimura, Hironobu Tsubouchi, Toshifumi Takao, Nobuaki Okumura, Masafumi Fukuda
  • Publication number: 20220271198
    Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
    Type: Application
    Filed: May 10, 2022
    Publication date: August 25, 2022
    Applicants: SemiLEDs Corporation, SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Chen-Fu Chu, SHIH-KAI CHAN, YI-FENG SHIH, DAVID TRUNG DOAN, TRUNG TRI DOAN, YOSHINORI OGAWA, KOHEl OTAKE, KAZUNORI KONDO, KEIJI OHORI, TAICHI KITAGAWA, NOBUAKI MATSUMOTO, TOSHIYUKI OZAi, SHUHEI UEDA
  • Patent number: 11417799
    Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: August 16, 2022
    Assignees: SemiLEDs Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
  • Patent number: 11370869
    Abstract: According to the present invention, an ultraviolet curable silicone composition for stereolithography, which contains (A) an organopolysiloxane that has two groups represented by formula (1) (wherein each R1 independently represents a monovalent hydrocarbon group having 1-20 carbon atoms; R2 represents an oxygen atom or the like; R3 represents an acryloyloxyalkyl group or the like; p represents a number satisfying 0?p?10; and a represents a number satisfying 1?a?3) in each molecule, (B) an organopolysiloxane resin that is composed of (a) a unit represented by formula (2) (wherein R1-R3, a and p are as defined above), (b) an R43SiO1/2 unit (wherein each R4 independently represents a monovalent hydrocarbon group having 1-10 carbon atoms) and (c) an SiO4/2 unit, and wherein the molar ratio of the total of the unit (a) and the unit (b) to the unit (c) is within the range of 0.6-1.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: June 28, 2022
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Kohei Otake, Nobuaki Matsumoto, Taichi Kitagawa, Toshiyuki Ozai, Atsushi Yaginuma
  • Publication number: 20220135744
    Abstract: Provided are an excellently convenient ultraviolet-curable organopolysiloxane causing no surface curing inhibition even when cured in the atmosphere; a composition containing such organopolysiloxane; and a cured product of such composition. The organopolysiloxane is represented by the following formula (1): wherein each R1 independently represents a monovalent hydrocarbon group having 1 to 10 carbon atoms or a group represented by the following formula (2), each molecule has at least one group represented by the following formula (2), m is a number satisfying 1?m?10,000, wherein R2 represents a group having at least one of an acryloyl group, methacryloyl group, acryloyloxyalkyl group or methacryloyloxyalkyl group, R3 represents a divalent hydrocarbon group having 1 to 20 carbon atoms.
    Type: Application
    Filed: March 5, 2020
    Publication date: May 5, 2022
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Nobuaki MATSUMOTO, Toshiyuki OZAI, Taichi KITAGAWA, Kohei OTAKE, Mamoru HAGIWARA
  • Publication number: 20220124949
    Abstract: A stamp head unit including: a stamp component including at least a silicone-based rubber film on a quartz glass substrate; a stamp-component-holding component including a surface having a hole for vacuum suction of a surface of the quartz glass substrate of the stamp component; and a tubular component having an evacuation suction hole connected to communicate with the hole for vacuum suction so as to maintain a vacuum, and being coupled and fixed with the stamp-component-holding component. This provides: a stamp component that can be fixed stably by a simple and convenient vacuum chuck system; a stamp head unit with which the stamp component can be replaced in a short time; and a microstructure-transfer apparatus provided with the stamp component and the stamp head unit.
    Type: Application
    Filed: December 10, 2019
    Publication date: April 21, 2022
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hideo NAKAGAWA, Yoshinori OGAWA, Nobuaki MATSUMOTO, Shuhei UEDA, Keiji OHORI, Kohei OTAKE
  • Publication number: 20220119663
    Abstract: Provided is an ultraviolet curable silicone composition capable of being ejected via inkjet ejection. The composition of the invention is an ultraviolet curable silicone composition comprising: (A) an organopolysiloxane represented by the following general formula (1) wherein each R1 independently represents a group selected from a monovalent aliphatic hydrocarbon group having 1 to 10 carbon atoms, an acryloyl group, a methacryloyl group, an alkyl acrylate group and an alkyl methacrylate group, while the component (A) has per molecule at least two groups selected from an acryloyl group, a methacryloyl group, an alkyl acrylate group and an alkyl methacrylate group; n represents a number satisfying 10?n?1,000; (B) a monofunctional (meth)acrylate compound having no siloxane structure; and/or (C) a multifunctional (meth)acrylate compound having no siloxane structure; and (D) a photopolymerization initiator.
    Type: Application
    Filed: December 30, 2021
    Publication date: April 21, 2022
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Nobuaki MATSUMOTO, Taichi KITAGAWA, Atsushi YAGINUMA, Masaaki SHIROTA
  • Publication number: 20220033690
    Abstract: This UV curable silicone composition contains (A) an organopolysiloxane represented by general formula (1) [R1 represents a monovalent hydrocarbon group having 1-20 carbon atoms, R2 represents an aromatic group, X represents a group represented by formula (2), a, m, and n respectively represent numbers in the ranges of 1?a?3, 1?m?2,000, 1?n?2,000, and m/(n+m)?0.01 is satisfied. (R1 is as defined above. R3 represents an oxygen atom or an alkylene group having 1-20 carbon atoms, R4 represents an acryloyloxyalkyl group, a methacryloyloxyalkyl group, an acryloyloxyalkyloxy group, or a methacryloyloxyalkyloxy group, p represents a number in the range of 0?p?10, and c represents a number in the range of 1?c?3)], (B) a mono-functional (meth)acrylate compound not containing a siloxane structure, and (C) a photopolymerization initiator, and provides, as a temporary fixing material, a cured product having excellent adhesiveness and rubber strength.
    Type: Application
    Filed: November 15, 2019
    Publication date: February 3, 2022
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kohei OTAKE, Nobuaki MATSUMOTO, Taichi KITAGAWA
  • Publication number: 20220017790
    Abstract: An ultraviolet curable silicone adhesive composition which contains (A) an organopolysiloxane represented by formula (1) (wherein each R1 represents a polymerizable group or a monovalent hydrocarbon group having 1-20 carbon atoms, provided that at least one of the R1 moieties represents a polymerizable group; R2 represents an oxygen atom or an alkylene group having 1-20 carbon atoms; and m and n represent numbers satisfying m?0, n?1 and 1 (m+n)?1,000), (B) an organopolysiloxane resin which is composed of (a) an R33SiO1/2 unit (wherein R3 represents a monovalent hydrocarbon group having 1-10 carbon atoms) and (b) an SiO4/2 unit, with the molar ratio of the unit (a) to the unit (b) being 0.6-1.2:1, (C) a fine silica powder and (D) a photopolymerization initiator, and which does not contain a (meth)acrylate compound that does not have a siloxane structure.
    Type: Application
    Filed: November 15, 2019
    Publication date: January 20, 2022
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Taichi KITAGAWA, Nobuaki MATSUMOTO, Kohei OTAKE
  • Publication number: 20220002595
    Abstract: This composition does not contain a non-crosslinkable organopolysiloxane resin but contains: (A) an organopolysiloxane having, per molecule, two groups each represented by formula (1) (R1 represents a C1-20 monovalent hydrocarbon group, R2 represents an oxygen atom or the like, R3 represents an acryloyloxyalkyl group or the like, and p and a respectively represent numbers satisfying 0-10 and 1-3); (B) a monofunctional(meth)acrylate compound not including a siloxane structure; (C) an organopolysiloxane resin which comprises a unit (a) represented by formula (2) (R1, R2, R3, a, and p are identical to those described above), a R43SiO1/2 unit (b) (in the formula, R4 represents a monovalent hydrocarbon group having 1-10 carbon atoms), and a SiO4/2 unit (c), and in which the mole ratio of the total of units (a) and (b) to unit (c) is in a range of 0.4 to 1.2:1; and (D) a photoinitiator.
    Type: Application
    Filed: October 25, 2019
    Publication date: January 6, 2022
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Kohei OTAKE, Taichi KITAGAWA, Nobuaki MATSUMOTO, Toshiyuki OZAI, Yoshinori OGAWA
  • Publication number: 20210384049
    Abstract: A wet etch system comprises an etching bath comprising an etching solution in a process tank inside an overflow tank flowing over an open top into the overflow tank. The etching bath has a top cover, a gas inlet, and a gas outlet above the etching solution. A gas flow system pumps inert gas into the gas inlet and extracts the gas through the gas outlet under positive pressure. The gas flow system may also bubble inert gas through the etching solution via injectors of a gas sparger in the process tank. A recirculation path connects a liquid outlet port coupled to the overflow tank to a liquid inlet port coupled to the process tank. A pump drives the etching solution to flow from the overflow tank, through a degasser in the recirculation path, back into the process tank, and overflow from the process tank into the overflow tank.
    Type: Application
    Filed: November 3, 2020
    Publication date: December 9, 2021
    Inventors: Derek William Bassett, Antonio Luis Pacheco Rotondaro, Trace Quentin Hurd, Hironobu Hyakutake, Kazuyoshi Mizumoto, Nobuaki Matsumoto
  • Patent number: 11180680
    Abstract: This composition contains (A) 100 parts of an organopolysiloxane having two groups represented by general formula (1) (R1 represents a monovalent hydrocarbon group having 1-20 carbon atoms, R2 represents an oxygen atom or the like, R3 represents an acryloyloxyalkyl group or the like, p represents a number satisfying 0?p?10, and “a” represents a number satisfying 1?a?3) per molecule, (B) 1-500 parts of a monofunctional (meth)acrylate compound not containing a siloxane structure, (C) 1-5,000 parts of an organopolysiloxane resin containing (a) an R43SiO1/2 unit (in the formula, R4 represents a monovalent hydrocarbon group having 1-10 carbon atoms) and (b) a SiO4/2 unit, where the molar ratio of the unit (a) to the unit (b) is in the range of 0.6 to 1.2:1, (D) 1-100 parts of fine powder silica, and (E) 0.01-20 parts of an optical polymerization initiator.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: November 23, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Kohei Otake, Nobuaki Matsumoto, Eri Asakura
  • Publication number: 20210351166
    Abstract: A method for transferring alignment marks between substrate systems includes providing a substrate having semiconductor devices and alignment marks in precise alignment with the semiconductor devices; and physically transferring and bonding the semiconductor devices and the alignment marks to a temporary substrate of a first substrate system. The method can also include physically transferring and bonding the semiconductor devices and the alignment marks to a mass transfer substrate of a second substrate system; and physically transferring and bonding the semiconductor devices and the alignment marks to a circuitry substrate of a third substrate system. A system for transferring alignment marks between substrate systems includes the substrate having the semiconductor devices and the alignment marks in precise alignment with the semiconductor devices. The system also includes the first substrate system, and can include the second substrate system and the third substrate system.
    Type: Application
    Filed: April 27, 2021
    Publication date: November 11, 2021
    Applicants: SemiLEDs Corporation, Shin-Etsu Chemical Co. Ltd.
    Inventors: David Trung Doan, Yoshinori Ogawa, Nobuaki Matsumoto
  • Publication number: 20210332175
    Abstract: Provided are a low-viscosity ultraviolet curable silicone composition capable of being used even in a surface exposure method and a lift-up method etc.; and a cured product superior in tensile strength and elongation at break.
    Type: Application
    Filed: September 13, 2019
    Publication date: October 28, 2021
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Nobuaki MATSUMOTO, Kohei OTAKE, Taichi KITAGAWA, Tsuyoshi MATSUDA, Toshiyuki OZAI
  • Publication number: 20210309782
    Abstract: According to the present invention, an ultraviolet curable silicone composition for stereolithography, which contains (A) an organopolysiloxane that has two groups represented by formula (1) (wherein each R1 independently represents a monovalent hydrocarbon group having 1-20 carbon atoms; R2 represents an oxygen atom or the like; R3 represents an acryloyloxyalkyl group or the like; p represents a number satisfying 0?p?10; and a represents a number satisfying 1?a?3) in each molecule, (B) an organopolysiloxane resin that is composed of (a) a unit represented by formula (2) (wherein R1-R3, a and p are as defined above), (b) an R43SiO1/2 unit (wherein each R4 independently represents a monovalent hydrocarbon group having 1-10 carbon atoms) and (c) an SiO4/2 unit, and wherein the molar ratio of the total of the unit (a) and the unit (b) to the unit (c) is within the range of 0.6-1.
    Type: Application
    Filed: July 11, 2019
    Publication date: October 7, 2021
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Kohei OTAKE, Nobuaki MATSUMOTO, Taichi KITAGAWA, Toshiyuki OZAI, Atsushi YAGINUMA