Patents by Inventor Nobuhiro Kinoshita

Nobuhiro Kinoshita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220013508
    Abstract: Reliability of a semiconductor device is improved. The semiconductor device PKG1 includes a wiring substrate SUB1, a semiconductor chip CHP1 and a capacitor CDC mounted on the upper surface 2t of the wiring substrate SUB1, and a lid LD formed of a metallic plate covering the semiconductor chip CHP1 and the wiring substrate SUB1. The semiconductor chip CHP1 is bonded to the lid LD via a conductive adhesive layer, and the capacitor CDC, which is thicker than the thickness of the semiconductor chip CHP1, is disposed in the cut off portion 4d1 provided in the lid LD, and is exposed from the lid LD.
    Type: Application
    Filed: September 27, 2021
    Publication date: January 13, 2022
    Inventors: Toshihiko AKIBA, Kenji SAKATA, Nobuhiro KINOSHITA, Yosuke KATSURA
  • Patent number: 11220089
    Abstract: Provided are a laminate including a metal substrate having a surface with an anodic oxide coating formed thereon, a fluororesin layer laminated in contact with the anodic oxide coating and a fluoroelastomer layer laminated in contact with a surface of the fluororesin layer facing away from the metal substrate, and a gate seal including the laminate.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: January 11, 2022
    Assignee: VALQUA, LTD.
    Inventors: Nobuhiro Yoshida, Masayuki Noguchi, Hiromi Kinoshita
  • Patent number: 11158617
    Abstract: Reliability of a semiconductor device is improved. The semiconductor device PKG1 includes a wiring substrate SUB1, a semiconductor chip CHP1 and a capacitor CDC mounted on the upper surface 2t of the wiring substrate SUB1, and a lid LD formed of a metallic plate covering the semiconductor chip CHP1 and the wiring substrate SUB1. The semiconductor chip CHP1 is bonded to the lid LD via a conductive adhesive layer, and the capacitor CDC, which is thicker than the thickness of the semiconductor chip CHP1, is disposed in the cut off portion 4d1 provided in the lid LD, and is exposed from the lid LD.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: October 26, 2021
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Toshihiko Akiba, Kenji Sakata, Nobuhiro Kinoshita, Yosuke Katsura
  • Publication number: 20200006303
    Abstract: Reliability of a semiconductor device is improved. The semiconductor device PKG1 includes a wiring substrate SUB1, a semiconductor chip CHP1 and a capacitor CDC mounted on the upper surface 2t of the wiring substrate SUB1, and a lid LD formed of a metallic plate covering the semiconductor chip CHP1 and the wiring substrate SUB1. The semiconductor chip CHP1 is bonded to the lid LD via a conductive adhesive layer, and the capacitor CDC, which is thicker than the thickness of the semiconductor chip CHP1, is disposed in the cut off portion 4d1 provided in the lid LD, and is exposed from the lid LD.
    Type: Application
    Filed: June 18, 2019
    Publication date: January 2, 2020
    Inventors: Toshihiko AKIBA, Kenji SAKATA, Nobuhiro KINOSHITA, Yosuke KATSURA
  • Patent number: 9818678
    Abstract: To improve reliability of a semiconductor device, in a flip-chip bonding step, a solder material that is attached to a tip end surface of a projecting electrode in advance and a solder material that is applied in advance over a terminal (bonding lead) are heated and thereby integrated and electrically connected to each other. The terminal includes a wide part (a first portion) with a first width W1 and a narrow part (a second portion) with a second width W2. When the solder material is heated, the thickness of the solder material arranged over the narrow part becomes smaller than the thickness of the solder material arranged in the wide part. Then, in the flip-chip bonding step, a projecting electrode is arranged over the narrow part and bonded onto the narrow part. Thus, the amount of protrusion of the solder material can be reduced.
    Type: Grant
    Filed: March 23, 2014
    Date of Patent: November 14, 2017
    Assignee: Renesas Electronics Corporation
    Inventors: Jumpei Konno, Takafumi Nishita, Nobuhiro Kinoshita, Kazunori Hasegawa, Michiaki Sugiyama
  • Patent number: 9640414
    Abstract: In a semiconductor device formed by mounting a chip laminate including a semiconductor chip having a small diameter and a semiconductor chip having a large diameter over the top surface of a substrate, an excessive stress is prevented from being added to a joint of the two semiconductor chips. By mounting a first semiconductor chip having a large diameter over a support substrate and thereafter mounting a second semiconductor chip having a small diameter over the first semiconductor chip, it is possible to: suppress the inclination and unsteadiness of the second semiconductor chip mounted over the first semiconductor chip; and hence inhibit an excessive stress from being added to a joint of the first semiconductor chip and the second semiconductor chip.
    Type: Grant
    Filed: March 19, 2016
    Date of Patent: May 2, 2017
    Assignee: Renesas Electronics Corporation
    Inventors: Michiaki Sugiyama, Nobuhiro Kinoshita
  • Patent number: 9455240
    Abstract: Reliability of a semiconductor device is improved. Each of a plurality of terminals formed on a chip mounting surface included in a wiring substrate has a shape in which a narrow width portion is arranged between adjacent wide width portions in plan view. Moreover, a center of a tip end surface of each of a plurality of protruding electrodes formed on a semiconductor chip mounted on the wiring substrate is arranged at a position where it overlaps the narrow width portion in plan view, and the plurality of terminals and the plurality of protruding electrodes are electrically connected to each other via a solder member.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: September 27, 2016
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Jumpei Konno, Takafumi Nishita, Nobuhiro Kinoshita, Kazunori Hasegawa, Michiaki Sugiyama
  • Publication number: 20160204082
    Abstract: In a semiconductor device formed by mounting a chip laminate including a semiconductor chip having a small diameter and a semiconductor chip having a large diameter over the top surface of a substrate, an excessive stress is prevented from being added to a joint of the two semiconductor chips. By mounting a first semiconductor chip having a large diameter over a support substrate and thereafter mounting a second semiconductor chip having a small diameter over the first semiconductor chip, it is possible to: suppress the inclination and unsteadiness of the second semiconductor chip mounted over the first semiconductor chip; and hence inhibit an excessive stress from being added to a joint of the first semiconductor chip and the second semiconductor chip.
    Type: Application
    Filed: March 19, 2016
    Publication date: July 14, 2016
    Inventors: Michiaki Sugiyama, Nobuhiro Kinoshita
  • Patent number: 9355869
    Abstract: In a semiconductor device formed by mounting a chip laminate including a semiconductor chip having a small diameter and a semiconductor chip having a large diameter over the top surface of a substrate, an excessive stress is prevented from being added to a joint of the two semiconductor chips. By mounting a first semiconductor chip having a large diameter over a support substrate and thereafter mounting a second semiconductor chip having a small diameter over the first semiconductor chip, it is possible to: suppress the inclination and unsteadiness of the second semiconductor chip mounted over the first semiconductor chip; and hence inhibit an excessive stress from being added to a joint of the first semiconductor chip and the second semiconductor chip.
    Type: Grant
    Filed: August 17, 2013
    Date of Patent: May 31, 2016
    Assignee: Renesas Electronics Corporation
    Inventors: Michiaki Sugiyama, Nobuhiro Kinoshita
  • Patent number: 9349678
    Abstract: The reliability of a semiconductor device is improved. A probe mark is formed on a probe region of a pad covered with a protective insulating film. And, a pillar-shaped electrode has a first portion formed on an opening region and a second portion that is extended over the probe region from the upper portion of the opening region. At this time, a center position of the opening region is shifted from a center position of the pillar-shaped electrode that is opposed to a bonding finger.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: May 24, 2016
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Yoshihiro Ono, Nobuhiro Kinoshita, Tsuyoshi Kida, Jumpei Konno, Kenji Sakata, Kentaro Mori, Shinji Baba
  • Publication number: 20150380345
    Abstract: The reliability of a semiconductor device is improved. A probe mark is formed on a probe region of a pad covered with a protective insulating film. And, a pillar-shaped electrode has a first portion formed on an opening region and a second portion that is extended over the probe region from the upper portion of the opening region. At this time, a center position of the opening region is shifted from a center position of the pillar-shaped electrode that is opposed to a bonding finger.
    Type: Application
    Filed: June 25, 2015
    Publication date: December 31, 2015
    Inventors: Yoshihiro ONO, Nobuhiro KINOSHITA, Tsuyoshi KIDA, Jumpei KONNO, Kenji SAKATA, Kentaro MORI, Shinji BABA
  • Publication number: 20150325528
    Abstract: Provided is a semiconductor device with improved reliability. A logic chip (first semiconductor chip) and a laminated body (second semiconductor chip) are stacked in that order over a wiring substrate. An alignment mark formed over the wiring substrate is aligned with an alignment mark formed on a front surface of the logic chip, whereby the logic chip is mounted over the wiring substrate. An alignment mark formed on a back surface of the logic chip is aligned with an alignment mark formed on a front surface of the laminated body, whereby the laminated body is mounted over the back surface of the logic chip LG.
    Type: Application
    Filed: July 20, 2015
    Publication date: November 12, 2015
    Inventor: Nobuhiro Kinoshita
  • Patent number: 9117826
    Abstract: Provided is a semiconductor device with improved reliability. A logic chip (first semiconductor chip) and a laminated body (second semiconductor chip) are stacked in that order over a wiring substrate. An alignment mark formed over the wiring substrate is aligned with an alignment mark formed on a front surface of the logic chip, whereby the logic chip is mounted over the wiring substrate. An alignment mark formed on a back surface of the logic chip is aligned with an alignment mark formed on a front surface of the laminated body, whereby the laminated body is mounted over the back surface of the logic chip LG.
    Type: Grant
    Filed: March 3, 2014
    Date of Patent: August 25, 2015
    Assignee: Renesas Electronics Corporation
    Inventor: Nobuhiro Kinoshita
  • Publication number: 20150236003
    Abstract: A method of manufacturing a semiconductor device obtained by laminating a first semiconductor chip and a second semiconductor chip with different planar sizes when seen in a plan view on a wiring board via an adhesive material, in which the second semiconductor chip with a relatively larger planar size is mounted on the first semiconductor chip with a relatively smaller planar size. Also, after the first and second semiconductor chips are mounted, the first and second semiconductor chips are sealed with resin. Here, before sealing with the resin, a gap between the second semiconductor chip and the wiring board is previously sealed with the adhesive material used when the first and second semiconductor chips are mounted.
    Type: Application
    Filed: September 14, 2012
    Publication date: August 20, 2015
    Applicant: Renesas Electronics Corporation
    Inventors: Jumpei Konno, Takafumi Nishita, Kenji Sakata, Nobuhiro Kinoshita, Michiaki Sugiyama, Tsuyoshi Kida, Yoshihiro Ono
  • Patent number: 8975120
    Abstract: The reliability of a semiconductor device is to be improved. A microcomputer chip (semiconductor chip) having a plurality of pads formed on a main surface thereof is mounted over an upper surface of a wiring substrate in an opposed state of the chip main surface to the substrate upper surface. Pads coupled to a plurality of terminals (bonding leads) formed over the substrate upper surface comprise a plurality of first pads in which a unique electric current different from the electric current flowing through other pads flows and a plurality of second pads in which an electric current common to the pads flows or does not flow. Another first pad of the first pads or one of the second pads are arranged next to the first pad. The first pads are electrically coupled to a plurality of bonding leads respectively via a plurality of bumps (first conductive members), while the second pads are bonded to the terminals via a plurality of bumps (second conductive members).
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: March 10, 2015
    Assignee: Renesas Electronics Corporation
    Inventors: Naoto Taoka, Atsushi Nakamura, Naozumi Morino, Toshikazu Ishikawa, Nobuhiro Kinoshita
  • Publication number: 20140284780
    Abstract: Provided is a semiconductor device with improved reliability. A logic chip (first semiconductor chip) and a laminated body (second semiconductor chip) are stacked in that order over a wiring substrate. An alignment mark formed over the wiring substrate is aligned with an alignment mark formed on a front surface of the logic chip, whereby the logic chip is mounted over the wiring substrate. An alignment mark formed on a back surface of the logic chip is aligned with an alignment mark formed on a front surface of the laminated body, whereby the laminated body is mounted over the back surface of the logic chip LG.
    Type: Application
    Filed: March 3, 2014
    Publication date: September 25, 2014
    Applicant: Renesas Electronics Corporation
    Inventor: Nobuhiro Kinoshita
  • Publication number: 20140203431
    Abstract: To improve reliability of a semiconductor device, in a flip-chip bonding step, a solder material that is attached to a tip end surface of a projecting electrode in advance and a solder material that is applied in advance over a terminal (bonding lead) are heated and thereby integrated and electrically connected to each other. The terminal includes a wide part (a first portion) with a first width W1 and a narrow part (a second portion) with a second width W2. When the solder material is heated, the thickness of the solder material arranged over the narrow part becomes smaller than the thickness of the solder material arranged in the wide part. Then, in the flip-chip bonding step, a projecting electrode is arranged over the narrow part and bonded onto the narrow part. Thus, the amount of protrusion of the solder material can be reduced.
    Type: Application
    Filed: March 23, 2014
    Publication date: July 24, 2014
    Applicant: Renesas Electronics Corporation
    Inventors: Jumpei KONNO, Takafumi NISHITA, Nobuhiro KINOSHITA, Kazunori HASEGAWA, Michiaki SUGIYAMA
  • Publication number: 20140193954
    Abstract: The reliability of a semiconductor device is to be improved. A microcomputer chip (semiconductor chip) having a plurality of pads formed on a main surface thereof is mounted over an upper surface of a wiring substrate in an opposed state of the chip main surface to the substrate upper surface. Pads coupled to a plurality of terminals (bonding leads) formed over the substrate upper surface comprise a plurality of first pads in which a unique electric current different from the electric current flowing through other pads flows and a plurality of second pads in which an electric current common to the pads flows or does not flow. Another first pad of the first pads or one of the second pads are arranged next to the first pad. The first pads are electrically coupled to a plurality of bonding leads respectively via a plurality of bumps (first conductive members), while the second pads are bonded to the terminals via a plurality of bumps (second conductive members).
    Type: Application
    Filed: March 11, 2014
    Publication date: July 10, 2014
    Applicant: Renesas Electronics Corporation
    Inventors: Naoto Taoka, Atsushi Nakamura, Naozumi Morino, Toshikazu Ishikawa, Nobuhiro Kinoshita
  • Publication number: 20140183759
    Abstract: Reliability of a semiconductor device is improved. Each of a plurality of terminals formed on a chip mounting surface included in a wiring substrate has a shape in which a narrow width portion is arranged between adjacent wide width portions in plan view. Moreover, a center of a tip end surface of each of a plurality of protruding electrodes formed on a semiconductor chip mounted on the wiring substrate is arranged at a position where it overlaps the narrow width portion in plan view, and the plurality of terminals and the plurality of protruding electrodes are electrically connected to each other via a solder member.
    Type: Application
    Filed: December 23, 2013
    Publication date: July 3, 2014
    Applicant: Renesas Electronics Corporation
    Inventors: Jumpei Konno, Takafumi Nishita, Nobuhiro Kinoshita, Kazunori Hasegawa, Michiaki Sugiyama
  • Patent number: 8701972
    Abstract: To improve reliability of a semiconductor device, in a flip-chip bonding step, a solder material that is attached to a tip end surface of a projecting electrode in advance and a solder material that is applied in advance over a terminal (bonding lead) are heated and thereby integrated and electrically connected to each other. The terminal includes a wide part (a first portion) with a first width W1 and a narrow part (a second portion) with a second width W2. When the solder material is heated, the thickness of the solder material arranged over the narrow part becomes smaller than the thickness of the solder material arranged in the wide part. Then, in the flip-chip bonding step, a projecting electrode is arranged over the narrow part and bonded onto the narrow part. Thus, the amount of protrusion of the solder material can be reduced.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: April 22, 2014
    Assignee: Renesas Electronics Corporation
    Inventors: Takafumi Nishita, Nobuhiro Kinoshita, Jumpei Konno, Michiaki Sugiyama, Kazunori Hasegawa