Abstract: In order to supplement results of diagnosis of degradation of an object that has been implemented at set intervals using a degradation progression model for simulating the progression of degradation of the object, a degradation prediction apparatus 100 is provided with: a data generation unit 112 configured to generate, as supplement data, diagnosis results that would be obtained if the degradation diagnosis were performed at an interval shorter than the set interval; a prediction model generation unit 113 configured, using the supplement data, to generate a prediction model for predicting a degradation index indicating a degradation state of the object at a specific point in time; and a degradation index prediction unit 114 configured to predict the degradation index of the object based on the prediction model.

Abstract: An air conditioner includes an outdoor unit, a relay circuit which includes a contact and a relay coil, and a control unit which causes a first voltage equal to or higher than an operating voltage or a second voltage lower than the operating voltage and equal to or higher than a retention voltage to be applied to the relay coil. One end portion of the contact is connected to an alternating-current power supply and the other end portion of the contact is connected to the outdoor unit. One end portion of the relay coil is connected to a power supply for driving the relay circuit. The control unit causes a second voltage to be applied to the relay coil after the contact is turned ON, and causes the first voltage to be applied to the relay coil at a predetermined constant period.

Abstract: In order to supplement results of diagnosis of degradation of an object that has been implemented at set intervals using a degradation progression model for simulating the progression of degradation of the object, a degradation prediction apparatus 100 is provided with: a data generation unit 112 configured to generate, as supplement data, diagnosis results that would be obtained if the degradation diagnosis were performed at an interval shorter than the set interval; a prediction model generation unit 113 configured, using the supplement data, to generate a prediction model for predicting a degradation index indicating a degradation state of the object at a specific point in time; and a degradation index prediction unit 114 configured to predict the degradation index of the object based on the prediction model.

Abstract: An air conditioner includes an outdoor unit, a relay circuit which includes a contact and a relay coil, and a control unit which causes a first voltage equal to or higher than an operating voltage or a second voltage lower than the operating voltage and equal to or higher than a retention voltage to be applied to the relay coil. One end portion of the contact is connected to an alternating-current power supply and the other end portion of the contact is connected to the outdoor unit. One end portion of the relay coil is connected to a power supply for driving the relay circuit. The control unit causes a second voltage to be applied to the relay coil after the contact is turned ON, and causes the first voltage to be applied to the relay coil at a predetermined constant period.

Abstract: In a related fluid leakage detecting device, erroneous leakage determination may occur due to a change in a state of a fluid in piping. A leakage determination system of the present invention includes a first detection means for detecting a prescribed physical quantity indicating a state of a fluid in piping, a second detection means for detecting vibration propagating through the piping, and a leakage determination means for performing leakage determination based on the physical quantity detected by the first detection means and the vibration detected by the second detection means.

Abstract: Degradation of a pipe can be easily detected. A piping inspection system 1 includes an excitation unit 100, a wave detection unit 210, and a diagnosis unit 220. The excitation unit 100 excites waves of different wave modes simultaneously at a first position of a pipe 300. The wave detection unit 210 detects the waves of different wave modes at a second position of the pipe 300. The diagnosis unit 220 diagnoses degradation of the pipe 300 based on a velocity of one of the waves of different wave modes, the velocity being calculated by using a detection time difference between the waves of different wave modes.

Abstract: An information processing apparatus comprises: a processor configured to: estimate a soundness degree of a checkup-object structure from an inspection result of the checkup-object structure, based on a model generated by using an inspection result of a learning-object structure and a soundness degree of the learning-object structure; and present in a recognizable manner an erroneous determination possibility indicating a possibility that a soundness degree determined from the inspection result of the checkup-object structure is erroneous, based on the estimated soundness degree of the checkup-object structure.

Abstract: In a related fluid leakage detecting device, erroneous leakage determination may occur due to a change in a state of a fluid in piping. A leakage determination system of the present invention includes a first detection means for detecting a prescribed physical quantity indicating a state of a fluid in piping, a second detection means for detecting vibration propagating through the piping, and a leakage determination means for performing leakage determination based on the physical quantity detected by the first detection means and the vibration detected by the second detection means.

Abstract: A component built-in module of the present invention includes: a substrate which includes a top surface and a bottom surface; a plurality of electronic components which are mounted on the top surface of the substrate; a resin which seals the top surface of the substrate; and a reinforcing plate which is bonded to the bottom surface of the substrate. The reinforcing plate and the resin are bonded to each other.

Abstract: A component built-in module of the present invention includes: a flexible substrate that includes a first surface and a second surface on an opposite side of the first surface, the first surface including a concave part recessed in a direction from the first surface toward the second surface; a plurality of electronic components that are mounted on the first surface, mounting heights of the electronic components from the first surface to respective upper surfaces of the electronic components differing from each other; and a resin that seals the first surface. Among the plurality of electronic components, at least an electronic component having a highest mounting height is mounted in the concave part.

Abstract: An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.

Abstract: A failure prediction system for performing failure prediction to a monitoring target device by detecting a state, comprising: a state detection unit for detecting state signals of no smaller than two different kinds, and outputting a detection signal corresponding to each of the state signals; a phase processing part for synchronizing a plurality of the detection signals; a signal analysis part for calculating a feature value indicating a feature of the state for each of the detection signals from the phase processing part; and a failure prediction part for performing failure prediction of the monitoring target device for each of the feature values by comparing the feature value in question and a reference value set in advance.

Abstract: A failure prediction system for performing failure prediction to a monitoring target device by detecting a state, comprising: a state detection unit for detecting state signals of no smaller than two different kinds, and outputting a detection signal corresponding to each of the state signals; a phase processing part for synchronizing a plurality of the detection signals; a signal analysis part for calculating a feature value indicating a feature of the state for each of the detection signals from the phase processing part; and a failure prediction part for performing failure prediction of the monitoring target device for each of the feature values by comparing the feature value in question and a reference value set in advance.

Abstract: The present invention pertains to a component-containing module that is: provided with a substrate configured from flat sections and a projecting section, and electronic components mounted on the flat sections and the projecting section; and characterized in that the electronic components mounted on the flat sections are sealed in resin, and the electronic component mounted on the projecting section has an upper part thereof exposed above the resin surface.

Abstract: An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.

Abstract: An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.

Abstract: A component built-in module of the present invention includes: a substrate which includes a top surface and a bottom surface; a plurality of electronic components which are mounted on the top surface of the substrate; a resin which seals the top surface of the substrate; and a reinforcing plate which is bonded to the bottom surface of the substrate. The reinforcing plate and the resin are bonded to each other.

Abstract: A component built-in module of the present invention includes: a flexible substrate that includes a first surface and a second surface on an opposite side of the first surface, the first surface including a concave part recessed in a direction from the first surface toward the second surface; a plurality of electronic components that are mounted on the first surface, mounting heights of the electronic components from the first surface to respective upper surfaces of the electronic components differing from each other; and a resin that seals the first surface. Among the plurality of electronic components, at least an electronic component having a highest mounting height is mounted in the concave part.

Abstract: A heat dissipating structure and a portable device are provided, which enable that heat is dissipated from a heat generating part without causing a user to feel discomfort. A heat transfer member is configured to transfer heat generated in a heat generating body and a thermal storrage unit is thermally connected to the heat transfer member. The thermal storrage unit includes a pack with stretching property and a thermal storrage medium which is filled in the pack and a volume of which changes with a change in temperature. The pack is arranged such that there is a gap between the pack and a first heat dissipating portion at normal temperature and the pack contacts the first heat dissipating portion when the thermal storrage medium expands with a change in temperature.

Abstract: A switch integrated type housing includes a housing body, a switch button sheet, a conductor and a cover sheet. The housing body is provided with a plurality of concave sections on an outer surface of the housing body. The switch button sheet is provided on the outer surface to cover the plurality of concave sections. The conductor has a dome shape downwardly projecting and is provided in each of the plurality of concave sections to contact the switch button sheet. The cover sheet is provided between the switch button sheet and the outer surface of the housing body in a portion of the outer surface of the housing body other than the plurality of concave sections and to cover a lower surface of the conductor in each of the plurality of concave sections.