Abstract: A semiconductor laser assembly includes a substrate 10 having a first mount surface 10a and a second mount surface 10b, and a submount 3 which is mounted on the first mount surface 10a and which is separate from a monitoring photodiode 4. A laser diode 1 is mounted on the submount 3. The monitoring photodiode 4 is mounted on the second mount surface 10b, and an electrode 4a formed on the monitoring photodiode 4 is used as a relay electrode for a metal wire 5a connected to an upper-surface electrode of the laser diode 1.

Abstract: A complex comprising cisplatin and a poly(ethylene glycol)/poly(glutamic acid) block copolymer, wherein the cisplatin is enclosed in the copolymer through ligand displacement in which a carboxyl anion of the copolymer is replaced with a chlorine ion of the cisplatin. This complex can give a medicine reduced in toxicity and usable by a new method of administration.

Abstract: The invention relates to a polymeric micellar structure comprising an ionic porphyrin dendrimer represented by general formula [1]

Abstract: A base frame, a laser device mounting frame, and a lead frame are formed by stamping and bending one metal plate. A reference plane is constituted by reference plane portions of the flat base frame, and metal plates for heat dissipation and reinforcement are further attached to the reference plane to provide high strength and heat dissipation though the present apparatus is a flame type laser apparatus. Also, a laser device is mounted on the laser device mounting frame, and the surrounding thereof except the light emitting side is molded with a mold resin. This eliminates the need for a cap for protecting the laser device and a wire, and enables collective production. More specifically, collective mass production is enabled by forming a frame by stamping out from one metal plate and molding the frame with resin without use of a cap.

Abstract: A semiconductor laser device according to the present invention includes a first lead portion having a mounting portion on which a semiconductor laser chip is mounted, a second lead portion for an electrode, and a resin portion for fixing the first and second lead portions. The second lead portion is provided with an engagement portion engaging with the resin portion in the longitudinal direction of the second lead portion, and extends straight within the resin portion.