Abstract: In a liquid cooling system having a structure in which a joint is attached or detached while inserting or removing a card board, when a liquid is leaked from a connection portion of the joint, the leaked liquid confined within a housing is prevented from spilling out and scattering to surrounding electronic components when the card board is disconnected. The liquid cooling system includes male and female joints, and housings that fix those joints to each other. A water absorptive material is disposed on an inner wall of the housing of the male joint, and a seal member is disposed on an inner wall of the housing of the female joint. The liquid cooling system includes a liquid leakage detection function. When the liquid cooling system detects the liquid leakage, the liquid cooling system stops the operation of a pump, and prevents the liquid from being further leaked.

Abstract: Plural flaps provided in a wind-pressure shutter are located approximately parallel to a direction of an airflow path, i.e., the airflow path is opened. Thus, the wind-pressure loss of cooling wind passing through the shutter can be reduced to near zero during the normal operation of the fan. If an air-backflow flows from the exhaust vent due to a fan failure, the flap slightly inclined toward the airflow path receives wind pressure of the air-backflow on its surface, thereby swings about the support shaft to close the airflow path.

Abstract: In an environment in which influence of heat energy from the outside is received, for example, when a large temperature difference occurs in an electronic equipment by external factors such as solar insolation or when a temperature difference occurs in the electronic equipment by heat of another device installed in the neighborhood, it is difficult to stabilize the temperature of the equipment within an allowable temperature range due to the influence of the external environment. An electronic equipment has a structure in which an electronic component contained in a housing is thermally connected to a housing inner wall through plural heat conduction members and a heat conduction control member, and the amount of heat transported from the electronic component to the housing inner wall is controlled by using the heat conduction control member.