LIQUID LEAKAGE PREVENTION DEVICE, LIQUID LEAKAGE PREVENTION METHOD, AND LIQUID COOLING SYSTEM
In a liquid cooling system having a structure in which a joint is attached or detached while inserting or removing a card board, when a liquid is leaked from a connection portion of the joint, the leaked liquid confined within a housing is prevented from spilling out and scattering to surrounding electronic components when the card board is disconnected. The liquid cooling system includes male and female joints, and housings that fix those joints to each other. A water absorptive material is disposed on an inner wall of the housing of the male joint, and a seal member is disposed on an inner wall of the housing of the female joint. The liquid cooling system includes a liquid leakage detection function. When the liquid cooling system detects the liquid leakage, the liquid cooling system stops the operation of a pump, and prevents the liquid from being further leaked.
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The present application claims priority from Japanese patent application JP 2012-095291 filed on Apr. 19, 2012, the content of which is hereby incorporated by reference into this application.
BACKGROUND OF THE INVENTION1. Technical Field
The present invention relates to a liquid leakage prevention device, a liquid leakage prevention method, and a liquid cooling system, and more particularly to a liquid leakage prevention device, a liquid leakage prevention method, and a liquid cooling system for use in an electronic device, having a liquid leakage prevention structure of a pipe joint, and a liquid leakage prevention structure of the pipe joint.
2. Background Art
A semiconductor component used for the electronic device produces heat during operation. There is a need to cool the semiconductor component because the semiconductor component loses a function of semiconductor when the semiconductor component exceeds a given temperature. As a method of cooling the semiconductor component, an air cooling method is frequently applied. However, in recent years, higher integration of the semiconductor component is advanced, and a liquid cooling method high in cooling efficiency is being spread with an increase in the heat generation density.
A basic configuration of the liquid cooling system will be described with reference to
Incidentally, in a computer device field, there is used an electronic device that realizes a plurality of functions by inserting plural types of cardboards into one housing. An example using the liquid cooling method in the electronic device of this type is disclosed in JP-A-2009-15869.
Hereinafter, a configuration example of JP-A-2009-15869 will be described with reference to
Because the joints used in JP-A-2009-15869 require a liquid leakage prevention property at the time of attachment or detachment, the joints are structured as follows. The valves are provided for both of a male side and a female side inside of the joint, and when the joints are not connected, the valves are closed. On the other hand, when those valves are connected, both of the valves are opened to circulate the refrigerant liquid.
However, in the related art joint as disclosed in JP-A-2009-15869, for example, when the cardboard is attached or detached at the time of operating the system, it is assumed that the internal refrigerant liquid cannot be surely prevented from being leaked to the external by the attachment or detachment work. Also, there is a possibility that a liquid is leaked from a connection portion of the joint, and affects the reliability of an electronic device, for example, when a foreign matter such as dust is caught by the joint at the time of attaching or detaching the joint, or when a rubber ring for tightly sealing a liquid is damaged or deteriorated.
Under the circumstances, solutions to the above problems will be described below.
Even with the liquid leakage structure of the joint in
Joints 1 and 2 are of a structure in which the liquid is shut within housings 3 and 4 if the liquid is leaked. For that reason, when the male joint 1 is removed from this state, as illustrated in
The invention has been made in view of the above circumstances, and an object of the invention is to provide a structure in which safe insertion and removal of cardboards are enabled without leaking the liquid to the external even if a liquid is leaked from a connection portion of joints, in a liquid cooling system having a structure in which joints for refrigerant liquid are attached or detached while the card boards are inserted or removed.
The joint according to the invention includes, for example, a male joint and a female joint, and housings for fixing those joints together. When the joints are not connected to each other, the male joint and the female joint close flow channels. On the other hand, when those joints are connected to each other, the flow channels of those joints are opened so that the refrigerant liquid can flow thereinto. Also, the housings can be shaped so that a seam portion is sealed by the housings when the joints are fitted to each other. Further, a water absorptive polymer is disposed on a housing inner wall of the male joint, and a seal member is disposed on a housing inner wall of the female joint.
Also, the liquid cooling system may have a function of detecting the liquid leakage. Further, when the liquid leakage is detected, the operation of a pump stops so that the liquid can be prevented from being further leaked.
According to the first solving means of the present invention, there is provided a liquid leakage prevention device in a liquid cooling system, comprising:
a first joint of a liquid connector which connects a pipe for allowing a refrigerant liquid to flow to a heat receiving jacket for cooling an electronic component mounted on a board;
a second joint of the liquid connector which is fitted to the first joint;
a first housing that fixes the first joint to an interior thereof;
a second housing that is fitted to the first housing from an exterior, and fixes the second joint to an interior thereof;
a seal member that is disposed on an inner wall of the second housing, and confines the refrigerant liquid leaked from a connection portion of the first joint and the second joint within a space formed when the first housing and the second housing are fitted to each other; and
a water absorptive material that is disposed on an inner wall of the first housing, and absorbs the refrigerant liquid confined within the space.
According to the second solving means of the present invention, there is provided a liquid leakage prevention method in a liquid cooling system, comprising:
connecting a pipe for allowing a refrigerant liquid to flow to a heat receiving jacket for cooling an electronic component mounted on a board by a first joint of a liquid connector;
fitting a second joint of the liquid connector to the first joint;
internally fixing the first joint by a first housing;
fitting a second housing to the first housing from an exterior, and fixing the second joint to an interior thereof;
confining, by a sealing member disposed on an inner wall of the second housing, the refrigerant liquid leaked from a connection portion of the first joint and the second joint within a space formed when the first housing and the second housing are fitted to each other; and
absorbing the refrigerant liquid confined within the space by a water absorptive material that is disposed on an inner wall of the first housing.
According to the third solving means of the present invention, there is provided a liquid cooling system, comprising:
a board on which an electronic component is mounted, which is inserted into a backplane or removed from the backplane;
a heat receiving jacket that covers the electronic component, and internally circulates a refrigerant liquid to cool the electronic component at the time of inserting the board into the backplane;
a pump that circulates the refrigerant liquid;
a reserve tank that reserves the refrigerant liquid;
a heat radiation unit that cools the refrigerant liquid; and
a liquid leakage prevention device of a refrigerant liquid,
wherein
the liquid leakage prevention device, comprising:
a first joint of a liquid connector which connects a pipe for allowing a refrigerant liquid to flow to a heat receiving jacket for cooling an electronic component mounted on a board;
a second joint of the liquid connector which is fitted to the first joint;
a first housing that fixes the first joint to an interior thereof;
a second housing that is fitted to the first housing from an exterior, and fixes the second joint to an interior thereof;
a seal member that is disposed on an inner wall of the second housing, and confines the refrigerant liquid leaked from a connection portion of the first joint and the second joint within a space formed when the first housing and the second housing are fitted to each other; and
a water absorptive material that is disposed on an inner wall of the first housing, and absorbs the refrigerant liquid confined within the space,
wherein
the board is connected to the backplane by an electric connector, and the heat receiving jacket on the substrate is connected to the backplane by the liquid connector having the first and second joints, and
the pump circulates the refrigerant liquid in a path including the reserve tank, the liquid connector having the first and second joints, the heat receiving jacket, and the heat radiation unit, to cool the refrigerant liquid.
According to the fourth solving means of the present invention, there is provided a liquid cooling system, comprising:
a board on which an electronic component is mounted, which is inserted into a backplane or removed from the backplane;
a heat receiving jacket that covers the electronic component, and internally circulates a refrigerant liquid to cool the electronic component at the time of inserting the board into the backplane;
a pump that circulates the refrigerant liquid;
a reserve tank that reserves the refrigerant liquid;
a heat radiation unit that cools the refrigerant liquid; and
a liquid leakage prevention device of a refrigerant liquid,
first and second flow rate sensors that are disposed on an inflow side and an outflow side of the reserve tank;
a detection unit that detects the liquid leakage by monitoring a difference between the first and second flow rate sensors,
wherein
the liquid leakage prevention device comprising:
a first joint of a liquid connector which connects a pipe for allowing a refrigerant liquid to flow to a heat receiving jacket for cooling an electronic component mounted on a board;
a second joint of the liquid connector which is fitted to the first joint; a first housing that fixes the first joint to an interior thereof;
a second housing that is fitted to the first housing from an exterior, and fixes the second joint to an interior thereof;
a seal member that is disposed on an inner wall of the second housing, and confines the refrigerant liquid leaked from a connection portion of the first joint and the second joint within a space formed when the first housing and the second housing are fitted to each other; and
a water absorptive material that is disposed on an inner wall of the first housing, and absorbs the refrigerant liquid confined within the space,
wherein
the board is connected to the backplane by an electric connector, and the heat receiving jacket on the substrate is connected to the backplane by the liquid connector having the first and second joints, and
the pump circulates the refrigerant liquid in a path including the reserve tank, the liquid connector having the first and second joints, the heat receiving jacket, and the heat radiation unit, to cool the refrigerant liquid.
According to the present invention, it is possible to provide a structure in which safe insertion and removal of card boards are enabled without leaking the liquid to the external even if a liquid is leaked from a connection portion of joints, in a liquid cooling system having a structure in which joints for refrigerant liquid are attached or detached while the card boards are inserted or removed.
Hereinafter, embodiments of the invention will be described with reference to the accompanying drawings.
A. Liquid Leakage Prevention Device (Joint Structure) First EmbodimentAlso, as a method of fixing the water absorptive material 5 (water absorptive polymer, etc.), the water absorptive material 5 may be attached to an inner wall of the housing 3 of the male joint 1 by using an adhesive so that the water absorptive material 5 does not easily drop off due to attachment or detachment of the joint.
As a method of fixing the water absorptive material 5 (water absorptive polymer, etc.) to the housing, as illustrated in
Subsequently, the state in which the male joint 1 and the female joint 2 are fitted to each other will be described with reference to
When the male joint 1 and the female joint 2 are fitted to each other, the seal member 6 attached to the inner wall of the housing 4 of the female joint 2 is pressed by the housing 3 of the male joint 1, to thereby ensure a sealing property of the space within the housing 4. Also, in this situation, the lock mechanism (not shown) of the housing 4 operates to hold the fitting state, as a result of which even if the liquid is leaked from the seam, the liquid can be prevented from being leaked to the external of the housing 4.
Hereinafter, a description will be given of the behavior when the liquid is leaked from the connection portion at the time of fitting the joints together in the configuration of the first embodiment.
As illustrated in
The male joint 1 of the card boards 9 side and the female joint 2 on the backplane 8 side may be arranged reversely. Also, the housing 3 on the card boards 9 side and the housing 4 on the backplane 8 side may be arranged reversely.
B. Liquid Leakage DetectionHereinafter, a description will be given of the liquid cooling system for detecting the liquid leakage and the liquid leakage prevention device (joint device) used in the liquid cooling system.
(1) Liquid Cooling SystemIn this embodiment, if the liquid is leaked from the connection portion at the time of fitting the joints together, the leaked water is confined in the sealed space within the housings 3 and 4. In this situation, as described with reference to
Incidentally, as another means for detecting the liquid leakage, there is proposed a method stated below.
Referring to
Also, as in this modified example, in the second embodiment, a switch 131 such as a button switch may be installed instead of the pressure sensor 111 so that the water swellable water stop material is swelled to push the switch 131, and the liquid leakage is detected by the liquid leakage detector circuit 113.
Further, referring to
The male joint 1 on the card boards 9 side and the female joint 2 on the backplane 8 side may be arranged reversely. Also, the housing 3 on the card boards 9 side and the housing 4 on the backplane 8 side may be arranged reversely. In this case, the liquid leakage detector circuit 113 can be located on the backplane 8 side.
Third EmbodimentFurther, as another means for detecting the liquid leakage, a liquid leakage sensor 141 shown in the figure may be used. Referring to
The liquid leakage sensor 141 of this type is installed within each of the housings 3 and 4, and connected to a liquid leakage detector circuit 142 mounted on the card board 9 by a cable, thereby being capable of quickly detecting the liquid leakage.
Also, as in the second embodiment, the liquid leakage detector circuit 142 is set to stop the operation of the pump 101 at the time of detecting the liquid leakage, thereby being capable of preventing the liquid from being further leaked from the joint connection portion.
The male joint 1 on the card boards 9 side and the female joint 2 on the backplane 8 side may be arranged reversely. Also, the housing 3 on the card boards 9 side and the housing 4 on the backplane 8 side may be arranged reversely. In this case, the liquid leakage detector circuit 142 can be provided on the backplane 8 side.
Claims
1. A liquid leakage prevention device in a liquid cooling system, comprising:
- a first joint of a liquid connector which connects a pipe for allowing a refrigerant liquid to flow to a heat receiving jacket for cooling an electronic component mounted on a board;
- a second joint of the liquid connector which is fitted to the first joint;
- a first housing that fixes the first joint to an interior thereof;
- a second housing that is fitted to the first housing from an exterior, and fixes the second joint to an interior thereof;
- a seal member that is disposed on an inner wall of the second housing, and confines the refrigerant liquid leaked from a connection portion of the first joint and the second joint within a space formed when the first housing and the second housing are fitted to each other; and
- a water absorptive material that is disposed on an inner wall of the first housing, and absorbs the refrigerant liquid confined within the space.
2. The liquid leakage prevention device according to claim 1,
- wherein a position at which the water absorptive material is located includes any one of all surfaces, a surface on which the refrigerant liquid is liable to be reserved, a lower surface, and lateral surfaces in the inner wall of the first housing.
3. The liquid leakage prevention device according to claim 1,
- wherein a protrusion is provided on the water absorptive material, and a groove that fixes the protrusion to the inner wall of the first housing is provided.
4. A liquid cooling system, comprising:
- a board on which an electronic component is mounted, which is inserted into a backplane or removed from the backplane;
- a heat receiving jacket that covers the electronic component, and internally circulates a refrigerant liquid to cool the electronic component at the time of inserting the board into the backplane;
- a pump that circulates the refrigerant liquid;
- a reserve tank that reserves the refrigerant liquid;
- a heat radiation unit that cools the refrigerant liquid; and
- a liquid leakage prevention device of a refrigerant liquid,
- wherein
- the liquid leakage prevention device, comprising:
- a first joint of a liquid connector which connects a pipe for allowing a refrigerant liquid to flow to a heat receiving jacket for cooling an electronic component mounted on a board;
- a second joint of the liquid connector which is fitted to the first joint;
- a first housing that fixes the first joint to an interior thereof;
- a second housing that is fitted to the first housing from an exterior, and fixes the second joint to an interior thereof;
- a seal member that is disposed on an inner wall of the second housing, and confines the refrigerant liquid leaked from a connection portion of the first joint and the second joint within a space formed when the first housing and the second housing are fitted to each other; and
- a water absorptive material that is disposed on an inner wall of the first housing, and absorbs the refrigerant liquid confined within the space,
- wherein
- the board is connected to the backplane by an electric connector, and the heat receiving jacket on the substrate is connected to the backplane by the liquid connector having the first and second joints, and
- the pump circulates the refrigerant liquid in a path including the reserve tank, the liquid connector having the first and second joints, the heat receiving jacket, and the heat radiation unit, to cool the refrigerant liquid.
5. The liquid cooling system according to claim 4,
- wherein the water absorptive material is a water swellable water stop material,
- the liquid cooling system further comprises:
- a pressure sensor that is disposed on the inner wall of the first housing; and
- a detection unit that detects the liquid leakage by the water absorptive material and the pressure sensor.
6. The liquid cooling system according to claim 4,
- wherein the water absorptive material is a water swellable water stop material,
- the liquid cooling system further comprises:
- a switch that is disposed on the inner wall of the first housing; and
- a detection unit that detects the liquid leakage by the water absorptive material and the switch.
7. The liquid cooling system according to claim 4, further comprising:
- a water leakage sensor that is disposed on the inner wall of the first housing; and
- a detection unit that detects the liquid leakage by the water leakage sensor.
8. The liquid cooling system according to claim 4, further comprising:
- a first flow rate sensor that is disposed on an inflow side of the reserve tank;
- a second flow rate sensor that is disposed on an outflow side of the reserve tank; and
- a detection unit that detects the liquid leakage by monitoring a difference between the first flow rate sensor and the second flow rate sensor.
9. The liquid cooling system according to claim 5,
- wherein the detection unit stops the operation of the pump when detecting the liquid leakage.
Type: Application
Filed: Feb 27, 2013
Publication Date: Oct 24, 2013
Applicant: HITACHI, LTD. (Tokyo)
Inventors: Mitsuo ISHIKURA (Tokyo), Nobuhiro TAMAYAMA (Tokyo)
Application Number: 13/778,694
International Classification: F28F 11/00 (20060101);