Abstract: A distance measurement accuracy is improved. A solid-state imaging device according to an embodiment includes a pixel array part in which a plurality of pixels is arranged in a matrix, in which each of the pixels includes a plurality of photoelectric conversion units that each photoelectrically converts incident light to generate a charge, a floating diffusion region that accumulates the charge, a plurality of transfer circuits that transfer the charge generated in each of the plurality of photoelectric conversion units to the floating diffusion region, and a first transistor that causes a pixel signal of a voltage value corresponding to a charge amount of the charge accumulated in the floating diffusion region to appear in a signal line.

Abstract: A return spring (21) made of a metal plate, for biasing a friction pad (6) in a return direction of separating away from a disc (1) is arranged between the friction pad (6) and a mounting member (2). The return spring (21) includes a fixed portion (22), which is on a base end side fixed to an ear portion (7B) of a back plate (7) of the friction pad (6). Then, an abutment portion (25), which is on a distal end side of the return spring (21), is elastically brought into abutment on an abutment plate portion (13D) of a pad spring (13), which is on the mounting member (2) side at a position on an outer side in a disc radial direction relative to the fixed portion (22).

Abstract: A return spring is provided between a friction pad and a mount member. The return spring biases the friction pad in a return direction for separating the friction pad from the disk, and is made of a metallic plate. The return spring includes a fixation portion on a proximal end side thereof, and the fixation portion is fixed to an ear portion of a back plate of the friction pad. The return spring includes an abutment portion, and the abutment portion is in elastic abutment with an abutment plate portion of a pad spring, which corresponds to a mount member side, on an outer side in a disk radial direction relative to the fixation portion. The pad spring includes a guide portion extending in a disk axial direction and supporting a side surface of an intermediate portion of the return spring.

Abstract: A return spring (21) made of a metal plate, for biasing a friction pad (6) in a return direction of separating away from a disc (1) is arranged between the friction pad (6) and a mounting member (2). The return spring (21) includes a fixed portion (22), which is on a base end side fixed to an ear portion (7B) of a back plate (7) of the friction pad (6). Then, an abutment portion (25), which is on a distal end side of the return spring (21), is elastically brought into abutment on an abutment plate portion (13D) of a pad spring (13), which is on the mounting member (2) side at a position on an outer side in a disc radial direction relative to the fixed portion (22).

Abstract: A shim plate relatively movably attached with a friction pad in a rotational direction of a disc is disposed between the friction pad and a reaction section of a caliper, a plurality of claw sections formed to extend in a radial direction of the disc at a position deviated in the rotational direction of the disc with respect to a center of pistons are formed at the reaction section, and movement restriction portions that can abut the intermediate claw section disposed at the middle of the claw sections of the reaction section are formed at a surface of the shim plate opposite to the reaction section in the radial direction of the disc.

Abstract: A return spring is provided between a friction pad and a mount member. The return spring biases the friction pad in a return direction for separating the friction pad from the disk, and is made of a metallic plate. The return spring includes a fixation portion on a proximal end side thereof, and the fixation portion is fixed to an ear portion of a back plate of the friction pad. The return spring includes an abutment portion, and the abutment portion is in elastic abutment with an abutment plate portion of a pad spring, which corresponds to a mount member side, on an outer side in a disk radial direction relative to the fixation portion. The pad spring includes a guide portion extending in a disk axial direction and supporting a side surface of an intermediate portion of the return spring.

Abstract: A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components for a power module, such as a casing, can be attached onto the component attachment plate.

Abstract: A power module includes a power device and a heat sink. The heat sink includes a refrigerant passage in which a cooling medium flows and a corrugated fin body arranged in the refrigerant passage. The refrigerant passage is defined by a surface and a backside, and the power device is disposed in proximity to the surface. The corrugated fin body has crests and troughs that extend in the flow direction of the cooling medium and side walls each of which connects the corresponding one of the crests with the adjacent one of the troughs. Each adjacent pair of the side walls and the corresponding one of the crests or the corresponding one of the troughs arranged between the adjacent side walls form a fin. A guide that extends in the flow direction of the cooling medium and operates to stir the cooling medium is arranged in each of the fins.

Abstract: A shim plate is provided at the rear side of a friction pad to abut annular contact parts of pistons. The shim plate is provided with first and second one-side cut portions and at a position corresponding to the annular contact part of a disk rotational entrance-side piston, for example, so that the area of contact between the shim plate and the annular contact part is larger at the disk rotational exit side than at the disk rotational entrance side. The first and second one-side cut portions and have four contact ends at which the peripheries of the cut portions and the annular contact part intersect each other. At least two of the four contact ends are provided on the disk rotational entrance side with respect to the diametrical center of the piston.

Abstract: A shim plate relatively movably attached with a friction pad in a rotational direction of a disc is disposed between the friction pad and a reaction section of a caliper, a plurality of claw sections formed to extend in a radial direction of the disc at a position deviated in the rotational direction of the disc with respect to a center of pistons are formed at the reaction section, and movement restriction portions that can abut the intermediate claw section disposed at the middle of the claw sections of the reaction section are formed at a surface of the shim plate opposite to the reaction section in the radial direction of the disc.

Abstract: Provided is a disc brake capable of preventing large positional shift of a position of abutment of a return spring against a mounting member, which occurs with wear of a friction pad and the like. The return spring for biasing the friction pad in a direction away from a disc includes a fixed portion on one side, which is fixedly mounted to the friction pad, an extending portion extending from the fixed portion in an axial direction of the disc and in a direction away from the friction pad, a turned-back portion formed by turning back a distal end side of the extending portion toward the mounting member, and an abutting portion provided on a distal end side of the turned-back portion so as to be elastically brought into abutment against a side of the mounting member.

Abstract: A heat sink (1) for power module is capable of mounting a power device (101) on at least a surface of the heat sink. The heat sink includes a refrigerant passage (1d) in which cooling medium that dissipates heat generated by the power device (101) flows and a corrugated fin body (1a) arranged in the refrigerant passage (1d). The corrugated fin body (1a) has crests (21b) and troughs (21c) that extend in the flow direction of the cooling medium, and side walls (21a) each of which connects the corresponding one of the crests (21b) with the adjacent one of the troughs (21c). Each adjacent pair of the side walls (21a) and the corresponding one of the crests (21b) or the corresponding one of the troughs (21c) arranged between the adjacent side walls (21a) form a fin (21). Each of the side walls (21a) has a louver (31) that operates to, at least, rotate the cooling medium flowing in the associated fin (21). The heat sink (1) thus has a further improved heat dissipating performance.

Abstract: A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided. The heat sink 1 for a power module has a laminating body 20, a first side plate 30 and a second side plate 40. The laminating body 20 has plural flow path plates 21 formed in a plate shape in which plural grooves 23 parallel to each other are concavely arranged on a flat joining face 22. Each groove 23 is set to a parallel flow path 50 parallel to a front face side by laminating each flow path plate 21 by each joining face 22. A portion other than each groove 23 of each joining face 22 forms a heat transfer path 70a to each parallel flow path 50 of a laminating direction. A flow-in path 30a and a flow-out path 40a are formed in the first and second side plates 30, 40. The flow-in path 30a and the flow-out path 40a are joined to side faces 26a, 26b of the laminating body 20, and are communicated with each parallel flow path 50.

Abstract: A shim plate is provided at the rear side of a friction pad to abut annular contact parts of pistons. The shim plate is provided with first and second one-side cut portions and at a position corresponding to the annular contact part of a disk rotational entrance-side piston, for example, so that the area of contact between the shim plate and the annular contact part is larger at the disk rotational exit side than at the disk rotational entrance side. The first and second one-side cut portions and have four contact ends at which the peripheries of the cut portions and the annular contact part intersect each other. At least two of the four contact ends are provided on the disk rotational entrance side with respect to the diametrical center of the piston.

Abstract: Provided is a disc brake capable of preventing large positional shift of a position of abutment of a return spring against a mounting member, which occurs with wear of a friction pad and the like. The return spring for biasing the friction pad in a direction away from a disc includes a fixed portion on one side, which is fixedly mounted to the friction pad, an extending portion extending from the fixed portion in an axial direction of the disc and in a direction away from the friction pad, a turned-back portion formed by turning back a distal end side of the extending portion toward the mounting member, and an abutting portion provided on a distal end side of the turned-back portion so as to be elastically brought into abutment against a side of the mounting member.

Abstract: A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on the second side of the insulating substrate 3 opposite the heat-generating-element-mounting side. A stress relaxation member 4 formed of a high-thermal-conduction material intervenes between the metal layer 7 of the insulating substrate 3 and the heat sink 5 and includes a plate-like body 10 and a plurality of projections 11 formed at intervals on one side of the plate-like body 10. The end faces of the projections 11 of the stress relaxation member 4 are brazed to the metal layer 7, whereas the side of the plate-like body 10 on which the projections 11 are not formed is brazed to the heat sink 5. This heat radiator 1 is low in material cost and exhibits excellent heat radiation performance.

Abstract: A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components for a power module, such as a casing, can be attached onto the component attachment plate.

Abstract: A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components required for a power module, such as a casing, can be attached onto the component attachment plate.

Abstract: A semiconductor module 10 includes a ceramic substrate having a front surface on which a semiconductor element 12 is mounted and a rear surface on the opposite side of the front surface, a front metal plate 15 joined to the front surface, a rear metal plate 16 joined to the rear surface, and a heat sink 13 joined to the rear metal plate 16. The rear metal plate 16 includes a joint surface 16b that faces the heat sink 13. The joint surface 16b includes a joint area and a non-joint area. The non-joint area includes recesses 18 which extend in the thickness direction of the rear metal plate 16. The joint area of the rear metal plate 16 is in a range from 65% to 85% of the total area of the joint surface 16b on the rear metal plate 16. As a result, excellent heat dissipating performance can be achieved while occurrence of distortion and cracking due to thermal stress is prevented.

Abstract: A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components required for a power module, such as a casing, can be attached onto the component attachment plate.