Abstract: A heat sink (1) for power module is capable of mounting a power device (101) on at least a surface of the heat sink. The heat sink includes a refrigerant passage (1d) in which cooling medium that dissipates heat generated by the power device (101) flows and a corrugated fin body (1a) arranged in the refrigerant passage (1d). The corrugated fin body (1a) has crests (21b) and troughs (21c) that extend in the flow direction of the cooling medium, and side walls (21a) each of which connects the corresponding one of the crests (21b) with the adjacent one of the troughs (21c). Each adjacent pair of the side walls (21a) and the corresponding one of the crests (21b) or the corresponding one of the troughs (21c) arranged between the adjacent side walls (21a) form a fin (21). Each of the side walls (21a) has a louver (31) that operates to, at least, rotate the cooling medium flowing in the associated fin (21). The heat sink (1) thus has a further improved heat dissipating performance.

Abstract: A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on the second side of the insulating substrate 3 opposite the heat-generating-element-mounting side. A stress relaxation member 4 formed of a high-thermal-conduction material intervenes between the metal layer 7 of the insulating substrate 3 and the heat sink 5 and includes a plate-like body 10 and a plurality of projections 11 formed at intervals on one side of the plate-like body 10. The end faces of the projections 11 of the stress relaxation member 4 are brazed to the metal layer 7, whereas the side of the plate-like body 10 on which the projections 11 are not formed is brazed to the heat sink 5. This heat radiator 1 is low in material cost and exhibits excellent heat radiation performance.

Abstract: A semiconductor module 10 includes a ceramic substrate having a front surface on which a semiconductor element 12 is mounted and a rear surface on the opposite side of the front surface, a front metal plate 15 joined to the front surface, a rear metal plate 16 joined to the rear surface, and a heat sink 13 joined to the rear metal plate 16. The rear metal plate 16 includes a joint surface 16b that faces the heat sink 13. The joint surface 16b includes a joint area and a non-joint area. The non-joint area includes recesses 18 which extend in the thickness direction of the rear metal plate 16. The joint area of the rear metal plate 16 is in a range from 65% to 85% of the total area of the joint surface 16b on the rear metal plate 16. As a result, excellent heat dissipating performance can be achieved while occurrence of distortion and cracking due to thermal stress is prevented.

Abstract: A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on a side of the insulating substrate 3 opposite the heat-generating-element-mounting side. A stress relaxation member 4 intervenes between the metal layer 7 of the insulating substrate 3 and the heat sink 5. The stress relaxation member 4 is formed of an aluminum plate 10 having a plurality of through holes 9 formed therein, and the through holes 9 serve as stress-absorbing spaces. The stress relaxation member 4 is brazed to the metal layer 7 of the insulating substrate 3 and to the heat sink 5. This heat radiator 1 is low in material cost and exhibits excellent heat radiation performance.

Abstract: A liquid-cooling type cooling plate including at least one flat multi-bored tube, a substrate, and a cover plate. The substrate includes, at its upper surface, two header forming dented portions arranged apart from each other and a tube accommodating dented portion for accommodating the tube, the tube accommodating dented portion being formed between the header forming dented portions. An upper surface of the cover plate and/or a lower surface of the substrate is configured to be attached by a member to be cooled. The tube is accommodated in the tube accommodating dented portion and is disposed between the substrate and the cover plate. An opening of each header forming dented portion is closed by the cover plate, whereby two header portions are formed. The substrate, the tube, and the cover plate are integrally jointed.

Abstract: A waste heat recover system includes a mechanism for supplying power by use of a thermoelectric conversion unit, and a mechanism for utilizing heat released from the thermoelectric conversion unit. Heat released from the thermoelectric conversion unit is utilized for, for example, heating, defrosting, defogging, temperature keeping of fuel, temperature keeping of an internal combustion engine, and temperature keeping of a fuel cell. The waste heat recovery system is equipped in, for example, cars, incinerators, fuel cells, and industrial machinery.

Abstract: The heat exchanger according to the present invention includes a heat exchanger component in which a fluoride layer 10 is formed at the surface layer portion. It is preferable that the fluoride layer 10 falls within the range of from 2 nm to 10 &mgr;m in thickness. It is preferable that the component is at least one of a fin and a plate. Furthermore, it is preferable that the fluoride layer 10 is formed on a substrate via an intermediate layer 2. It is preferable that the intermediate layer 2 includes an anodized oxide layer 3 and/or a nickel plated layer 4. The heat exchanger is excellent in corrosion resistance against water, vapor and the like The heat exchanger is preferably used, especially, for a fuel cell.