Patents by Inventor Nobuki Sunagare
Nobuki Sunagare has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8480804Abstract: A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.Type: GrantFiled: April 15, 2010Date of Patent: July 9, 2013Assignee: Panasonic CorporationInventors: Kazuyoshi Honda, Masaru Odagiri, Kiyoshi Takahashi, Noriyasu Echigo, Nobuki Sunagare
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Publication number: 20100192858Abstract: A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.Type: ApplicationFiled: April 15, 2010Publication date: August 5, 2010Inventors: Kazuyoshi HONDA, Masaru Odagiri, Kiyoshi Takahashi, Noriyasu Echigo, Nobuki Sunagare
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Patent number: 7006344Abstract: The present invention provides a bis(4-mercaptophenyl) sulfide derivative represented by general formula 1. This derivative is a monomer that can form a dielectric film suitable for an electronic component. The present invention further provides a method for producing this derivative and an electronic component having high characteristics under excellent humidity and high temperature.Type: GrantFiled: July 23, 2001Date of Patent: February 28, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Noriyasu Echigo, Kazuyoshi Honda, Yoshiaki Kai, Masaru Odagiri, Hisaaki Tachihara, Hideki Matsuda, Jun Katsube, Kazuo Iwaoka, Takanori Sugimoto, Nobuki Sunagare
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Patent number: 6942903Abstract: A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.Type: GrantFiled: March 4, 2003Date of Patent: September 13, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Masaru Odagiri, Kiyoshi Takahashi, Noriyasu Echigo, Nobuki Sunagare
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Patent number: 6879481Abstract: A layered product comprising a plurality of deposition units, each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 ?m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 ?m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.Type: GrantFiled: April 5, 2002Date of Patent: April 12, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare, Shinichi Suzawa
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Patent number: 6838153Abstract: A method for producing a laminate having resin layers and thin metal layers by repeating a process unit comprising a step of laminating a resin layer by applying a resin material, a step of depositing a patterning material on the resin layer and a step of laminating a thin metal layer, predetermined times on a turning support (511), wherein the patterning material is stuck on the surface of the resin layer in a noncontact way. A laminate comprising a large number of laminate units each comprising a resin layer and a thin metal layer divided at an electric insulation stripe part can be produced stably. The laminate is applicable to production of a high performance small capacitor at low cost.Type: GrantFiled: December 6, 2002Date of Patent: January 4, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare, Shinichi Suzawa
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Patent number: 6829135Abstract: Resin thin films (12) and metal thin films (11a, 11b) are layered in alternation. The metal thin films are set back from the peripheral edges of the resin thin films (12). Via holes (13a, 13b) penetrating the layered product in the layering direction are formed and filled with conductive material (14a, 14b). The conductive material (14a, 14b) electrically connects the metal thin films (11a, 11b) among one another. The metal thin films are not exposed at the periphery, so that corrosion of the metal thin films is not likely to occur. Furthermore, cutting of the metal thin films during the manufacturing process is avoided.Type: GrantFiled: November 27, 2001Date of Patent: December 7, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Yoshiaki Kai, Masaru Odagiri, Nobuki Sunagare
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Patent number: 6721165Abstract: A layered product comprising a plurality of deposition units, each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.Type: GrantFiled: April 5, 2002Date of Patent: April 13, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare, Shinichi Suzawa
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Patent number: 6714401Abstract: A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.Type: GrantFiled: March 4, 2003Date of Patent: March 30, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Masaru Odagiri, Kiyoshi Takahashi, Noriyasu Echigo, Nobuki Sunagare
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Patent number: 6710997Abstract: A layered product including a plurality of deposition units, each having a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.Type: GrantFiled: May 1, 2002Date of Patent: March 23, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare, Shinichi Suzawa
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Patent number: 6704190Abstract: A layered product comprising a plurality of deposition units, each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.Type: GrantFiled: April 5, 2002Date of Patent: March 9, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare, Shinichi Suzawa
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Publication number: 20030189808Abstract: The present invention provides a bis(4-mercaptophenyl) sulfide derivative represented by general formula 1. This derivative is a monomer that can form a dielectric film suitable for an electronic component. The present invention further provides a method for producing this derivative and an electronic component having high characteristics under excellent humidity and high temperature.Type: ApplicationFiled: April 11, 2003Publication date: October 9, 2003Inventors: Noriyasu Echigo, Kazuyoshi Honda, Yoshiaki Kai, Masaru Odagiri, Hisaaki Tachihara, Hideki Matsuda, Jun Katsube, Kazuo Iwaoka, Takanori Sugimoto, Nobuki Sunagare
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Patent number: 6611420Abstract: A layered product including a plurality of deposition units, each having a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.Type: GrantFiled: May 1, 2002Date of Patent: August 26, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare, Shinichi Suzawa
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Publication number: 20030157742Abstract: A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.Type: ApplicationFiled: March 4, 2003Publication date: August 21, 2003Inventors: Kazuyoshi Honda, Masaru Odagiri, Kiyoshi Takahashi, Noriyasu Echigo, Nobuki Sunagare
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Publication number: 20030148038Abstract: A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.Type: ApplicationFiled: March 4, 2003Publication date: August 7, 2003Inventors: Kazuyoshi Honda, Masaru Odagiri, Kiyoshi Takahashi, Noriyasu Echigo, Nobuki Sunagare
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Publication number: 20030145792Abstract: A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.Type: ApplicationFiled: March 4, 2003Publication date: August 7, 2003Inventors: Kazuyoshi Honda, Masaru Odagiri, Kiyoshi Takahashi, Noriyasu Echigo, Nobuki Sunagare
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Patent number: 6602559Abstract: A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.Type: GrantFiled: September 25, 2000Date of Patent: August 5, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Masaru Odagiri, Kiyoshi Takahashi, Noriyasu Echigo, Nobuki Sunagare
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Patent number: 6576523Abstract: A method for producing a laminate having resin layers and thin metal layers by repeating a process unit comprising a step of laminating a resin layer by applying a resin material, a step of depositing a patterning material on the resin layer and a step of laminating a thin metal layer, predetermined times on a turning support (511), wherein the patterning material is stuck on the surface of the resin layer in a noncontact way. A laminate comprising a large number of laminate units each comprising a resin layer and a thin metal layer divided at an electric insulation stripe part can be produced stably. The laminate is applicable to production of a high performance small capacitor at low cost.Type: GrantFiled: May 10, 2000Date of Patent: June 10, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare, Shinichi Suzawa
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Patent number: 6577493Abstract: A layered product including a plurality of deposition units, each having a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.Type: GrantFiled: May 1, 2002Date of Patent: June 10, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare, Shinichi Suzawa
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Publication number: 20030087037Abstract: A method for producing a laminate having resin layers and thin metal layers by repeating a process unit comprising a step of laminating a resin layer by applying a resin material, a step of depositing a patterning material on the resin layer and a step of laminating a thin metal layer, predetermined times on a turning support (511), wherein the patterning material is stuck on the surface of the resin layer in a noncontact way. A laminate comprising a large number of laminate units each comprising a resin layer and a thin metal layer divided at an electric insulation stripe part can be produced stably. The laminate is applicable to production of a high performance small capacitor at low cost.Type: ApplicationFiled: December 6, 2002Publication date: May 8, 2003Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare, Shinichi Suzawa