Abstract: A layered product comprising a plurality of deposition units, each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.

Abstract: A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.

Abstract: A method for manufacturing a resin thin film of the present invention includes supplying a liquid resin material and a gas to a two-fluid nozzle by pressure; ejecting the resin material in the form of atomized particles toward a heating member by the two-fluid nozzle, thereby adhering the resin material to the heating member; or mixing a liquid resin material with a gas; ejecting the resin material in form of atomized particles toward a heating member that is provided under reduced pressure, thereby adhering the resin material to the heating member; and evaporating the resin material on the heating member to obtain the evaporated resin material. Thus, the present invention can provide a resin thin film having a uniform thickness stably with simple means at a low cost. The resin thin film obtained by the present invention can be used in a wide range, for example a magnetic recording medium such as a magnetic tape, a wrapping material, and an electronic component.

Abstract: A layered product comprising a plurality of deposition units, each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.

Abstract: Resin thin films (12) and metal thin films (11a, 11b) are layered in alternation. The metal thin films are set back from the peripheral edges of the resin thin films (12). Via holes (13a, 13b) penetrating the layered product in the layering direction are formed and filled with conductive material (14a, 14b). The conductive material (14a, 14b) electrically connects the metal thin films (11a, 11b) among one another. The metal thin films are not exposed at the periphery, so that corrosion of the metal thin films is not likely to occur. Furthermore, cutting of the metal thin films during the manufacturing process is avoided.

Abstract: A layered product comprising a plurality of deposition units, each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.

Abstract: A layered product comprising a plurality of deposition units, each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.

Abstract: A layered product comprising a plurality of deposition units, each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.

Abstract: In a method for manufacturing electronic parts by laminating metal thin films and insulating thin films on a support, a mold releasing agent is applied to the support before the start of lamination. Alternatively, the mold releasing agent is applied to the surface of the laminate during the lamination step, and then lamination is resumed. Therefore, the laminate can be prevented from cracking when the laminate is separated from the support or divided into plural pieces in the lamination direction. Thus, the reliability and productivity of electronic parts improve.

Abstract: A layered product including a plurality of deposition units, each having a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.

Abstract: In a method for manufacturing electronic parts by laminating metal thin films and insulating thin films on a support, a mold releasing agent is applied to the support before the start of lamination. Alternatively, the mold releasing agent is applied to the surface of the laminate during the lamination step, and then lamination is resumed. Therefore, the laminate can be prevented from cracking when the laminate is separated from the support or divided into plural pieces in the lamination direction. Thus, the reliability and productivity of electronic parts improve.

Abstract: Before forming resin layers and metal thin film layers on a rotating supporting base, a belt-shaped object is run over the supporting base to remove foreign particles adhering to the supporting base. After a resin layer and a metal thin film layer are formed on the belt-shaped object and their formation conditions are optimized, the belt-shaped object is removed, and subsequently a layered product is formed on the supporting base. Thus, foreign objects adhering to the supporting base can be removed, and resin layers and metal thin film layers can be formed as desired.

Abstract: Before forming resin layers and metal thin film layers on a rotating supporting base, a belt-shaped object is run over the supporting base to remove foreign particles adhering to the supporting base. After a resin layer and a metal thin film layer are formed on the belt-shaped object and their formation conditions are optimized, the belt-shaped object is removed, and subsequently a layered product is formed on the supporting base. Thus, foreign objects adhering to the supporting base can be removed, and resin layers and metal thin film layers can be formed as desired.

Abstract: In a method wherein, before forming a thin film of, for example, metal on a supporting base in a vacuum, a vapor stream of patterning material for forming a pattern in the thin film is applied from nozzle holes, and the thin film is formed after this liquid has been adhered onto the supporting base, the patterning material is applied from the nozzle holes in such manner that it unifies on the supporting base. Thus, even when the pattern width is enlarged, a pattern can be formed in which the blurring at the pattern edges is small.

Abstract: An electronic component provided with a dielectric thin film (4), normal electrodes (1a, 1b) formed on the thin film (4), dummy electrodes (2a,2b) formed on the dielectric thin film (4) with an insulating region (20) therebetween, and auxiliary electrodes (3) provided on both side faces of the component, wherein the width of the insulating region (20) is not less than 500 times the thickness of the dielectric thin film (4) so as to improve the characteristics such as the equivalent series resistance. Thus, the deterioration of the frequency characteristics caused by the dummy electrodes can be remedied and the component can be used for a capacitor or the like.

Abstract: A method for manufacturing a capacitor includes the step of depositing metal thin film layers and resin layers alternating with each other, thereby forming a layered product. The thickness of the resin layer and the metal thin film or the width of margins are measured during the deposition. At a predetermined point in the process of the deposition, the number of layers to be deposited further is determined, based on the measured values and an intended electrostatic capacitance or deposition thickness. The thus obtained capacitor has the intended electrostatic capacitance or deposition thickness with a small dispersion.

Abstract: A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.