Patents by Inventor Nobumitsu AOKI
Nobumitsu AOKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240125561Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.Type: ApplicationFiled: December 21, 2023Publication date: April 18, 2024Applicant: FUJITSU LIMITEDInventors: Kento OHGA, Hideo KUBO, Kenji SASABE, Masahide KODAMA, Atsushi ENDO, Keita HIRAI, Nobumitsu AOKI, Takashi URAI
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Patent number: 11892246Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.Type: GrantFiled: January 4, 2022Date of Patent: February 6, 2024Assignee: FUJITSU LIMITEDInventors: Kento Ohga, Hideo Kubo, Kenji Sasabe, Masahide Kodama, Atsushi Endo, Keita Hirai, Nobumitsu Aoki, Takashi Urai
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Publication number: 20240032251Abstract: A cooling device includes a container in which refrigerant is sealed. The container includes; a heat reception plate that forms part of the container and that receives heat from a heat generating element; an evaporator that causes the refrigerant in a liquid phase to evaporate with heat reception in the container; a condenser that causes the refrigerant in a gas phase to condense with heat dissipation in the container; and a plurality of recessed portions formed in a surface of the heat reception plate inside the container.Type: ApplicationFiled: April 19, 2023Publication date: January 25, 2024Applicant: Fujitsu LimitedInventors: Hideo Kubo, Atsushi Endo, Masahide Kodama, Nobumitsu Aoki, Kenji Sasabe, Keita Hirai, Yuki Kanai, Toru Kobayashi, Hiroshi Satou, Takashi Urai, Hiromasa Miyata
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Publication number: 20230240046Abstract: A heat sink comprises a bottom plate and a plurality of fins. The bottom plate is formed in a T-shape of a head portion and a body portion and includes a coupling region in which the body portion is thermally coupled to a heat generation element; and the plurality of fins that are erected at the head portion and the body portion of the bottom plate and extend in a direction from the head portion toward the body portion. With the plurality of fins, a pressure loss of first air which flows through a center portion of the head portion is smaller than a pressure loss of second air which flows through a side portion of the head portion in a case where air flows between the plurality of fins along the direction.Type: ApplicationFiled: October 31, 2022Publication date: July 27, 2023Applicant: Fujitsu LimitedInventors: Kenji Sasabe, Hideo Kubo, Keita Hirai, Atsushi Endo, Masahide Kodama, Nobumitsu Aoki, Yuki Kanai, Takashi Urai
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Publication number: 20220346278Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporation circuit that evaporates the refrigerant in a liquid phase inside the container by heat reception; a condensation circuit that condenses the refrigerant in a gas phase inside the container by heat radiation; a transport circuit that transports the refrigerant in the liquid phase inside the container to the evaporation circuit by a capillary phenomenon; a heat radiation member that includes fins, and includes a narrow portion that has a width in a direction orthogonal to a flow direction of cooling air that is narrow on a downstream side in the flow direction, and a wide portion that has the width that is wide on an upstream side in the flow direction; and an air guide member that is provided on the downstream side of the wide portion and on the upstream side of the narrow portion.Type: ApplicationFiled: January 25, 2022Publication date: October 27, 2022Applicant: FUJITSU LIMITEDInventors: Masahide KODAMA, Hideo Kubo, KENJI SASABE, Nobumitsu Aoki, ATSUSHI ENDO, Keita Hirai
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Publication number: 20220322564Abstract: A cooling device includes: a downstream heat radiation member that includes a plurality of downstream fins; and an upstream heat radiation member that is arranged on an upstream side in a flow direction of cooling air with a gap from the downstream heat radiation member, includes a plurality of upstream fins, and is provided with a low pressure loss portion in which pressure loss is lower than pressure loss in another portion in one portion in a fin arrangement direction orthogonal to the flow direction.Type: ApplicationFiled: January 4, 2022Publication date: October 6, 2022Applicant: FUJITSU LIMITEDInventors: Hideo KUBO, Kenji SASABE, Shinnosuke FUJIWARA, Nobumitsu AOKI, Keita HIRAI, Atsushi ENDO, Masahide KODAMA, Kento OHGA
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Publication number: 20220307772Abstract: A cooling device including: a container in which a refrigerant is sealed; a plurality of evaporation structures that evaporate the refrigerant in a liquid phase inside the container by heat reception; a plurality of condensation structures each of which is provided in corresponding one of the plurality of evaporation units and which condenses the refrigerant in a gas phase inside the container by heat radiation; a transport structure that transports the refrigerant in the liquid phase from the condensation units to the evaporation units by surface tension; and a movement portion that communicates the plurality of condensation units such that the refrigerant in the liquid phase is movable between the plurality of condensation structures.Type: ApplicationFiled: December 2, 2021Publication date: September 29, 2022Applicant: FUJITSU LIMITEDInventors: KENJI SASABE, Hideo Kubo, Keita Hirai, KENTO OHGA, Masahide KODAMA, ATSUSHI ENDO, Takashi Urai, Nobumitsu Aoki
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Publication number: 20220299273Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.Type: ApplicationFiled: January 4, 2022Publication date: September 22, 2022Applicant: FUJITSU LIMITEDInventors: KENTO OHGA, Hideo Kubo, KENJI SASABE, Masahide KODAMA, ATSUSHI ENDO, Keita Hirai, Nobumitsu Aoki, Takashi Urai
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Publication number: 20220078946Abstract: An information processing device includes: a first distributing layer distributer configured to distribute a coolant for cooling electronic devices; and a second distributing layer distributer coupled to the first distributing layer distributer and configured to distribute the coolant, wherein the first distributing layer distributer includes a first distributing pipe and first distributing connecting pipes branched from the first distributing pipe, the first distributing pipe is disposed so that an axis of the first distributing pipe is parallel with the height direction, and the first distributing connecting pipes are arranged in the height direction, wherein the second distributing layer distributer includes second distributing pipes which are coupled to the respective first distributing connecting pipes, each of the second distributing pipes is disposed so that an axis of the second distributing pipe is parallel with the height direction, and the second distributing pipes are arranged in the height directType: ApplicationFiled: November 17, 2021Publication date: March 10, 2022Applicant: FUJITSU LIMITEDInventors: Koji NAKAGAWA, Nobumitsu Aoki, Osamu Aizawa, Keita Hirai, Tsuyoshi So
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Patent number: 10881019Abstract: A cooling apparatus includes an immersion-tank configured to store a refrigerant, a refrigerant suction port formed at a lower portion of the immersion-tank, the refrigerant suction port being configured to suck the refrigerant from an outside of the immersion-tank into an inside of the immersion-tank, an electronic device immersed in the refrigerant, the electronic device including, a first heat-generation portion, a second heat-generation portion having a heat-generation amount smaller than a heat-generation amount of the first heat-generation portion, and a refrigerant inlet positioned below the first heat-generation portion and the second heat-generation portion and being open downward, and a block positioned below the first heat-generation portion and the second heat-generation portion, the block including a through-hole through which a region positioned below the first heat-generation portion in the refrigerant inlet is open, and a closing portion that closes a region positioned below the second heat-geType: GrantFiled: March 4, 2019Date of Patent: December 29, 2020Assignee: FUJITSU LIMITEDInventors: Shinnosuke Fujiwara, Nobumitsu Aoki, Hideo Kubo, Keita Hirai
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Patent number: 10701834Abstract: An information processing apparatus includes a plurality of electronic apparatus stacked over a plurality of hierarchies in the information processing apparatus, a heat exchanger that cools refrigerant liquid for cooling the plurality of electronic apparatus, a first distributor that distributes the refrigerant liquid from the heat exchanger to the plurality of hierarchies, a plurality of second distributor that stores the refrigerant liquid temporarily, and a plurality of pipes that branched from the distribution pipes to the plurality of the electronic apparatus, wherein the number of the second distributor increases toward a hierarchy on downstream side, the pipes of the last hierarchy are coupled to the electronic apparatus.Type: GrantFiled: September 24, 2018Date of Patent: June 30, 2020Assignee: FUJITSU LIMITEDInventors: Tsuyoshi So, Osamu Aizawa, Nobumitsu Aoki, Koji Nakagawa, Keita Hirai
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Publication number: 20190281727Abstract: A cooling apparatus includes an immersion-tank configured to store a refrigerant, a refrigerant suction port formed at a lower portion of the immersion-tank, the refrigerant suction port being configured to suck the refrigerant from an outside of the immersion-tank into an inside of the immersion-tank, an electronic device immersed in the refrigerant, the electronic device including, a first heat-generation portion, a second heat-generation portion having a heat-generation amount smaller than a heat-generation amount of the first heat-generation portion, and a refrigerant inlet positioned below the first heat-generation portion and the second heat-generation portion and being open downward, and a block positioned below the first heat-generation portion and the second heat-generation portion, the block including a through-hole through which a region positioned below the first heat-generation portion in the refrigerant inlet is open, and a closing portion that closes a region positioned below the second heat-geType: ApplicationFiled: March 4, 2019Publication date: September 12, 2019Applicant: FUJITSU LIMITEDInventors: Shinnosuke FUJIWARA, Nobumitsu Aoki, Hideo Kubo, Keita Hirai
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Patent number: 10342164Abstract: A rack mount-type information processing apparatus includes: a plurality of slots, into each of which an electronic device is inserted, a liquid-cooled element provided in a cooling target included in the electronic device, a liquid to cool the cooling target being circulated in the liquid-cooled element; a manifold pipe extending in a direction where the slots are arranged; and a plurality of connection pipes configured to interconnect the liquid-cooled element and the manifold pipe, and coupled in parallel to the manifold pipe at a portion of the manifold pipe which corresponds to at least one slot among the plurality of slots.Type: GrantFiled: October 5, 2017Date of Patent: July 2, 2019Assignee: FUJITSU LIMITEDInventors: Tsuyoshi So, Osamu Aizawa, Keita Hirai, Koji Nakagawa, Yoshinori Uzuka, Nobumitsu Aoki, Naofumi Kosugi
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Publication number: 20190104646Abstract: An information processing apparatus includes a plurality of electronic apparatus stacked over a plurality of hierarchies in the information processing apparatus, a heat exchanger that cools refrigerant liquid for cooling the plurality of electronic apparatus, a first distributor that distributes the refrigerant liquid from the heat exchanger to the plurality of hierarchies, a plurality of second distributor that stores the refrigerant liquid temporarily, and a plurality of pipes that branched from the distribution pipes to the plurality of the electronic apparatus, wherein the number of the second distributor increases toward a hierarchy on downstream side, the pipes of the last hierarchy are coupled to the electronic apparatus.Type: ApplicationFiled: September 24, 2018Publication date: April 4, 2019Applicant: FUJITSU LIMITEDInventors: Tsuyoshi So, Osamu Aizawa, Nobumitsu Aoki, Koji NAKAGAWA, Keita Hirai
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Publication number: 20180177079Abstract: An information processing device includes: a first distributing layer distributer configured to distribute a coolant for cooling electronic devices; and a second distributing layer distributer coupled to the first distributing layer distributer and configured to distribute the coolant, wherein the first distributing layer distributer includes a first distributing pipe and first distributing connecting pipes branched from the first distributing pipe, the first distributing pipe is disposed so that an axis of the first distributing pipe is parallel with the height direction, and the first distributing connecting pipes are arranged in the height direction, wherein the second distributing layer distributer includes second distributing pipes which are coupled to the respective first distributing connecting pipes, each of the second distributing pipes is disposed so that an axis of the second distributing pipe is parallel with the height direction, and the second distributing pipes are arranged in the height directType: ApplicationFiled: December 6, 2017Publication date: June 21, 2018Applicant: FUJITSU LIMITEDInventors: Koji Nakagawa, Nobumitsu Aoki, Osamu Aizawa, Keita Hirai, Tsuyoshi So
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Publication number: 20180132387Abstract: A rack mount-type information processing apparatus includes: a plurality of slots, into each of which an electronic device is inserted, a liquid-cooled element provided in a cooling target included in the electronic device, a liquid to cool the cooling target being circulated in the liquid-cooled element; a manifold pipe extending in a direction where the slots are arranged; and a plurality of connection pipes configured to interconnect the liquid-cooled element and the manifold pipe, and coupled in parallel to the manifold pipe at a portion of the manifold pipe which corresponds to at least one slot among the plurality of slots.Type: ApplicationFiled: October 5, 2017Publication date: May 10, 2018Applicant: FUJITSU LIMITEDInventors: Tsuyoshi So, Osamu Aizawa, Keita Hirai, Koji NAKAGAWA, Yoshinori Uzuka, Nobumitsu Aoki, NAOFUMI KOSUGI
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Patent number: 9951999Abstract: A cooling device includes: a refrigerant circulation loop configured to depressurizing the inside thereof, the refrigerant circulation loop includes, an evaporator that vaporizes a part of refrigerant by heat generated by an electronic component, a condenser that cools the refrigerant, and a pump that circulates the refrigerant, wherein a filling ratio of liquid refrigerant to a volume of the refrigerant circulation loop is configured to maintain a refrigerant circulation capability of the pump.Type: GrantFiled: December 16, 2014Date of Patent: April 24, 2018Assignee: FUJITSU LIMITEDInventors: Tsuyoshi So, Hideo Kubo, Osamu Aizawa, Nobuyuki Hayashi, Teru Nakanishi, Yoshinori Uzuka, Nobumitsu Aoki
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Patent number: 9949402Abstract: A liquid loop cooling apparatus includes: an evaporator thermally coupled to a heating element; a condenser configured to be cooled by an airflow; a pump configured to circulate a refrigerant between the evaporator and the condenser; a first piping configured to couple the evaporator and the condenser; a second piping configured to couple the condenser and the pump; and a third piping configured to couple the pump and the evaporator, wherein the first piping is arranged on a destination side of the airflow, and the second piping is arranged on a source side of the airflow.Type: GrantFiled: September 19, 2016Date of Patent: April 17, 2018Assignee: FUJITSU LIMITEDInventors: Tsuyoshi So, Hideo Kubo, Yoshinori Uzuka, Nobumitsu Aoki
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Patent number: 9694433Abstract: A disclosed method of joining a cooling component includes joining an electronic component and a spherical shaped bottom plate of a cooling component to each other by pressing the bottom plate against the electronic component, while providing a thermal bonding material between the bottom plate and the electronic component.Type: GrantFiled: June 29, 2016Date of Patent: July 4, 2017Assignee: FUJITSU LIMITEDInventors: Tsuyoshi So, Hideo Kubo, Yoshinori Uzuka, Nobumitsu Aoki
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Publication number: 20170127564Abstract: A liquid loop cooling apparatus includes: an evaporator thermally coupled to a heating element; a condenser configured to be cooled by an airflow; a pump configured to circulate a refrigerant between the evaporator and the condenser; a first piping configured to couple the evaporator and the condenser; a second piping configured to couple the condenser and the pump; and a third piping configured to couple the pump and the evaporator, wherein the first piping is arranged on a destination side of the airflow, and the second piping is arranged on a source side of the airflow.Type: ApplicationFiled: September 19, 2016Publication date: May 4, 2017Applicant: FUJITSU LIMITEDInventors: Tsuyoshi So, Hideo Kubo, Yoshinori Uzuka, Nobumitsu Aoki