Abstract: A disclosed method of joining a cooling component includes joining an electronic component and a spherical shaped bottom plate of a cooling component to each other by pressing the bottom plate against the electronic component, while providing a thermal bonding material between the bottom plate and the electronic component.

Abstract: A cooling module includes: a heat exchanger mounted on an electronic part mounted on a board, and that cools the electronic part; a leaf spring including an overhang portion and an extension portion, the overhang portion overhanging outward beyond the heat exchanger from the heat exchanger, and the extension portion extending from the overhang portion in a direction intersecting an overhang direction of the overhang portion when viewed in a thickness direction of the board; and a support member located around the heat exchanger, and fixed to the board, the extension portion bent toward the board being attached to the support member.

Abstract: A pump includes: an impeller including a rotary shaft and a plurality of blades extending radially from the rotary shaft, a cutout or a hole is formed in each of the blades; a casing housing the impeller therein; an inlet provided to the casing, a thermal medium flows in the casing through the inlet; and an outlet provided to the casing, the thermal medium flows out of the casing through the outlet.

Abstract: A cooling unit includes a radiator, a rigid supply pipe connected to the radiator, and a refrigerant that is air-cooled by the radiator flows, a plurality of open nozzles provided at the supply pipe to correspond to the respective plurality of heat-generating components, a plurality of heat receiving units that are mounted to the respective plurality of heat-generating components and connected to the respective open nozzles, and allow a refrigerant supplied from the open nozzles to flow through internal channels, and a plurality of return pipes each of which is provided for each of the heat receiving units and joined to the heat receiving unit, and returns the refrigerant discharged from the heat receiving unit to the radiator, wherein the respective heat receiving units are connected to the supply pipe to be relatively displaceable, and the respective return pipes are connected to one another in series and relatively displaceably.

Abstract: A cooling device includes: an evaporator that vaporizes a part of a refrigerant by heat generated by an electronic component; a condenser that cools the refrigerant; a refrigerant circulation loop coupled to the evaporator and the condenser, an inside of the refrigerant circulation loop is depressurized; and a pump that circulates the refrigerant, wherein a filling ratio of the liquid refrigerant to a volume of the refrigerant circulation loop is 50% or more.

Abstract: A cooling structure for a card-type electronic component, including: a printed circuit board on which a card-type electronic component is detachably mounted; a thermally-conductive heat transfer member, disposed facing the card-type electronic component; a press contact portion that places the heat transfer member in press contact with the card-type electronic component; and a pair of flow path portions that are disposed at both width direction sides of the card-type electronic component, that form flow paths in which coolant flows, and that support the heat transfer member so as to enable heat exchange between the heat transfer member and the coolant.

Abstract: DIMMs to be cooled are mounted in DIMM areas of a printed circuit board of a system board. An air intake port that introduces cooling air is arranged on a side plate of the system board, whereas an air discharge port that discharges the cooling air is arranged on another side plate. The cooling air flows in a direction that is oblique with respect to the side plate. The air intake port is arranged at a position that is offset in the direction in which the cooling air is supplied. Accordingly, cooling is possible by efficiently bringing the cooling air into contact with the DIMMs.

Abstract: A cooling unit includes a radiator, a rigid supply pipe connected to the radiator, and a refrigerant that is air-cooled by the radiator flows, a plurality of open nozzles provided at the supply pipe to correspond to the respective plurality of heat-generating components, a plurality of heat receiving units that are mounted to the respective plurality of heat-generating components and connected to the respective open nozzles, and allow a refrigerant supplied from the open nozzles to flow through internal channels, and a plurality of return pipes each of which is provided for each of the heat receiving units and joined to the heat receiving unit, and returns the refrigerant discharged from the heat receiving unit to the radiator, wherein the respective heat receiving units are connected to the supply pipe to be relatively displaceable, and the respective return pipes are connected to one another in series and relatively displaceably.

Abstract: DIMMs to be cooled are mounted in DIMM areas of a printed circuit board of a system board. An air intake port that introduces cooling air is arranged on a side plate of the system board, whereas an air discharge port that discharges the cooling air is arranged on another side plate. The cooling air flows in a direction that is oblique with respect to the side plate. The air intake port is arranged at a position that is offset in the direction in which the cooling air is supplied. Accordingly, cooling is possible by efficiently bringing the cooling air into contact with the DIMMs.