Patents by Inventor Nobuo Ikemoto
Nobuo Ikemoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120098728Abstract: An antenna includes a flexible sheet, a first coil electrode located on a first main surface of the flexible sheet and a second coil electrode located on a second main surface of the flexible sheet. A base film is arranged on the first main surface of the flexible sheet and a wireless communication IC is mounted on the base film. Two input/output terminals of the wireless communication IC are connected to coupling electrodes. A first coupling electrode opposes one end portion of the first coil electrode with the base film disposed therebetween. A second coupling electrode opposes one end of the second coil electrode with the base film, a central electrode and the flexible sheet disposed therebetween.Type: ApplicationFiled: December 29, 2011Publication date: April 26, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Noboru KATO, Katsumi TANIGUCHI, Nobuo IKEMOTO, Hiromi MURAYAMA
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Publication number: 20120092222Abstract: An antenna includes a flexible sheet that includes a first main surface including a first coil electrode located thereon and a second main surface including a second coil electrode located thereon. The first and second coil electrodes are wound in opposite directions when viewed from different directions. A first end of the first coil electrode faces a first end of the second coil electrode through the flexible sheet. Similarly, a second end of the first coil electrode faces a second end of the second coil electrode through the flexible sheet. The first and second coil electrodes define an inductor, the first ends of the first and second coil electrodes define a capacitor, and the second ends of the first and second coil electrodes define a capacitor whereby a resonant antenna is provided.Type: ApplicationFiled: December 22, 2011Publication date: April 19, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Noboru KATO, Katsumi TANIGUCHI, Nobuo IKEMOTO, Hiromi MURAYAMA
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Publication number: 20120086556Abstract: A wireless IC tag includes a wireless IC chip and two coil-shaped antennas. One end of each of the coil-shaped antennas is electrically connected to the wireless IC chip, and the other ends of the coil-shaped antennas are electrically connected to each other. The winding axes of the coil-shaped antennas are arranged at different positions, and the coil-shaped antennas have the same winding direction. A reader-writer includes an antenna connected to an information processing circuit. The antenna is electromagnetically coupled to the coil-shaped antennas for communication.Type: ApplicationFiled: December 19, 2011Publication date: April 12, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventor: Nobuo IKEMOTO
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Patent number: 8081121Abstract: An article having an electromagnetic coupling module attached thereto includes an electromagnetic coupling module and a PET bottle having the electromagnetic coupling module bonded thereto. The electromagnetic coupling module includes a wireless IC chip arranged to process transmission and reception signals and the feed circuit board having the wireless IC chip mounted thereon. The feed circuit board includes a feed circuit including a resonant circuit having a predetermined resonant frequency. The feed circuit performs characteristic impedance matching between the PET bottle and the wireless IC chip. The PET bottle functions as a radiator arranged to radiate a transmission signal supplied from the feed circuit using electromagnetic field coupling and to supply a received reception signal to the feed circuit using electromagnetic field coupling.Type: GrantFiled: March 11, 2009Date of Patent: December 20, 2011Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Yuya Dokai, Nobuo Ikemoto
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Patent number: 8009101Abstract: A wireless IC device includes a spiral line electrode portion and a first capacitance electrode connected to the inner end of the line electrode portion, which are disposed on the top surface of a substrate. A second capacitance electrode opposing the first capacitance electrode and a cross line electrode, which connects the second capacitance electrode and a connecting portion that connects the top and bottom surfaces, are disposed on the bottom surface of the substrate. The connecting portion electrically connects the outer end of the line electrode portion and an end of the cross line electrode. A wireless IC is mounted such that terminal electrodes thereof are connected to the connecting portion and an end of a radiating electrode. A radiating/resonating electrode including the line electrode portion, the capacitance electrodes, and the cross line electrode can act both as a resonant circuit for a resonant tag and as a radiating electrode serving as an RFID tag.Type: GrantFiled: September 7, 2007Date of Patent: August 30, 2011Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobuo Ikemoto, Noboru Kato
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Publication number: 20110199713Abstract: A high-frequency device includes a wireless IC chip and a board which is coupled to the wireless IC chip and electrically connected to radiator plates, and an inductor and/or a capacitance are provided as a static electricity countermeasure element in the board. The inductor is connected in parallel between the wireless IC chip and the radiator plates, and its impedance at the frequency of static electricity is less than an impedance of the wireless IC chip.Type: ApplicationFiled: April 27, 2011Publication date: August 18, 2011Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Noboru KATO, Nobuo IKEMOTO, Yuya DOKAI, Koji SHIROKI
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Patent number: 7997501Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.Type: GrantFiled: July 15, 2009Date of Patent: August 16, 2011Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobuo Ikemoto, Satoshi Ishino, Yuya Dokai, Noboru Kato, Takeshi Kataya, Ikuhei Kimura, Mikiko Tanaka
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Publication number: 20110186641Abstract: A radio IC device that is highly efficient in transmitting signals from a radio IC to a radiation pattern includes a radio IC chip arranged to processes radio signals, an auxiliary electrode pattern that is connected to the radio IC chip and includes a loop-shaped electrode, and a radiation electrode pattern that includes a magnetic-field radiation electrode having a resonant frequency and an electric-field radiation electrode having a resonant frequency. The loop-shaped electrode of the auxiliary electrode pattern is coupled to a maximum-voltage section of the magnetic-field radiation electrode through a capacitor.Type: ApplicationFiled: April 6, 2011Publication date: August 4, 2011Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Noboru KATO, Nobuo IKEMOTO
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Patent number: 7973633Abstract: Lower surface terminals are disposed at the lower surface of a magnetic substrate. An upper surface electrode is disposed at the upper surface of the magnetic substrate. A control circuit, an input capacitor, and an output capacitor are mounted on the upper surface electrode. The control circuit contains a switching element. A smoothing choke is disposed inside the magnetic substrate. The connection wiring of connecting the upper surface electrode and at least one of the input terminal, the output terminal, and the ground terminal is constructed using an inner conductor passing through the inside of the magnetic substrate, and the connection wiring forms an inductor.Type: GrantFiled: July 29, 2010Date of Patent: July 5, 2011Assignee: Murata Manufacturing Co., Ltd.Inventors: Takashi Noma, Nobuo Ikemoto, Yoshihiko Nishizawa
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Publication number: 20110127337Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.Type: ApplicationFiled: February 8, 2011Publication date: June 2, 2011Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Nobuo IKEMOTO, Satoshi ISHINO, Yuya DOKAI, Noboru KATO, Takeshi KATAYA, Ikuhei KIMURA, Mikiko TANAKA
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Patent number: 7931206Abstract: A wireless IC device includes a radiation plate, a feeding circuit substrate on which a feeding circuit including a resonant circuit including an inductance element is provided, the feeding circuit being electromagnetically coupled to the radiation plate, and a wireless IC chip including a connection electrode, the wireless IC chip being disposed on the feeding circuit substrate. A mounting electrode is provided on the feeding circuit substrate. The frequency of signals sent and received using the radiation plate substantially corresponds to the resonant frequency of the resonant circuit. The wireless IC chip is electromagnetically coupled to the mounting electrode.Type: GrantFiled: May 21, 2009Date of Patent: April 26, 2011Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Yuya Dokai, Nobuo Ikemoto
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Publication number: 20110090058Abstract: A radio IC device that can be used in a plurality of frequency bands for RFID tags and that is compact and has superior radiation characteristics is provided. A spiral line electrode portion and a first side electrode, extending from an inner end thereof, of a capacitor electrode portion are provided on a top surface of a sheet-shaped substrate, and a second side electrode arranged to face the first side electrode and a crossing line electrode are provided on a bottom surface of the substrate. A first radio IC chip is arranged at a location in the line electrode portion, and a second RFID tag radio IC is arranged so as to be connected to a front-to-back connection portion and an end of an electric-field radiation electrode portion. The radio IC chip rectifies an RF signal in a first frequency band and outputs and supplies power to the second RFID tag radio IC.Type: ApplicationFiled: December 30, 2010Publication date: April 21, 2011Applicant: MURATA MANUFACTURING CO., LTD.Inventor: Nobuo IKEMOTO
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Publication number: 20110074584Abstract: A radio frequency IC device includes a radio frequency IC chip arranged to process a transmitted/received signal, a printed circuit board on which the radio frequency IC chip is mounted, an electrode arrange on the circuit board, and a loop electrode that is arranged on the circuit board so that the loop electrode is electrically connected to the radio frequency IC chip and is coupled to the electrode by electromagnetic coupling. The electrode is coupled to the radio frequency IC chip via the loop electrode so as to transmit or receive a high-frequency signal. A power supply circuit board including a resonance circuit and/or a matching circuit may be disposed between the radio frequency IC chip and the loop electrode.Type: ApplicationFiled: December 3, 2010Publication date: March 31, 2011Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Takeshi KATAYA, Noboru KATO, Satoshi ISHINO, Nobuo IKEMOTO, Ikuhel KIMURA, Yuya DOKAI
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Patent number: 7905421Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.Type: GrantFiled: July 15, 2009Date of Patent: March 15, 2011Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobuo Ikemoto, Satoshi Ishino, Yuya Dokai, Noboru Kato, Takeshi Kataya, Ikuhei Kimura, Mikiko Tanaka
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Publication number: 20110031320Abstract: A wireless IC device includes a wireless IC chip arranged to process a radio signal, a power-supply circuit board that is connected to the wireless IC chip and that includes a power supply circuit including at least one coil pattern, and a radiation plate arranged to radiate a transmission signal supplied from the power-supply circuit board and/or receiving a reception signal to supply the reception signal to the power-supply circuit board. The radiation plate includes an opening provided in a portion thereof and a slit connected to the opening. When viewed in plan from the direction of the winding axis of the coil pattern, the opening in the radiation plate overlaps with an inner area of the coil pattern and the area of the inner area is approximately the same as that of opening.Type: ApplicationFiled: October 13, 2010Publication date: February 10, 2011Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Noboru KATO, Nobuo IKEMOTO
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Publication number: 20100328010Abstract: Lower surface terminals are disposed at the lower surface of a magnetic substrate. An upper surface electrode is disposed at the upper surface of the magnetic substrate. A control circuit, an input capacitor, and an output capacitor are mounted on the upper surface electrode. The control circuit contains a switching element. A smoothing choke is disposed inside the magnetic substrate. The connection wiring of connecting the upper surface electrode and at least one of the input terminal, the output terminal, and the ground terminal is constructed using an inner conductor passing through the inside of the magnetic substrate, and the connection wiring forms an inductor.Type: ApplicationFiled: July 29, 2010Publication date: December 30, 2010Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Takashi Noma, Nobuo Ikemoto, Yoshihiko Nishizawa
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Patent number: 7857230Abstract: An electromagnetic coupling module includes a feed circuit substrate having external coupling electrodes on both main surfaces thereof and a wireless IC chip. Radiation electrodes are disposed on a packaging body. The electromagnetic coupling module is disposed on a joint of the packaging body so that the external coupling electrodes on both the main surfaces of the electromagnetic coupling module are coupled to the radiation electrodes, respectively. Thus, the wireless IC device is resistant to shock, stress, forces or the like, easy to manufacture, obtains stable characteristics and allows for easy reuse or replacement of an IC chip.Type: GrantFiled: October 15, 2009Date of Patent: December 28, 2010Assignee: Murata Manufacturing Co., Ltd.Inventor: Nobuo Ikemoto
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Publication number: 20100308118Abstract: A wireless IC device and an electronic apparatus are obtained, which can achieve miniaturization and improve the gain of a radiator plate (electrode) without providing a dedicated antenna. A wireless IC device is provided, in which a loop electrode is provided in a ground electrode provided on a printed wiring circuit board, and in which a wireless IC chip that processes a transmission/reception signal or an electromagnetic coupling module is coupled to the loop electrode. The ground electrode is coupled to the wireless IC chip or the electromagnetic coupling module via the loop electrode, and transmits or receives a high-frequency signal. The ground electrode is formed with a slit for adjusting a resonant frequency thereof.Type: ApplicationFiled: August 24, 2010Publication date: December 9, 2010Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Takeshi KATAYA, Noboru KATO, Satoshi ISHINO, Nobuo IKEMOTO, Ikuhei KIMURA, Koji SHIROKI, Yuya DOKAI
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Publication number: 20100302013Abstract: A radio frequency IC device achieves impedance matching between a radio IC chip and a radiation plate in a wide frequency band, and achieves desired radiation characteristics over a wide range of frequencies. A radio frequency IC device and a radio communication system allow both long-distance and short-distance communication and, in particular, allow short-distance communication using a small amount of energy. The radio frequency IC device includes an electromagnetic coupling module including a radio IC chip and a feed circuit board, and a radiation plate. An annular electrode is arranged to be coupled to both a feed circuit of the electromagnetic coupling module and the radiation plate. The radiation plate defines an electric-field radiation plate for long-distance communication, while the annular electrode defines a magnetic-field radiation plate for short-distance communication.Type: ApplicationFiled: August 19, 2010Publication date: December 2, 2010Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Noboru KATO, Nobuo IKEMOTO
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Patent number: 7830311Abstract: A wireless IC device includes a wireless IC chip for processing a transmission/reception signal, a printed wiring circuit board on which the wireless IC chip is mounted, a ground electrode disposed on the circuit board, and a substantially loop-shaped electrode that is electrically conducted to the wireless IC chip and disposed on the circuit board so as to be coupled to the ground electrode by an electromagnetic field. The ground electrode is coupled to the wireless IC chip via the substantially loop-shaped electrode to transmit/receive a radio frequency signal. A feeder circuit board including a resonant circuit and/or a matching circuit may be interposed between the wireless IC chip and the substantially loop-shaped electrode.Type: GrantFiled: September 7, 2007Date of Patent: November 9, 2010Assignee: Murata Manufacturing Co., Ltd.Inventors: Takeshi Kataya, Noboru Kato, Satoshi Ishino, Nobuo Ikemoto, Ikuhei Kimura