Patents by Inventor Nobuo Ikemoto

Nobuo Ikemoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radio IC device
    Patent number: 9460376
    Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.
    Type: Grant
    Filed: January 15, 2010
    Date of Patent: October 4, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Satoshi Ishino, Takeshi Kataya, Ikuhei Kimura, Nobuo Ikemoto, Yuya Dokai
  • Communication terminal and information processing system
    Patent number: 9461363
    Abstract: An information processing system includes a reader/writer, a communication terminal, and a wireless IC tag. The communication terminal includes an electric field-type first antenna unit, a magnetic field-type second antenna unit, and a connection unit electrically connecting the first and second antenna units and to each other, and is housed within a pen housing. The first antenna unit is coupled to an antenna of the reader/writer through an electric field, and the second antenna unit is coupled to the wireless IC tag through a magnetic field. By causing the second antenna unit to be adjacent to the wireless IC tag, the reader/writer and the wireless IC tag communicate with each other.
    Type: Grant
    Filed: March 28, 2012
    Date of Patent: October 4, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Nobuo Ikemoto
  • Radio IC device
    Patent number: 9330354
    Abstract: A radio IC device that can be used in a plurality of frequency bands for RFID tags and that is compact and has superior radiation characteristics is provided. A spiral line electrode portion and a first side electrode, extending from an inner end thereof, of a capacitor electrode portion are provided on a top surface of a sheet-shaped substrate, and a second side electrode arranged to face the first side electrode and a crossing line electrode are provided on a bottom surface of the substrate. A first radio IC chip is arranged at a location in the line electrode portion, and a second RFID tag radio IC is arranged so as to be connected to a front-to-back connection portion and an end of an electric-field radiation electrode portion. The radio IC chip rectifies an RF signal in a first frequency band and outputs and supplies power to the second RFID tag radio IC.
    Type: Grant
    Filed: May 26, 2015
    Date of Patent: May 3, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Nobuo Ikemoto
  • Antenna device, card-type communication device, and communication terminal apparatus
    Patent number: 9269038
    Abstract: An antenna device includes an antenna resonance circuit connected to a power supply circuit and a variable-frequency resonance element including a resonance circuit which is coupled with the antenna resonance circuit via an electromagnetic field. The resonant frequency of the resonance circuit is variable within a predetermined frequency band.
    Type: Grant
    Filed: May 15, 2014
    Date of Patent: February 23, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Nobuo Ikemoto, Toshiyuki Nakaiso, Naoki Gouchi, Naoto Ikeda
  • Antenna device, wireless communication device, and method of manufacturing antenna device
    Patent number: 9225064
    Abstract: In an antenna device, first linear portions of a coil conductor are located on a lower surface of a first resin sheet. Second linear portions of the coil conductor are located on an upper surface of a second resin sheet. Via conductors of the coil conductor are formed in the first and second resin sheets and intermediate resin sheets located between the first and second resin sheets. The via conductors connect a first end and a second end of the first linear portions and a first end and a second end of the second linear portions, respectively. The first and second linear portions and the via conductors define the coil conductor. Each of the intermediate resin sheets includes an aperture in the center portion thereof. The lamination of the apertures defines a cavity in which a magnetic substance core is embedded. The coil conductor is wound around a periphery of the cavity.
    Type: Grant
    Filed: August 6, 2013
    Date of Patent: December 29, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Naoki Gouchi, Nobuo Ikemoto, Kuniaki Yosui, Wataru Tamura
  • CAMERA MODULE AND ELECTRONIC DEVICE
    Publication number: 20150373238
    Abstract: A camera module includes a multilayer base body including a first mounting portion, a second mounting portion, and a connecting portion. The first mounting portion and the second mounting portion are connected to the connecting portion. A connector element is arranged in the second mounting portion. The first mounting portion includes a cavity, and a penetration hole penetrating from the cavity to one surface of the first mounting portion. An image sensor IC is arranged in the cavity, and the lens unit is arranged on the one surface of the first mounting portion at a location at or near the penetration hole. Peripheral circuit components and conductor patterns are mounted to or incorporated in the first mounting portion.
    Type: Application
    Filed: August 31, 2015
    Publication date: December 24, 2015
    Inventors: Shigeru TAGO, Hirofumi SHINAGAWA, Jerry HSIEH, Satoshi SASAKI, Jun SASAKI, Nobuo IKEMOTO, Yuki WAKABAYASHI
  • ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT, AND CIRCUIT BOARD
    Publication number: 20150373854
    Abstract: A camera module includes an image sensor IC including terminal electrodes, and a circuit board on which the image sensor IC is mounted. The circuit board includes mount electrodes to which the terminal electrodes are ultrasonically welded, a flat film member provided with the mount electrodes, and a base member to which the flat film member is bonded. An elastic modulus of the flat film member is higher than that of the base member.
    Type: Application
    Filed: August 28, 2015
    Publication date: December 24, 2015
    Inventors: Nobuo IKEMOTO, Makoto OSAMURA, Satoshi SASAKI, Yuki WAKABAYASHI
  • MANUFACTURING METHOD FOR CAMERA MODULE
    Publication number: 20150358517
    Abstract: A manufacturing method for a camera module including a multilayer body in which an image sensor IC and a lens are arranged with an optical path provided in the multilayer body being disposed therebetween includes a first step and a second step. In the first step, the multilayer body is formed by stacking and combining flexible sheets. In the second step, a through hole is formed in flexible base material layers that constitute a portion of the multilayer body to form the optical path defined by the through hole.
    Type: Application
    Filed: August 14, 2015
    Publication date: December 10, 2015
    Inventors: Nobuo IKEMOTO, Atsushi KUMANO, Jerry HSIEH, Jun SASAKI
  • RESIN MULTILAYER SUBSTRATE AND ELECTRONIC APPARATUS
    Publication number: 20150351222
    Abstract: A flat cable includes a plurality of resin layers that are flexible and stacked together, a line conductor, and grounding conductors. The flat cable includes a triplate line in which both surfaces of the line conductor oppose the corresponding grounding conductors, and a microstrip line in which only one of the surfaces of the line conductor opposes the corresponding grounding conductor. A width of the line conductor in the microstrip line is greater than a width of the line conductor in the triplate line, and the flat cable is bent at a position where the microstrip line is provided.
    Type: Application
    Filed: August 11, 2015
    Publication date: December 3, 2015
    Inventors: Takahiro BABA, Nobuo IKEMOTO
  • INDUCTOR BRIDGE AND ELECTRONIC DEVICE
    Publication number: 20150340151
    Abstract: An inductor bridge is configured to bridge-connect a first circuit and a second circuit to each other, and includes a flexible flat plate base body, a first connector at a first end portion of the base body and connected to the first circuit, a second connector at a second end portion of the base body and connected to the second circuit, and an inductor section in the base body between the first connector and the second connector. The inductor section includes conductor patterns including a plurality of layers. The inductor bridge further includes a bending portion between the inductor section and the first connector, and a slot at an inner side of the bending portion that reduces a thickness of the base body.
    Type: Application
    Filed: July 31, 2015
    Publication date: November 26, 2015
    Inventors: Kuniaki YOSUI, Noboru KATO, Nobuo IKEMOTO, Naoto IKEDA, Yuki WAKABAYASHI
  • Camera module
    Patent number: 9197803
    Abstract: A camera module includes an image sensor IC, a resin multilayer board including thermoplastic resin layers stacked in a direction perpendicular or substantially perpendicular to a light receiving surface of the image sensor IC, a mounting electrode which is stacked on the thermoplastic resin layer and on which the image sensor IC is mounted, and a via-hole conductor electrically connected to the mounting electrode. The resin multilayer board includes a flat plate portion including a surface on which the mounting electrode is mounted, and a rigid portion including a greater number of thermoplastic resin layers than that of the flat plate portion, and the via-hole conductor is arranged in the flat plate portion so as to avoid the thermoplastic resin layer on which the mounting electrode is stacked.
    Type: Grant
    Filed: September 11, 2014
    Date of Patent: November 24, 2015
    Assignee: Murata Manufactruing Co., Ltd.
    Inventors: Nobuo Ikemoto, Atsushi Kumano, Jerry Hsieh, Jun Sasaki
  • TRANSMISSION LINE AND ELECTRONIC DEVICE
    Publication number: 20150318595
    Abstract: A main transmission line includes a substantially elongated dielectric body in which first and second substantially elongated signal conductors are disposed with a distance therebetween in a width direction. A first reference ground conductor and a first auxiliary ground conductor sandwich therebetween the first signal conductor in a thickness direction. A second reference ground conductor and a second auxiliary ground conductor sandwich therebetween the second signal conductor in the thickness direction. The second auxiliary ground conductor includes two substantially elongated conductors and a first bridge conductor, and the second auxiliary ground conductor includes two substantially elongated conductors and a second bridge conductor. The positions of the first and second bridge conductors in a lengthwise direction are different.
    Type: Application
    Filed: July 10, 2015
    Publication date: November 5, 2015
    Inventors: Kuniaki YOSUI, Nobuo IKEMOTO, Shigeru TAGO, Zhujun YANG, Jun SASAKI, Fumie MATSUDA, Wataru TAMURA
  • Wireless IC tag, reader-writer, and information processing system
    Patent number: 9178279
    Abstract: A wireless IC tag includes a wireless IC chip and two coil-shaped antennas. One end of each of the coil-shaped antennas is electrically connected to the wireless IC chip, and the other ends of the coil-shaped antennas are electrically connected to each other. The winding axes of the coil-shaped antennas are arranged at different positions, and the coil-shaped antennas have the same winding direction. A reader-writer includes an antenna connected to an information processing circuit. The antenna is electromagnetically coupled to the coil-shaped antennas for communication.
    Type: Grant
    Filed: December 19, 2011
    Date of Patent: November 3, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Nobuo Ikemoto
  • Circuit board
    Patent number: 9167685
    Abstract: A circuit board includes a plate-shaped dielectric body with a first and a second main surface and including a first area not to be bent and a second area to be bent such that the first main surface becomes an outer side, a first reinforcing member located in the first area nearer the first main surface in relation to a center of the second area in a thickness direction and away from the second area, and a second reinforcing member located in the first area nearer the second main surface in relation to the center of the second area and contacting with a border between the first and the second areas. The first main surface curves from an edge of the first reinforcing member closest to the second area, and the second main surface curves from an edge of the second reinforcing member on the border.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: October 20, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Nobuo Ikemoto, Yuki Wakabayashi
  • HIGH-FREQUENCY TRANSMISSION LINE
    Publication number: 20150295296
    Abstract: A first signal line is closer to a second ground conductor than a second signal line and, hence, crosstalk between the first and second signal lines is unlikely to be generated. By providing first opening portions in the second ground conductor, capacitive coupling between the first and second signal lines is reduced. Hence, in a transmission line including the first signal line, an increase in the capacitance due to the increased width of the first signal line is cancelled out by a decrease in the capacitance due to the increased distance from the first ground conductor and the first opening portions. Further, the width of the high-frequency transmission line need not be large. Further, since the capacitance is reduced by the first and second opening portions, the distances between the first ground conductor and the first and second signal lines are shortened.
    Type: Application
    Filed: June 26, 2015
    Publication date: October 15, 2015
    Inventors: Nobuo IKEMOTO, Takahiro BABA, Fumie MATSUDA, Wataru TAMURA
  • Wireless communication system
    Patent number: 9161160
    Abstract: A wireless communication system includes a plurality of communication devices, and a communication terminal that is a separate structure from the plurality of communication devices. Each of the communication devices includes a coupling portion to be coupled with the communication terminal, a power source, and a signal processing section arranged to process a signal received and a signal to be sent. The communication terminal includes neither a power source nor a signal processing section, and the communication terminal includes a coupling portion to be coupled with the coupling portion of each of the communication devices, an antenna arranged to send and receive radio waves, and a connector arranged to connect the coupling portion and the antenna to each other.
    Type: Grant
    Filed: June 3, 2013
    Date of Patent: October 13, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Nobuo Ikemoto, Satoshi Ishino, Noboru Kato
  • WIRELESS COMMUNICATION DEVICE
    Publication number: 20150263412
    Abstract: A compact wireless communication includes a first radiating element and a second radiating element, which define and function as a dipole antenna, a feeder circuit including a wireless IC chip coupled with the first and second radiating elements, and a feeder substrate that is provided with the wireless IC chip. The first radiating element is provided to the feeder substrate. The second radiating element is provided to a substrate other than the feeder substrate.
    Type: Application
    Filed: May 28, 2015
    Publication date: September 17, 2015
    Inventors: Ikuhei KIMURA, Nobuo IKEMOTO
  • Wireless IC device
    Patent number: 9135550
    Abstract: A wireless IC device includes a radiating plate, a wireless IC chip, and a feeder circuit board, on which the wireless IC chip is mounted. The feeder circuit board includes a resonant circuit with an inductance element, and the resonant circuit is electromagnetically coupled with the radiating plate. The wireless IC chip is interposed between the radiating plate and the feeder circuit board.
    Type: Grant
    Filed: June 10, 2010
    Date of Patent: September 15, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Yuya Dokai, Nobuo Ikemoto
  • RADIO IC DEVICE
    Publication number: 20150254548
    Abstract: A radio IC device that can be used in a plurality of frequency bands for RFID tags and that is compact and has superior radiation characteristics is provided. A spiral line electrode portion and a first side electrode, extending from an inner end thereof, of a capacitor electrode portion are provided on a top surface of a sheet-shaped substrate, and a second side electrode arranged to face the first side electrode and a crossing line electrode are provided on a bottom surface of the substrate. A first radio IC chip is arranged at a location in the line electrode portion, and a second RFID tag radio IC is arranged so as to be connected to a front-to-back connection portion and an end of an electric-field radiation electrode portion. The radio IC chip rectifies an RF signal in a first frequency band and outputs and supplies power to the second RFID tag radio IC.
    Type: Application
    Filed: May 26, 2015
    Publication date: September 10, 2015
    Inventor: Nobuo IKEMOTO
  • Communication circuit
    Patent number: 9083389
    Abstract: In a communication circuit, an RFIC includes an IO terminal and a control IC includes an IO terminal. A variable capacitance element includes control terminals, a capacitance element with a capacitance value that is determined according to a control voltage, and a resistance voltage divider circuit configured to generate the control voltage by dividing a voltage inputted to the control terminals. One of the RFIC and the control IC supplies control data to the variable capacitance element via a signal line. The variable capacitance element, along with an antenna coil, constitutes an antenna circuit of an LC parallel resonance circuit, and sets a resonant frequency of the antenna circuit to be a predetermined frequency.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: July 14, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Naoto Ikeda, Nobuo Ikemoto, Naoki Gouchi, Toshiyuki Nakaiso, Katsumi Taniguchi