Patents by Inventor Nobuo Ikemoto

Nobuo Ikemoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9917366
    Abstract: An antenna device includes a base including a planar conductor disposed thereon, and a coil antenna. The coil antenna includes a coil conductor wound around a magnetic core. The coil antenna is arranged such that a coil opening of the coil conductor is closed to an edge of the planar conductor. A current passing through the coil conductor induces a current in the planar conductor. Thus, a first magnetic flux occurs in the coil antenna, and a second magnetic flux occurs in the planar conductor. Therefore, a third magnetic flux occurs in an area of the planar conductor. Accordingly, the antenna device achieves a small footprint, a small-sized communication terminal apparatus and a desired communication distance.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: March 13, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Teppei Miura, Nobuo Ikemoto, Jun Sasaki, Noboru Kato, Nobuhito Tsubaki
  • Publication number: 20180027154
    Abstract: A camera module includes a multilayer base body including a first mounting portion, a second mounting portion, and a connecting portion. The first mounting portion and the second mounting portion are connected to the connecting portion. A connector element is arranged in the second mounting portion. The first mounting portion includes a cavity, and a penetration hole penetrating from the cavity to one surface of the first mounting portion. An image sensor IC is arranged in the cavity, and the lens unit is arranged on the one surface of the first mounting portion at a location at or near the penetration hole. Peripheral circuit components and conductor patterns are mounted to or incorporated in the first mounting portion.
    Type: Application
    Filed: October 2, 2017
    Publication date: January 25, 2018
    Inventors: Shigeru TAGO, Hirofumi SHINAGAWA, Jerry HSIEH, Satoshi SASAKI, Jun SASAKI, Nobuo IKEMOTO, Yuki WAKABAYASHI
  • Patent number: 9854685
    Abstract: A camera module includes an image sensor IC including terminal electrodes, and a circuit board on which the image sensor IC is mounted. The circuit board includes mount electrodes to which the terminal electrodes are ultrasonically welded, a flat film member provided with the mount electrodes, and a base member to which the flat film member is bonded. An elastic modulus of the flat film member is higher than that of the base member.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: December 26, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Nobuo Ikemoto, Makoto Osamura, Satoshi Sasaki, Yuki Wakabayashi
  • Patent number: 9830552
    Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.
    Type: Grant
    Filed: August 12, 2013
    Date of Patent: November 28, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Noboru Kato, Satoshi Ishino, Takeshi Kataya, Ikuhei Kimura, Nobuo Ikemoto, Yuya Dokai
  • Patent number: 9813595
    Abstract: A camera module includes a multilayer base body including a first mounting portion, a second mounting portion, and a connecting portion. The first mounting portion and the second mounting portion are connected to the connecting portion. A connector element is arranged in the second mounting portion. The first mounting portion includes a cavity, and a penetration hole penetrating from the cavity to one surface of the first mounting portion. An image sensor IC is arranged in the cavity, and the lens unit is arranged on the one surface of the first mounting portion at a location at or near the penetration hole. Peripheral circuit components and conductor patterns are mounted to or incorporated in the first mounting portion.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: November 7, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shigeru Tago, Hirofumi Shinagawa, Jerry Hsieh, Satoshi Sasaki, Jun Sasaki, Nobuo Ikemoto, Yuki Wakabayashi
  • Patent number: 9793600
    Abstract: A wireless communication module includes a multilayer structure including a magnetic block and at least one non-magnetic layer stacked on the magnetic block, the magnetic block including at least one magnetic layer, at least one inductor element disposed at the magnetic block, and an antenna coil disposed at the non-magnetic layer so as to overlap the inductor element in a planar view along a stacking direction of the non-magnetic layer with respect to the magnetic block, wherein the magnetic layer is present between the inductor element and the antenna coil.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: October 17, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Nobuo Ikemoto
  • Patent number: 9774070
    Abstract: In a high frequency signal line, a first signal line extends along a first dielectric element assembly, a first reference ground conductor extends along the first signal line, a second signal line is provided in or on the second dielectric element assembly and extends along the second dielectric element assembly, a second reference ground conductor is provided in or on the second dielectric element assembly and extends along the second signal line. A portion of a bottom surface at an end of the first dielectric element assembly and a portion of the top surface at an end of the second dielectric element assembly are joined together such that a joint portion of the first and second dielectric element assemblies includes a corner. The second signal line and the first signal line are electrically coupled together. The first and second reference ground conductors are electrically coupled together.
    Type: Grant
    Filed: November 10, 2014
    Date of Patent: September 26, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Nobuo Ikemoto, Yuki Wakabayashi, Shigeru Tago
  • Publication number: 20170271733
    Abstract: A transmission line portion of a flat cable includes first regions and second regions connected alternately. In the first region, the transmission line portion is a flexible tri-plate transmission line including a dielectric element including a signal conductor, a first ground conductor including opening portions, and a second ground conductor which is a solidly filled conductor. In the second region, the transmission line portion is a hard tri-plate transmission line including a wide dielectric element including a meandering conductor, and a first ground conductor and a second ground conductor which are solidly filled conductors. A variation width of the characteristic impedance in the second region is larger than a variation width of the characteristic impedance in the first region.
    Type: Application
    Filed: June 6, 2017
    Publication date: September 21, 2017
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Noboru KATO, Satoshi ISHINO, Jun SASAKI, Kuniaki YOSUI, Takahiro BABA, Nobuo IKEMOTO
  • Patent number: 9761923
    Abstract: A compact wireless communication includes a first radiating element and a second radiating element, which define and function as a dipole antenna, a feeder circuit including a wireless IC chip coupled with the first and second radiating elements, and a feeder substrate that is provided with the wireless IC chip. The first radiating element is provided to the feeder substrate. The second radiating element is provided to a substrate other than the feeder substrate.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: September 12, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ikuhei Kimura, Nobuo Ikemoto
  • Patent number: 9748625
    Abstract: A transmission line portion of a flat cable includes first regions and second regions connected alternately. In the first region, the transmission line portion is a flexible tri-plate transmission line including a dielectric element including a signal conductor, a first ground conductor including opening portions, and a second ground conductor which is a solidly filled conductor. In the second region, the transmission line portion is a hard tri-plate transmission line including a wide dielectric element including a meandering conductor, and a first ground conductor and a second ground conductor which are solidly filled conductors. A variation width of the characteristic impedance in the second region is larger than a variation width of the characteristic impedance in the first region.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: August 29, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Satoshi Ishino, Jun Sasaki, Kuniaki Yosui, Takahiro Baba, Nobuo Ikemoto
  • Publication number: 20170236049
    Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.
    Type: Application
    Filed: May 5, 2017
    Publication date: August 17, 2017
    Inventors: Noboru KATO, Satoshi ISHINO, Takeshi KATAYA, Ikuhei KIMURA, Nobuo IKEMOTO, Yuya DOKAI
  • Patent number: 9727765
    Abstract: An RFID system includes an antenna of a reader/writer and an antenna of an RFID tag. Transmission and reception of a high-frequency signal of a UHF band is performed between the antenna of the reader/writer and the antenna of the RFID tag that are arranged so as to be adjacent to each other. A loop antenna including a loop conductor is used as the antenna of the reader/writer, and coil antennas including a plurality of laminated coil conductors are used as the antenna of an RFID tag. In addition, the conductor width of the loop conductor in the loop antenna is greater than the conductor widths of the coil conductors in the coil antennas.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: August 8, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Nobuo Ikemoto
  • Publication number: 20170206445
    Abstract: A wireless IC device includes a wireless IC chip arranged to process a radio signal, a power-supply circuit board that is connected to the wireless IC chip and that includes a power supply circuit including at least one coil pattern, and a radiation plate arranged to radiate a transmission signal supplied from the power-supply circuit board and/or receiving a reception signal to supply the reception signal to the power-supply circuit board. The radiation plate includes an opening provided in a portion thereof and a slit connected to the opening. When viewed in plan from the direction of the winding axis of the coil pattern, the opening in the radiation plate overlaps with an inner area of the coil pattern and the area of the inner area is approximately the same as that of opening.
    Type: Application
    Filed: April 5, 2017
    Publication date: July 20, 2017
    Inventors: Noboru KATO, Nobuo IKEMOTO
  • Patent number: 9692100
    Abstract: A flat cable includes a plurality of resin layers that are flexible and stacked together, a line conductor, and grounding conductors. The flat cable includes a triplate line in which both surfaces of the line conductor oppose the corresponding grounding conductors, and a microstrip line in which only one of the surfaces of the line conductor opposes the corresponding grounding conductor. A width of the line conductor in the microstrip line is greater than a width of the line conductor in the triplate line, and the flat cable is bent at a position where the microstrip line is provided.
    Type: Grant
    Filed: August 11, 2015
    Date of Patent: June 27, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takahiro Baba, Nobuo Ikemoto
  • Patent number: 9679240
    Abstract: An antenna device includes a multilayer body including magnetic layers or dielectric layers that are stacked, a first coil conductor that has a winding axis extending in a direction perpendicular or substantially perpendicular to a stacking direction of the multilayer body, the first coil conductor being provided in the multilayer body, and a second coil conductor that has a winding axis extending in a direction perpendicular or substantially perpendicular to the winding axis of the first coil conductor, the second coil conductor being provided in the multilayer body.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: June 13, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Nobuo Ikemoto, Kuniaki Yosui
  • Patent number: 9673502
    Abstract: A dielectric element assembly includes a plurality of dielectric layers stacked on each other in a direction of lamination and extends in an x-axis direction. A signal line is provided in the dielectric element assembly and extends in the x-axis direction. A reference ground conductor is provided on a positive side in a z-axis direction relative to the signal line. An auxiliary ground conductor is provided on a negative side in the z-axis direction relative to the signal line. Via-hole conductors connect the reference ground conductor and the auxiliary ground conductor and are provided in the dielectric element assembly on the negative side relative to the center in a y-axis direction. A portion of the signal line in a section which includes the via-hole conductors is positioned on the positive side in the y-axis direction relative to another portion of the signal line in a section which does not include the via-hole conductors.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: June 6, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Satoshi Sasaki, Nobuo Ikemoto, Shigeru Tago
  • Patent number: 9672970
    Abstract: An inductor bridge is configured to bridge-connect a first circuit and a second circuit to each other, and includes a flexible flat plate base body, a first connector at a first end portion of the base body and connected to the first circuit, a second connector at a second end portion of the base body and connected to the second circuit, and an inductor section in the base body between the first connector and the second connector. The inductor section includes conductor patterns including a plurality of layers. The inductor bridge further includes a bending portion between the inductor section and the first connector, and a slot at an inner side of the bending portion that reduces a thickness of the base body.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: June 6, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kuniaki Yosui, Noboru Kato, Nobuo Ikemoto, Naoto Ikeda, Yuki Wakabayashi
  • Patent number: 9666925
    Abstract: A main transmission line includes a substantially elongated dielectric body in which first and second substantially elongated signal conductors are disposed with a distance therebetween in a width direction. A first reference ground conductor and a first auxiliary ground conductor sandwich therebetween the first signal conductor in a thickness direction. A second reference ground conductor and a second auxiliary ground conductor sandwich therebetween the second signal conductor in the thickness direction. The second auxiliary ground conductor includes two substantially elongated conductors and a first bridge conductor, and the second auxiliary ground conductor includes two substantially elongated conductors and a second bridge conductor. The positions of the first and second bridge conductors in a lengthwise direction are different.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: May 30, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kuniaki Yosui, Nobuo Ikemoto, Shigeru Tago, Zhujun Yang, Jun Sasaki, Fumie Matsuda, Wataru Tamura
  • Publication number: 20170149111
    Abstract: A composite transmission line includes a laminated insulator including insulator layers, signal transmission lines including first and second signal transmission lines and a power transmission line. The power transmission line includes a power transmission conductor pattern along the insulator layers, and an interlayer connection conductor that interlayer-connects power transmission conductor patterns. The first signal conductor pattern of the first signal transmission line, the second signal conductor pattern of the second signal transmission line, and the power transmission conductor pattern are parallel or substantially parallel to each other on the insulator layers that are mutually different from each other. The first and second signal conductor patterns interpose a first ground conductor in the laminating direction of the insulator layers. The power transmission line is in a side portion of the first signal conductor pattern.
    Type: Application
    Filed: January 10, 2017
    Publication date: May 25, 2017
    Inventors: Kuniaki YOSUI, Naoki GOUCHI, Nobuo IKEMOTO
  • Patent number: 9652706
    Abstract: A wireless IC device includes a wireless IC chip arranged to process a radio signal, a power-supply circuit board that is connected to the wireless IC chip and that includes a power supply circuit including at least one coil pattern, and a radiation plate arranged to radiate a transmission signal supplied from the power-supply circuit board and/or receiving a reception signal to supply the reception signal to the power-supply circuit board. The radiation plate includes an opening provided in a portion thereof and a slit connected to the opening. When viewed in plan from the direction of the winding axis of the coil pattern, the opening in the radiation plate overlaps with an inner area of the coil pattern and the area of the inner area is approximately the same as that of opening.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: May 16, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Nobuo Ikemoto