Patents by Inventor Nobuo Komatsu

Nobuo Komatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10238567
    Abstract: An arm mechanism includes a first arm, which is hollow, a second arm, and a connection portion for mutually rotatably connecting the first arm and the second arm. A connection portion 15 includes a rotary shaft extending in a direction perpendicular to an axial direction of a first arm 11 and a second arm 12, a friction portion for generating a frictional force against rotation of the rotary shaft, and a biasing member which is housed in the first arm, has an end portion facing away from the rotary shaft and connected to the first arm, has an end portion facing the rotary shaft and connected to the second arm via a connection member, and generates a contraction force which is increased with an increase in angle between an axis of the second arm and an axis of the first arm by rotation of the rotary shaft.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: March 26, 2019
    Assignee: SYWIND CO., LTD.
    Inventor: Nobuo Komatsu
  • Publication number: 20190029905
    Abstract: An arm mechanism includes a first arm, which is hollow, a second arm, and a connection portion for mutually rotatably connecting the first arm and the second arm. A connection portion 15 includes a rotary shaft extending in a direction perpendicular to an axial direction of a first arm 11 and a second arm 12, a friction portion for generating a frictional force against rotation of the rotary shaft, and a biasing member which is housed in the first arm, has an end portion facing away from the rotary shaft and connected to the first arm, has an end portion facing the rotary shaft and connected to the second arm via a connection member, and generates a contraction force which is increased with an increase in angle between an axis of the second arm and an axis of the first arm by rotation of the rotary shaft.
    Type: Application
    Filed: July 28, 2017
    Publication date: January 31, 2019
    Inventor: Nobuo Komatsu
  • Patent number: 7548690
    Abstract: There is provided a shutter device which is used in a camera having two image-capturing optical systems and enables a significant reduction in the number of components. Two shutter openings are formed in a shutter base. Shutter blades and a diaphragm plate are provided forward of the shutter base. When a cam pin is reciprocally moved from the position of a start point to an intermediate position or from the intermediate position to the position of an end point, the shutter blades open and close a shutter one or more times. When the cam pin is located at any position along the way from the start position to the intermediate position, the diaphragm plate is moved to a location where small diaphragm openings correspond to the shutter openings. When the cam pin is located at any position along the way from the intermediate position to the position of the endpoint, the diaphragm plate is moved to a location where open diaphragm openings correspond to the shutter openings.
    Type: Grant
    Filed: January 11, 2007
    Date of Patent: June 16, 2009
    Assignee: Eastman Kodak Company
    Inventors: Kazunori Gomi, Nobuo Komatsu
  • Patent number: 7468846
    Abstract: The number of drive motors in a digital camera having multiple imaging optical systems is curtailed. The digital camera has a first imaging optical system and a second imaging optical system. The first imaging optical system has a zoom lens group and a focus lens. The second imaging optical system has another zoom lens group and another focus lens. The focus lens groups are actuated commonly by a focusing drive motor. The former focus lens group is moved by a gear G3 and an outer peripheral gear of a lens guide ring. The latter focus lens group is moved by a feed screw.
    Type: Grant
    Filed: January 10, 2007
    Date of Patent: December 23, 2008
    Assignee: Eastman Kodak Company
    Inventors: Kazunori Gomi, Nobuo Komatsu
  • Publication number: 20080025718
    Abstract: There is provided a shutter device which is used in a camera having two image-capturing optical systems and enables a significant reduction in the number of components. Two shutter openings are formed in a shutter base. Shutter blades and a diaphragm plate are provided forward of the shutter base. When a cam pin is reciprocally moved from the position of a start point to an intermediate position or from the intermediate position to the position of an end point, the shutter blades open and close a shutter one or more times. When the cam pin is located at any position along the way from the start position to the intermediate position, the diaphragm plate is moved to a location where small diaphragm openings correspond to the shutter openings. When the cam pin is located at any position along the way from the intermediate position to the position of the endpoint, the diaphragm plate is moved to a location where open diaphragm openings correspond to the shutter openings.
    Type: Application
    Filed: January 11, 2007
    Publication date: January 31, 2008
    Inventors: Kazunori Gomi, Nobuo Komatsu
  • Publication number: 20080018779
    Abstract: The number of drive motors in a digital camera having multiple imaging optical systems is curtailed. The digital camera has a first imaging optical system and a second imaging optical system. The first imaging optical system has a zoom lens group and a focus lens. The second imaging optical system has another zoom lens group and another focus lens. The focus lens groups are actuated commonly by a focusing drive motor. The former focus lens group is moved by a gear G3 and an outer peripheral gear of a lens guide ring. The latter focus lens group is moved by a feed screw.
    Type: Application
    Filed: January 10, 2007
    Publication date: January 24, 2008
    Inventors: Kazunori Gomi, Nobuo Komatsu
  • Patent number: 6941648
    Abstract: A method for making a printed wiring board reduced in weight by reducing the size and the thickness of a substrate in its entirety. The printed wiring board includes a rigid substrate 2, comprised of a core material 11 at least one side of which carries a land 23, and flexible substrates 3, 4, 5, and 6 comprised of core materials 33, 36 on at least one surface of which a bump 32 for electrical connection to the land 38 is formed protuberantly. The rigid substrate 2 and the flexible substrates 3 to 6 are molded as one with each other, with the interposition of an adhesive in-between, so that the land and the bump face each other.
    Type: Grant
    Filed: February 12, 2003
    Date of Patent: September 13, 2005
    Assignee: Sony Corporation
    Inventors: Kazuhiro Shimizu, Nobuo Komatsu, Soichiro Kishimoto
  • Patent number: 6930827
    Abstract: A binocular device includes two observation optical systems, an additional optical system, and a viewfinder for the additional optical system. An image-capturing unit is movable between a first image-plane position of one of the observation optical systems and an image-plane position of the additional optical system by shifting a lens-switching lever. A switch of the image-capturing unit can be turned on and off by a camera switch lever. For an observation mode using the observation optical system, the image-capturing unit is set at the image-plane position of the additional optical system. For an image-capturing mode using the observation optical system, the image-capturing unit is set at the first image-plane position such that the switch of the image-capturing unit is turned on. For image-capturing using the additional optical system, the image-capturing unit is set at the image-plane position of the additional optical system such that the switch of the image-capturing unit is turned on.
    Type: Grant
    Filed: November 23, 2004
    Date of Patent: August 16, 2005
    Assignee: Genesis Technology Co., LTD
    Inventor: Nobuo Komatsu
  • Publication number: 20050141083
    Abstract: A binocular device includes two observation optical systems, an additional optical system, and a viewfinder for the additional optical system. An image-capturing unit is movable between a first image-plane position of one of the observation optical systems and an image-plane position of the additional optical system by shifting a lens-switching lever. A switch of the image-capturing unit can be turned on and off by a camera switch lever. For an observation mode using the observation optical system, the image-capturing unit is set at the image-plane position of the additional optical system. For an image-capturing mode using the observation optical system, the image-capturing unit is set at the first image-plane position such that the switch of the image-capturing unit is turned on. For image-capturing using the additional optical system, the image-capturing unit is set at the image-plane position of the additional optical system such that the switch of the image-capturing unit is turned on.
    Type: Application
    Filed: November 23, 2004
    Publication date: June 30, 2005
    Applicant: GENESIS TECHNOLOGY CO., LTD.
    Inventor: Nobuo Komatsu
  • Patent number: 6625880
    Abstract: A multi-layer printed wiring board is manufactured by forming a wiring pattern and a component mounting portion on a first substrate. An insulating spacer, formed with a first opening, is stacked over the first substrate with the first opening in registration with the component mounting portion. A second substrate is stacked over the spacer and the resulting assembly is bonded together. A second opening, continuing to the first opening, is formed in the second substrate, exposing the component mounting portion to the outside. An LSI is mounted on the component mounting portion, the first and second openings are filled with a synthetic resin mass, and then a third substrate is stacked over the second substrate to enclose the openings.
    Type: Grant
    Filed: March 2, 2001
    Date of Patent: September 30, 2003
    Assignee: Sony Corporation
    Inventors: Yoshie Nabemoto, Nobuo Komatsu
  • Publication number: 20030116345
    Abstract: A printed wiring board reduced in weight by reducing the size and the thickness of a substrate in its entirety. The printed wiring board includes a rigid substrate 2, comprised of a core material 11 at least one side of which carries a land 23, and flexible substrates 3, 4, 5 and 6 comprised of core materials 33, 36 on at least one surface of which a bump 32 for electrical connection to the land 38 is formed protuberantly. The rigid substrate 2 and the flexible substrates 3 to 6 are molded as one with each other, with the interposition of an adhesive in-between, so that the land and the bump face each other.
    Type: Application
    Filed: February 12, 2003
    Publication date: June 26, 2003
    Inventors: Kazuhiro Shimzu, Nobuo Komatsu, Soichiro Kishimoto
  • Patent number: 6570098
    Abstract: A printed wiring board reduced in weight by reducing the size and the thickness of a substrate in its entirety. The printed wiring board includes a rigid substrate 2, comprised of a core material 11 at least one side of which carries a land 23, and flexible substrates 3, 4, 5 and 6 comprised of core materials 33, 36 on at least one surface of which a bump 32 for electrical connection to the land 38 is formed protuberantly. The rigid substrate 2 and the flexible substrates 3 to 6 are molded as one with each other, with the interposition of an adhesive in-between, so that the land and the bump face each other.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: May 27, 2003
    Assignees: Sony Corporation, Sony Chemicals Corporation
    Inventors: Kazuhiro Shimizu, Nobuo Komatsu, Soichiro Kishimoto
  • Publication number: 20010040794
    Abstract: A printed wiring board reduced in weight by reducing the size and the thickness of a substrate in its entirety. The printed wiring board includes a rigid substrate 2, comprised of a core material 11 at least one side of which carries a land 23, and flexible substrates 3, 4, 5 and 6 comprised of core materials 33, 36 on at least one surface of which a bump 32 for electrical connection to the land 38 is formed protuberantly. The rigid substrate 2 and the flexible substrates 3 to 6 are molded as one with each other, with the interposition of an adhesive in-between, so that the land and the bump face each other.
    Type: Application
    Filed: February 28, 2001
    Publication date: November 15, 2001
    Inventors: Kazuhiro Shimizu, Nobuo Komatsu, Soichiro Kishimoto
  • Publication number: 20010027605
    Abstract: A printed wiring board, in which an LSI is enclosed, is to be manufactured efficiently. To this end, a wiring pattern 17 is formed on a first substrate 11, and a component mounting portion 18 is formed in the first substrate 11. An insulating spacer 25 then is formed, in which there is formed a first opening 29 in registration with the component mounting portion 18 of the first substrate 11 for accommodating an LSI 39. A second substrate 19 is stacked on the spacer 25. The component units, thus stacked, are bonded together. A second opening 36 communicating with and continuing to the first opening 29 is formed in the second substrate 19 to expose the component mounting portion 18 to outside. The LSI 39 is mounted on the component mounting portion 18, exposed to outside, and synthetic resin 40 is charged in the first and second openings 29, 36. A third substrate 41 then is mounted for stopping the second opening 36.
    Type: Application
    Filed: March 2, 2001
    Publication date: October 11, 2001
    Inventors: Yoshie Nabemoto, Nobuo Komatsu
  • Patent number: 5591562
    Abstract: A photopolymerizable composition suitable as a solder resist and capable of forming a resist film having characteristics in no way inferior to those of the conventional heat-curable type or organic solvent developed type solder resist, with the use of water or a dilute aqueous solution which is completely innocuous and higher in safety than the aqueous alkaline solution, and a method for producing a cured coated film pattern using the photopolymerizable composition.
    Type: Grant
    Filed: October 13, 1994
    Date of Patent: January 7, 1997
    Assignee: Sony Corporation
    Inventors: Nobuo Komatsu, Ikuyo Kai, Nami Konishi, Naozumi Iwasawa, Satoru Furusawa
  • Patent number: 5424793
    Abstract: A camera viewfinder optical system is interlockingly connected with a rotatable cam ring used to zoom a camera lens barrel system unit forwardly in an optical axial direction thus eliminating a bulky cam portion on the outer surface of the cam ring so a more compact zoom lens barrel unit is possible.
    Type: Grant
    Filed: April 6, 1994
    Date of Patent: June 13, 1995
    Assignee: Chinon Kabushiki Kaisha
    Inventors: Mitsuru Fukushima, Noriyoshi Fujimori, Nobuo Komatsu
  • Patent number: 5404189
    Abstract: The viewfinder of a camera include one or more lens elements that zoom in coordination with the camera's taking lens, and normal/panoramic masking plates that pivot about horizontal axis in coordination, with moving masking plates for the camera's back frame opening or with signaling elements. Since the panoramic masking plates are not in the image plane, the aperture in a provided aperture plate is a horizontal slit opening, which provides a great depth of focus, to maintain image sharpness, when the masking plates are in the panoramic position.
    Type: Grant
    Filed: November 30, 1993
    Date of Patent: April 4, 1995
    Assignee: Eastman Kodak Company
    Inventors: Peter Labaziewicz, Nobuo Komatsu
  • Patent number: 5402314
    Abstract: A printed circuit board having a through-hole in a land is disclosed. A solder resist of a photo-curable solder resist is formed on the substrate surface of the printed circuit board and the through-hole is stopped with the same photo-curable solder resist as the solder resist layer. If a land on which a chip component is mounted co-exists with a land on which a discrete component is mounted, only the through-hole in the land on which the chip component is mounted is selectively stopped with the photo-curable solder resist. The solder resist layer and the photo-curable solder resist stopping the through-hole are formed by selective light exposure from both the front and reverse surfaces of the substrate.
    Type: Grant
    Filed: February 3, 1993
    Date of Patent: March 28, 1995
    Assignee: Sony Corporation
    Inventors: Hirohisa Amago, Seimi Ishii, Nobuo Komatsu, Nobuyuki Yasuda
  • Patent number: 5329329
    Abstract: A lens barrel unit for a zoom lens camera which is more compact in the axial optical direction in the retracted state because the lens group moving means and linear movement guiding means are juxtaposed along the optical axis. The lens barrel unit also has a reduced outer diameter due to a reduction in the need for a separate outer helicoid portion of the moving means and elimination of guiding grooves on the inside of the fixed barrel unit.
    Type: Grant
    Filed: March 30, 1992
    Date of Patent: July 12, 1994
    Assignee: Chinon Kabushiki Kaisha
    Inventors: Mitsuru Fukushima, Noriyoshi Fujimori, Nobuo Komatsu
  • Patent number: 5261717
    Abstract: An apparatus for preventing the driver of a vehicle from being blinded by the glare of light by selectively moving a light-shielding plate in two-dimensions along an inside surface of the windshield to provide a light-shielding region. The light-shielding plate is controllably moved by hand or by motor. More preferably, the apparatus further includes a microcomputer for obtaining the crossing point between light coming into the eye of the driver and the windshield plate, and a mechanism or circuit for moving the light-shielding plate to a shielding position defined by the microcomputer.
    Type: Grant
    Filed: July 27, 1992
    Date of Patent: November 16, 1993
    Inventors: Toshihiro Tsumura, Nobuo Komatsu