Abstract: It is an object of this invention to prevent a deposited film from adhering to an exhaust chamber so as to suppress the generation of particles. A sputtering apparatus (1) includes a shutter accommodation unit (23) which is detachably placed in an exhaust chamber (8) and accommodates a shutter (19) in a retracted state, and shield members (40a, 40b) which at least partially cover the exhaust port of the exhaust chamber (8), and are at least partially formed around an opening portion of the shutter accommodation unit (23).

Abstract: This invention provides a sputtering method which can generate an electric discharge under practical conditions and maintain the pressure in a plasma space uniform, and a sputtering apparatus used for the same. The sputtering method includes a first gas introduction step (step S403) of introducing a process gas from a first gas introduction port formed in a sputtering space defined by a deposition shield plate, a substrate holder, and the target which are disposed in a process chamber, a voltage application step (step S407) of applying a voltage to the target after the first gas introduction step, and a second gas introduction step (step S405) of introducing a process gas from a second gas introduction port formed outside the sputtering space.

Abstract: The present invention provides a sputtering apparatus that can efficiently laminate thin films in a short time without lowering throughputs, and a manufacturing method of an electronic device. The sputtering apparatus according to an embodiment of the present invention includes a rotatable substrate holder, four target holders obliquely arranged with respect to the substrate holder, and a first shutter and a second shutter that each are provided between the target holders and the substrate holder and have two holes arranged two-fold symmetrical with respect to a rotational axis X. Two of the four target holders are first group target holders arranged two-fold symmetrical with respect to the rotational axis X, and the other two target holders are second group target holders arranged between the first group target holders and two-fold symmetrical with respect to the rotational axis X.

Abstract: A reactive sputtering apparatus includes a chamber, a substrate holder provided in the chamber, a target holder which is provided in the chamber and configured to hold a target, a deposition shield plate which is provided in the chamber so as to form a sputtering space between the target holder and the substrate holder, and prevents a sputter particle from adhering to an inner wall of the chamber, a reactive gas introduction pipe configured to introduce a reactive gas into the sputtering space, an inert gas introduction port which introduces an inert gas into a space that falls outside the sputtering space and within the chamber, and a shielding member which prevents a sputter particle from the target mounted on the target holder from adhering to an introduction port of the reactive gas introduction pipe upon sputtering.

Abstract: A sputtering apparatus includes a target holder which is placed in a vacuum vessel and can hold a target configured to deposit a film on a substrate, a substrate holder which can mount the substrate, a first shield member which is disposed in a vicinity of the substrate holder, and configured to form a closed state in which the substrate holder and the target holder are shielded from each other, or an open state in which the substrate holder and the target holder are opened to each other, a first opening/closing driving unit adapted to open/close the first shield member to enter the open state or the closed state, a second shield member, having an annular-shaped, disposed on the surface of the substrate holder and an outer peripheral portion of the substrate, and a driving unit adapted to move the substrate holder in order to bring the substrate holder, on which the second shield member is disposed, close to the first shield member in the closed state.

Abstract: The present invention provides a mask alignment mechanism which reduces the occurrence of particles and which aligns a mask with high accuracy, and a vacuum processing apparatus including such a mask alignment mechanism. A mask alignment mechanism according to one embodiment of the present invention includes a substrate holder which is movable up and down when a substrate is transferred and on which four taper pins are formed, and a mask in which grooves are formed. The taper pins can be inserted into the grooves, respectively. The taper pins include a pair of long taper pins and a pair of short taper pins. The taper pins in each pair are disposed to face each other across the substrate. Tapered surfaces formed in the long taper pins and tapered surfaces formed in the short taper pins are located at different heights.

Abstract: Disclosed is a sputtering device wherein a target (2) is disposed offset with respect to a substrate (7), wherein said sputtering device can ensure a uniform amount of deposition, even when a substrate support holder (6) has a low number of rotations of several rotations to several tens of rotations, and the amount of deposition is extremely small, such as a film thickness of 1 nm or less.

Abstract: The invention provides a method of manufacturing a semiconductor device and a sputtering apparatus which improve the composition of a film formed by a metal and a reactive gas without increasing the number of steps. An embodiment includes the steps of: placing a substrate on a substrate holder in a process chamber; and sputtering a target in the process chamber by applying electric power thereto while feeding a first reactive gas and a second reactive gas having higher reactivity than that of the first reactive gas into the process chamber, to form a film containing a target material on the substrate. The step of forming a film is conducted by feeding at least the first reactive gas from a first gas feed opening formed near the target, and by feeding the second reactive gas from a second gas feed opening formed at a position with the distance from the target larger than that of the first gas feed opening.

Abstract: A sputtering film forming method. which positions a target 4 and 5 at an incline to a surface of a substrate 10 whereupon a film is to be formed, and forms the film upon the surface of the substrate 10 whereupon the film is to be formed in an incline direction while the substrate 10 is rotated about a normal axis, terminates the forming of the film at a predetermined timing from the commencement of the forming of the film, wherein the forming of the film is terminated, when the substrate has rotated by 360 degrees×n+180 degrees+?, where n is a natural number, including 0, and ?10 degrees<?<10 degrees.

Abstract: A sputtering apparatus includes a target holder which is placed in a vacuum vessel and can hold a target configured to deposit a film on a substrate, a substrate holder which can mount the substrate, a first shield member which is disposed in a vicinity of the substrate holder, and configured to form a closed state in which the substrate holder and the target holder are shielded from each other, or an open state in which the substrate holder and the target holder are opened to each other, a first opening/closing driving unit adapted to open/close the first shield member to enter the open state or the closed state, a second shield member, having an annular-shaped, disposed on the surface of the substrate holder and an outer peripheral portion of the substrate, and a driving unit adapted to move the substrate holder in order to bring the substrate holder, on which the second shield member is disposed, close to the first shield member in the closed state.

Abstract: A deposition apparatus includes a shutter storage unit which is connected to a processing chamber via an opening and stores a shutter in the retracted state into an exhaust chamber, and a shield member which is formed around the opening of the shutter storage unit and covers the exhaust port of the exhaust chamber. The shield member has, at a position of a predetermined height between the opening of the shutter storage unit and a deposition unit, the first exhaust path which communicates with the exhaust port of the exhaust chamber.

Abstract: A sputtering film forming method. which positions a target 4 and 5 at an incline to a surface of a substrate 10 whereupon a film is to be formed, and forms the film upon the surface of the substrate 10 whereupon the film is to be formed in an incline direction while the substrate 10 is rotated about a normal axis, terminates the forming of the film at a predetermined timing from the commencement of the forming of the film, wherein the forming of the film is terminated, when the substrate has rotated by 360 degrees×n+180 degrees+?, where n is a natural number, including 0, and ?10 degrees<?<10 degrees.

Abstract: In a vehicle including a plurality of containing portions, namely, a front containing portion provided in an inner cover covering from the rear side a head pipe of a vehicle body frame at its front end and constituting a part of a vehicle body cover which can be locked in a fully closed condition, to facilitate the operation for releasing the lock conditions of the plurality of containing portions. A plurality of lock release operating buttons for respectively releasing the locked conditions of a plurality of containing portions inclusive of a front containing portion is disposed at an inner cover on a lateral side of the front containing portion.

Abstract: In a vehicle wherein a functional part arranged in a body cover is supported by a body frame and a lid which makes it possible to lock a closed state covering the functional part can be openably fitted to the body cover in a position matching the functional part. Thus, the risk of undesirable tampering with the unlocking member is to be minimized and the risk for the unlocking member to be influenced by external disturbance such as unfavorable weather is to be avoided as far as possible. A cover member in which a lid is arranged in a secluded position is openably disposed on a body cover, and an unlocking member for releasing the lid from the locked state is disposed on the body cover so as to be covered by a cover member in a closed state.

Abstract: In a vehicle wherein a functional part arranged in a body cover is supported by a body frame and a lid which makes it possible to lock a closed state covering the functional part can be openably fitted to the body cover in a position matching the functional part. Thus, the risk of undesirable tampering with the unlocking member is to be minimized and the risk for the unlocking member to be influenced by external disturbance such as unfavorable weather is to be avoided as far as possible. A cover member in which a lid is arranged in a secluded position is openably disposed on a body cover, and an unlocking member for releasing the lid from the locked state is disposed on the body cover so as to be covered by a cover member in a closed state.

Abstract: Electrostatic attraction is performed on a plate-shaped object 9 in that an attraction power source 3 applies a voltage to a pair of attraction terminals 23, 24 mounted inside a dielectric block 22, the surface of which is an attraction surface, thereby inducing static electricity in an attraction surface. The attraction power source 3 adjusts the surface potential of a plate-shaped object 9 by independently controlling voltages applied to the respective attraction terminals 23, 24. Processing is carried out on the surface of the plate-shaped object 9 while the injection of charged particles into the plate-shaped object 9 is suppressed. A control part 6 which controls the attraction power source 3 records, in a recording part 62, data obtained by measuring in advance the surface potential of the plate-shaped object 9 while respectively changing the voltage applied to the attraction terminals 23, 24, and controls the attraction power source 3 with a pattern selected in accordance with this data.

Abstract: In a vehicle including a plurality of containing portions, namely, a front containing portion provided in an inner cover covering from the rear side a head pipe of a vehicle body frame at its front end and constituting a part of a vehicle body cover which can be locked in a fully closed condition, to facilitate the operation for releasing the lock conditions of the plurality of containing portions. A plurality of lock release operating buttons for respectively releasing the locked conditions of a plurality of containing portions inclusive of a front containing portion is disposed at an inner cover on a lateral side of the front containing portion.

Abstract: Electrostatic attraction is performed on a plate-shaped object 9 in that an attraction power source 3 applies a voltage to a pair of attraction terminals 23, 24 mounted inside a dielectric block 22, the surface of which is an attraction surface, thereby inducing static electricity in an attraction surface. The attraction power source 3 adjusts the surface potential of a plate-shaped object 9 by independently controlling voltages applied to the respective attraction terminals 23, 24. Processing is carried out on the surface of the plate-shaped object 9 while the injection of charged particles into the plate-shaped object 9 is suppressed. A control part 6 which controls the attraction power source 3 records, in a recording part 62, data obtained by measuring in advance the surface potential of the plate-shaped object 9 while respectively changing the voltage applied to the attraction terminals 23, 24, and controls the attraction power source 3 with a pattern selected in accordance with this data.