Abstract: A workpiece such as a semiconductor wafer is polished by pressing the workpiece against a polishing surface under a predetermined pressure. A polished surface of the workpiece is processed by pressing the workpiece against a processing surface under a predetermined pressure while the processing surface makes circulatory translational motion along a predetermined path. The processing surface comprises a surface of a polishing cloth or a surface of an abrading plate, and the polished surface of the workpiece is further polished or cleaned.

Abstract: A workpiece such as a semiconductor wafer is polished by pressing the workpiece against a polishing surface under a predetermined pressure. A polished surface of the workpiece is processed by pressing the workpiece against a processing surface under a predetermined pressure while the processing surface makes circulatory translational motion along a predetermined path. The processing surface comprises a surface of a polishing cloth or a surface of an abrading plate, and the polished surface of the workpiece is further polished or cleaned.

Abstract: A workpiece such as a semiconductor wafer is polished by pressing the workpiece against a polishing surface under a predetermined pressure. A polished surface of the workpiece is processed by pressing the workpiece against a processing surface under a predetermined pressure while the processing surface makes circulatory translational motion along a predetermined path. The processing surface comprises a surface of a polishing cloth or a surface of an abrading plate, and the polished surface of the workpiece is further polished or cleaned.

Abstract: The polishing apparatus can control the attitude of the top ring with respect to a surface of a turntable of a polishing apparatus is controlled so as to provide a uniform polish surface pressure across the entire polish surface. The polishing apparatus includes the turntable having an abrading surface, a top ring for holding an object to be polished to keep the object surface in moving contact with the abrading surface while rotating the turntable and the top ring, a magnetic bearing assembly for supporting a rotation shaft of the top ring by means of a thrust bearing device and at least one radial bearing device, and an attitude controller for controlling an orientation of the top ring with respect to the turntable through the magnetic bearing assembly.

Abstract: The cleaning apparatus of the present invention comprises a cleaning member 105 adapted to be rotated while maintaining contact with a surface of a semiconductor wafer W, to thereby clean the surface of the semiconductor wafer W, and a drive motor 50 for rotating the cleaning member 105. A linear bushing 75 and coil springs 81 are provided between the cleaning member 105 and the drive motor 50. The linear bushing 75 ensures that the cleaning member 105 is capable of slidably moving in a direction of an axis of rotation. The coil springs 81 ensure that the cleaning member 105 applies a predetermined pressure to the semiconductor wafer W. A pressure in a casing 1 [(1-1), (1-2) and (1-3)] is set to a negative pressure relative to an outside air pressure by suction through a pipe 111.

Abstract: A polishing method and a compact apparatus for the method are presented for efficient production of a polished workpiece for manufacturing high technology devices. The polishing method comprises a first and second steps for polishing a work surface. In the first polishing step, the work surface is pressed against an abrading surface of a first polishing tool which is being rotated. In the second step, the work surface is pressed against a rubbing surface of a second polishing tool which is being moved in a planar translation motion relatively to the work surface.

Abstract: A conditioner assembly for a polishing machine includes a carrier, a conditioning element attached to the carrier, and an elastic element arranged between the conditioning element and the carrier. The conditioner assembly improves the polishing uniformity across the surface of a workpiece.

Abstract: The polishing apparatus can control the attitude of the top ring with respect to a surface of a turntable of a polishing apparatus is controlled so as to provide a uniform polish surface pressure across the entire polish surface. The polishing apparatus includes the turntable having an abrading surface, a top ring for holding an object to be polished to keep the object surface in moving contact with the abrading surface while rotating the turntable and the top ring, a magnetic bearing assembly for supporting a rotation shaft of the top ring by means of a thrust bearing device and at least one radial bearing device, and an attitude controller for controlling an orientation of the top ring with respect to the turntable through the magnetic bearing assembly.

Abstract: A polishing apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish includes a rotary drum provided on a surface thereof with a polishing pad. A stand supports the workpiece to be polished. A controlling device controls reciprocation of the drum and rotation of the workpiece to obtain a relationship:V/.omega.>Lin which V represents velocity of reciprocation of the drum reciprocating on the workpiece to polish an entire surface of the workpiece, .omega. represents rotational angular velocity of the workpiece, and L represents a distance from the rotational center of the workpiece to a radially outermost point on the workpiece.

Abstract: A drum-type polishing apparatus for producing a flat mirror polish on an object such as a semiconductor wafer, is capable of three degrees of freedom of movement of a drum member with respect to the wafer. The relative movements can be made, successively or simultaneously, at right angles to an axis of the drum, parallel to the surface of the wafer, as well as at any desired angular orientations. Combined with a follower device to provide automatic compensation for unevenness in pressing pressure applied to the wafer during polishing, the polishing apparatus offers outstanding uniformity in polishing quality and high productivity, even for large diameter wafers, with a comparatively modest investment in both facility space and equipment cost.

Abstract: To provide a screw vacuum pump which is compact and yet capable of attaining a high degree of vacuum. A screw vacuum pump having a pair of male and female rotors 7 and 7A rotating in mesh with each other around two parallel axes, respectively, and a casing 1 for accommodating the two rotors 7 and 7A, the casing 1 having a suction port 8b and a discharge port 9b, the screw vacuum pump further having a process of sucking a gas from the suction port 8b into a space defined between the rotors 7 and 7A, a process of transferring the gas, a process of compressing the gas, and a process of discharging the gas from the discharge port 9b, wherein the suction port 8b is closed early, thereby providing an expansion process between the suction and transfer processes.

Abstract: A screw vacuum pump is designed so that it is possible to reduce the load on the pump at the time of starting and evacuation of a gas under atmospheric pressure. The screw vacuum pump has male and female rotors rotating in mesh with each other around two parallel axes, respectively, and a casing for accommodating the rotors, the casing having a suction port and a discharge port, wherein the discharge port is formed so that V.sub.1 /V.sub.2 is in the range of 1.5 to 0.51, where V.sub.1 is a groove volume defined by the casing and the male and female rotors immediately after a gas has been trapped, and V.sub.2 is a groove volume immediately before the gas is discharged.

Abstract: A gas rotary machine of a type which is driven by a driving system with two parallel axes wherein a pinion shaft supporting a pinion is made as a flexible shaft and damper bearings including ball/roller bearings are employed to support the flexible shaft so that the whole machine is kept compact and the power required therefor is reduced.