Patents by Inventor Nobuyuki Hayashi

Nobuyuki Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150184949
    Abstract: A cooling device includes: an evaporator that vaporizes a part of a refrigerant by heat generated by an electronic component; a condenser that cools the refrigerant; a refrigerant circulation loop coupled to the evaporator and the condenser, an inside of the refrigerant circulation loop is depressurized; and a pump that circulates the refrigerant, wherein a filling ratio of the liquid refrigerant to a volume of the refrigerant circulation loop is 50% or more.
    Type: Application
    Filed: December 16, 2014
    Publication date: July 2, 2015
    Inventors: Tsuyoshi So, Hideo Kubo, Osamu Aizawa, Nobuyuki HAYASHI, TERU NAKANISHI, Yoshinori Uzuka, Nobumitsu Aoki
  • Publication number: 20150168272
    Abstract: A sampling jig that samples a coating formed on a substrate includes a sampler that has a convex sampling surface with a predetermined curvature, wherein the sampling surface has a contact surface that contacts the coating to hold a sampled coating and a recess formed on the contact surface, wherein a surface area of the contact surface is greater than a surface area of the recess, and wherein a hardness of the sampler is higher than a hardness of the coating.
    Type: Application
    Filed: February 24, 2015
    Publication date: June 18, 2015
    Applicant: FUJITSU LIMITED
    Inventors: Michiko NOGUCHI, Mitsuo OZAKI, Nobuyuki HAYASHI
  • Patent number: 9002232
    Abstract: An image forming apparatus includes an image bearing member, a conductive member, a bias application device, and a control portion. The image bearing member has a photosensitive layer formed on an outer peripheral surface thereof. The conductive member is disposed so as to make contact with an inner peripheral surface of the image bearing member and has a dielectric property. The bias application device applies a bias including an alternating current bias to the conductive member. The control portion controls the bias application device. The image forming apparatus is capable of executing a heating-up mode in which an alternating current bias having a peak-to-peak value twice or more as large as a discharge start voltage between the conductive member and the image bearing member is applied to the conductive member to cause the surface of the image bearing member to be heated up.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: April 7, 2015
    Assignee: KYOCERA Document Solutions Inc.
    Inventors: Shigeki Tsukahara, Takahiko Murata, Ai Takagami, Koichi Hayashi, Nobuyuki Hayashi, Yosuke Saito, Maki Ike, Masaki Kadota
  • Patent number: 8971737
    Abstract: An image forming apparatus includes an image bearing member, a first conductive member, a bias application device, and a control portion, and performs image formation on a surface of the image bearing member while making the image bearing member rotate. The image forming apparatus is capable of executing a heating-up mode in which, at the time of non-image formation, in a state where the image bearing member is made to rotate at a velocity lower than that used at the time of image formation, an alternating current bias having a frequency higher than that used at the time of image formation and a peak-to-peak value twice or more as large as a discharge start voltage between the first conductive member and the image bearing member is applied to the first conductive member to cause a surface of the image bearing member to be heated up.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: March 3, 2015
    Assignee: Kyocera Document Solutions Inc.
    Inventors: Nobuyuki Hayashi, Koichi Hayashi, Shigeki Tsukahara, Takahiko Murata, Ai Takagami, Yosuke Saito, Maki Ike, Masaki Kadota
  • Patent number: 8964402
    Abstract: An electronic device includes a wiring board including a first electrode and a second electrode, a semiconductor device mounted on the wiring board and including a first terminal and a second terminal, an interposer provided between the wiring board and the semiconductor device, the interposer including a conductive pad and a sheet supporting the conductive pad, the conductive pad having a first surface on a side of the wiring board and a second surface on a side of the semiconductor device, a first solder connecting the first electrode positioned outside of an area in which the interposer is disposed with the first terminal positioned outside of the area, a second solder connecting the second electrode positioned inside of the area with the first surface of the conductive pad, and a third solder connecting the second terminal positioned inside of the area with the second surface of the conductive pad.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: February 24, 2015
    Assignee: Fujitsu Limited
    Inventors: Teru Nakanishi, Nobuyuki Hayashi, Masaru Morita, Yasuhiro Yoneda
  • Publication number: 20150005257
    Abstract: An arylalkyloxypyrimidine derivative represented by the formula (I) wherein R1 is an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, a haloalkyl group, a haloalkenyl group, a haloalkynyl group, an alkoxyalkyl group, a dioxolane group and the like; R2 and R3 are each a hydrogen atom, an alkyl group and the like; X is an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, a haloalkyl group, a haloalkenyl group, a haloalkynyl group, a trialkylsilyl group and the like; Y is CH or a nitrogen atom; q is an integer of 1 to 3; m is an integer of 0 to 5; and n is 0 or 1 or a salt thereof, and an agrohorticultural insecticide containing the compound as an active ingredient and a method of use thereof.
    Type: Application
    Filed: February 1, 2013
    Publication date: January 1, 2015
    Applicant: NIHON NOHYAKU CO. OLTD.
    Inventors: Eikou Satoh, Tetsuya Murata, Hiroto Harayama, Motofumi Nakano, Kosuke Fukatsu, Kayo Inukai, Ryota Kasahara, Yutaka Abe, Nobuyuki Hayashi, Naoya Fujita
  • Publication number: 20140308053
    Abstract: An image forming apparatus includes an image bearing member, a conductive member, a bias application device, and a control portion. The image bearing member has a photosensitive layer formed on an outer peripheral surface thereof. The conductive member is disposed so as to make contact with an inner peripheral surface of the image bearing member and has a dielectric property. The bias application device applies a bias including an alternating current bias to the conductive member. The control portion controls the bias application device. The image forming apparatus is capable of executing a heating-up mode in which an alternating current bias having a peak-to-peak value twice or more as large as a discharge start voltage between the conductive member and the image bearing member is applied to the conductive member to cause the surface of the image bearing member to be heated up.
    Type: Application
    Filed: March 28, 2014
    Publication date: October 16, 2014
    Applicant: KYOCERA DOCUMENT SOLUTIONS INC.
    Inventors: Shigeki TSUKAHARA, Takahiko MURATA, Ai TAKAGAMI, Koichi HAYASHI, Nobuyuki HAYASHI, Yosuke SAITO, Maki IKE, Masaki KADOTA
  • Publication number: 20140294410
    Abstract: An image forming apparatus includes an image bearing member, a first conductive member, a bias application device, and a control portion, and performs image formation on a surface of the image bearing member while making the image bearing member rotate. The image forming apparatus is capable of executing a heating-up mode in which, at the time of non-image formation, in a state where the image bearing member is made to rotate at a velocity lower than that used at the time of image formation, an alternating current bias having a frequency higher than that used at the time of image formation and a peak-to-peak value twice or more as large as a discharge start voltage between the first conductive member and the image bearing member is applied to the first conductive member to cause a surface of the image bearing member to be heated up.
    Type: Application
    Filed: February 24, 2014
    Publication date: October 2, 2014
    Applicant: KYOCERA DOCUMENT SOLUTIONS INC.
    Inventors: Nobuyuki HAYASHI, Koichi HAYASHI, Shigeki TSUKAHARA, Takahiko MURATA, Ai TAKAGAMI, Yosuke SAITO, Maki IKE, Masaki KADOTA
  • Publication number: 20140294409
    Abstract: An image forming apparatus has an image carrying body, a first electrically conductive member, a bias application device, and a controller. The first electrically conductive member makes contact with the photosensitive layer of the image carrying body The bias application device applies a bias containing an AC bias to the first electrically conductive member. The controller controls the bias application device. The image forming apparatus can execute, while no image formation is being performed, a temperature raising mode in which, with the first electrically conductive member in contact with the image carrying body outside the image formation region, an AC bias having a peak-to-peak value twice as high as the discharge start voltage between the first electrically conductive member and the image carrying body is applied to the first electrically conductive member to raise the temperature of the surface of the image carrying body.
    Type: Application
    Filed: February 7, 2014
    Publication date: October 2, 2014
    Applicant: KYOCERA Document Solutions Inc.
    Inventors: Takahiko MURATA, Shigeki TSUKAHARA, Ai TAKAGAMI, Koichi HAYASHI, Nobuyuki HAYASHI, Yosuke SAITO, Maki IKE, Masaki KADOTA
  • Publication number: 20140137121
    Abstract: In the prior art, the number of jobs that can be executed in parallel in a parallel computer is restricted by the types of licenses capable of being used or the number of licenses, and if there is insufficiency in licenses, a new job cannot be executed until already entered jobs in execution are completed. In order to solve the problems of the prior art, the present invention is designed to release a resource of a job having a low priority when license is insufficient when a job is entered, and the released resource is allocated to a job having a high priority so as to enable the job having a high priority to be executed, according to which the efficiency of use of resources is enhanced.
    Type: Application
    Filed: October 5, 2012
    Publication date: May 15, 2014
    Applicant: HITACHI, LTD.
    Inventors: Keita Asakura, Nobuyuki Hayashi
  • Publication number: 20130232802
    Abstract: To provide a measuring instrument having improved usability and viewability. A measuring instrument includes a touch panel display unit that receives an external input performed by physical contact and has a display function. In the touch panel display unit, a plurality of operation icons that are used to perform a complicated input operation as well as a measurement result are displayed. It is possible to provide a measuring instrument that is superior in terms of the usability and viewability. For example, a measurement mode can be selected by selecting and touching one of the plurality of operation icons displayed in the touch panel display unit.
    Type: Application
    Filed: February 13, 2013
    Publication date: September 12, 2013
    Applicant: MITUTOYO CORPORATION
    Inventors: Nobuyuki HAYASHI, Yoshiaki SHIRAISHI
  • Patent number: 8508031
    Abstract: An electronic device includes a wiring board; a semiconductor device arranged at an upper side of the wiring board with an electrically conductive member being arranged therebetween; a covering member arranged at an upper side of the semiconductor device; and a supporting member arranged at a lower side of the wiring board, the supporting member having a convex portion facing the wiring board, the supporting member being connected to the covering member and supporting the wiring board at the convex portion.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: August 13, 2013
    Assignee: Fujitsu Limited
    Inventors: Nobuyuki Hayashi, Yasuhiro Yoneda, Teru Nakanishi, Masaru Morita
  • Patent number: 8472195
    Abstract: An electronic device includes an electronic component mounted on a substrate; a cooling system for cooling the electronic component; and a fastening structure for fastening the cooling system to the substrate. The fastening structure includes a first magnet provided to one of the substrate and the cooling system, a second magnetic material fixed to the other of the substrate and the cooling system and magnetically coupled with the first magnet, and a magnetic shield that covers a part or all of the first magnet except for a coupling face to be coupled with the second magnetic material.
    Type: Grant
    Filed: May 9, 2011
    Date of Patent: June 25, 2013
    Assignee: Fujitsu Limited
    Inventors: Teru Nakanishi, Nobuyuki Hayashi, Masaru Morita, Katsusada Motoyoshi, Yasuhiro Yoneda
  • Publication number: 20130055579
    Abstract: A measuring instrument includes a display that displays measurements. The display is provided by an organic electroluminescent display device or an electronic paper including an assembly of organic EL (Electro-Luminescence) devices. Since the display is provided by the organic electroluminescent display device or an electronic paper including an assembly of organic electroluminescence devices, visibility of the display can be enhanced. Further, since the display can be used for various measuring instruments in common and the display design can be easily changed, production cost can be reduced.
    Type: Application
    Filed: September 4, 2012
    Publication date: March 7, 2013
    Applicant: MITUTOYO CORPORATION
    Inventors: Nobuyuki HAYASHI, Yoshiaki SHIRAISHI, Shuji HAYASHIDA, Takefumi KIWADA
  • Publication number: 20120176759
    Abstract: An electronic device includes a wiring board including a first electrode and a second electrode, a semiconductor device mounted on the wiring board and including a first terminal and a second terminal, an interposer provided between the wiring board and the semiconductor device, the interposer including a conductive pad and a sheet supporting the conductive pad, the conductive pad having a first surface on a side of the wiring board and a second surface on a side of the semiconductor device, a first solder connecting the first electrode positioned outside of an area in which the interposer is disposed with the first terminal positioned outside of the area, a second solder connecting the second electrode positioned inside of the area with the first surface of the conductive pad, and a third solder connecting the second terminal positioned inside of the area with the second surface of the conductive pad.
    Type: Application
    Filed: December 20, 2011
    Publication date: July 12, 2012
    Applicant: FUJITSU LIMITED
    Inventors: Teru NAKANISHI, Nobuyuki Hayashi, Masaru Morita, Yasuhiro Yoneda
  • Publication number: 20120014068
    Abstract: An electronic device includes an electronic component mounted on a substrate; a cooling system for cooling the electronic component; and a fastening structure for fastening the cooling system to the substrate. The fastening structure includes a first magnet provided to one of the substrate and the cooling system, a second magnetic material fixed to the other of the substrate and the cooling system and magnetically coupled with the first magnet, and a magnetic shield that covers a part or all of the first magnet except for a coupling face to be coupled with the second magnetic material.
    Type: Application
    Filed: May 9, 2011
    Publication date: January 19, 2012
    Applicant: FUJITSU LIMITED
    Inventors: Teru NAKANISHI, Nobuyuki HAYASHI, Masaru MORITA, Katsusada MOTOYOSHI, Yasuhiro YONEDA
  • Publication number: 20110299255
    Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.
    Type: Application
    Filed: August 18, 2011
    Publication date: December 8, 2011
    Applicant: FUJITSU LIMITED
    Inventors: Teru NAKANISHI, Nobuyuki HAYASHI, Masaru MORITA, Yasuhiro YONEDA
  • Publication number: 20110147918
    Abstract: An electronic device includes a wiring board; a semiconductor device arranged at an upper side of the wiring board with an electrically conductive member being arranged therebetween; a covering member arranged at an upper side of the semiconductor device; and a supporting member arranged at a lower side of the wiring board, the supporting member having a convex portion facing the wiring board, the supporting member being connected to the covering member and supporting the wiring board at the convex portion.
    Type: Application
    Filed: October 19, 2010
    Publication date: June 23, 2011
    Applicant: FUJITSU LIMITED
    Inventors: Nobuyuki Hayashi, Yasuhiro Yoneda, Teru Nakanishi, Masaru Morita
  • Publication number: 20110063812
    Abstract: An electronic device includes a circuit board having a first electrode formed on a main surface thereof, a semiconductor device disposed toward the main surface of the circuit board, the semiconductor device having a second electrode formed on a surface thereof opposed to the main surface, and a connection member electrically connecting between the first and second electrodes. The connection member includes a hollow cylindrical member and a conductive member disposed within the hollow cylindrical member.
    Type: Application
    Filed: August 10, 2010
    Publication date: March 17, 2011
    Applicant: FUJITSU LIMITED
    Inventors: Teru NAKANISHI, Nobuyuki Hayashi, Masaru Morita, Yasuhiro Yoneda
  • Patent number: 7877894
    Abstract: A digital displacement measuring instrument includes a spindle screwed into a body to be axially advanced and retracted relative to the body; and an encoder that detects a displacement of the spindle. The encoder includes a rotor and a stator. The rotor is supported by a rotor bushing. The rotor bushing includes an engaging key engageable with a key groove axially provided on the outer circumference of the spindle, and is displaceable in the axial direction of the spindle via a position adjusting screw. The stator is fixed to the body via a stator bushing in the vicinity of the spindle so as not to be displaceable in the axial direction of the spindle.
    Type: Grant
    Filed: July 29, 2009
    Date of Patent: February 1, 2011
    Assignee: Mitutoyo Corporation
    Inventors: Shuji Hayashida, Nobuyuki Hayashi, Shozaburo Tsuji, Yasuhiro Tsujimoto, Masahiko Tachikake, Yuji Fujikawa, Takashi Komori, Junji Masui