Abstract: An object of the present invention is to provide a primer set, which can accurately, rapidly and simply identify yeast species of genus Saccharomyces. According to the present invention, there is provided a primer set for use in the detection of the yeast species of genus Saccharomyces, which comprises primers selected from the group consisting of the polynucleotides having the base sequences of SEQ ID NOS: 1 to 17 or 23 to 30, or the homologous polynucleotides thereof.

Abstract: A measuring instrument includes a detector that outputs a measured value, a digital display unit, an analog display unit having a plurality of display segments, and a display controller. The display controller includes: a tolerance range display unit that lights or blinks display segments corresponding to a preset tolerance range relative to a preset value; a first determiner that obtains a difference between the present value and a present measured value and determines whether the difference is within an analog display range wider than the tolerance range; a difference display unit that lights a display segment corresponding to the last one or the last two digits of the present measured value when the first determiner determines that the difference is within the analog display range; a second determiner that determines whether the difference is within the tolerance range; and an acceptance or rejection display unit that displays a result determined by the second determiner.

Abstract: A method of preparing a yeast usable in a fermentation test for evaluating malt on the laboratory scale whereby more reproducible test data can be obtained regardless of the operation conditions of a plant, etc.; and a medium to be used therein. A yeast for the fermentation test for evaluating malt is prepared by culturing a yeast in a liquid medium containing 0 to 2.5% by weight of glucose, 6.0 to 9.0% by weight of maltose, 0 to 2.5% by weight of sorbitol, 0 to 1.0% by weight of peptone and 0.3 to 1.0% by weight of yeast extract at 10 to 20° C. for 2 to 4 days under shaking (primary culture), then in the medium in an increased amount compared with the primary culture at 10 to 20° C. for 3 or 4 days under shaking (secondary culture), then in the medium in a further increased amount compared with the secondary culture at 8 to 9° C. for 7 to 9 days under stirring until the plats attains 3.0° P. or less (tertiary culture), allowing to stand in a cold room for 3 to 24 hours and then collecting the yeast.

Abstract: An object of the present invention is to provide a primer set for use in a LAMP method, which can accurately, rapidly and simply identify yeast species of genus Dekkera and yeast species of genus Brettanomyces. According to the present invention, there is provided a LAMP primer set for use in the detection of the yeast species of genus Dekkera and the yeast species of genus Brettanomyces, which comprises primers selected from the group consisting of the polynucleotides having the base sequences of SEQ ID NOS: 1 to 21 or the homologous polynucleotides thereof.

Abstract: A digital displacement measuring instrument includes a spindle screwed into a body to be axially advanced and retracted relative to the body; and an encoder that detects a displacement of the spindle. The encoder includes a rotor and a stator. The rotor is supported by a rotor bushing. The rotor bushing includes an engaging key engageable with a key groove axially provided on the outer circumference of the spindle, and is displaceable in the axial direction of the spindle via a position adjusting screw. The stator is fixed to the body via a stator bushing in the vicinity of the spindle so as not to be displaceable in the axial direction of the spindle.

Abstract: A multilayer wiring board (X1) comprises a core portion (100) and out-core wiring portion (30). The core portion (100) comprises a carbon fiber reinforced portion (10) composed of a carbon fiber material (11) and resin composition (12), and an in-core wiring portion (20) which has a laminated structure of at least one insulating layer (21) containing a glass fiber material (21a) and a wiring pattern (22) composed of a conductor having an elastic modulus of 10 to 40 GPa and which is bonded to the carbon fiber reinforced portion (10). The out-core wiring portion (30) has a laminated structure of at least one insulating layer (31) and a wiring pattern (32) and is bonded to the core portion (100) at the in-core wiring portion (20).

Abstract: The present invention provides an image forming apparatus and an image forming method capable of effectively suppressing the occurrence of image deletion etc. and thus stably obtaining a high-quality image and stably reducing the influence of titanium oxide particles on image quality. The image forming apparatus includes an amorphous silicon photoconductor drum having a heater provided therein; a charging device; and a rotating member that cleans the surfaces of the amorphous silicon photoconductor drum using titanium oxide particles included in toner particles. In the image forming apparatus and the image forming method using the same, the heater controls a difference between the surface temperature of the amorphous silicon photoconductor drum and the outdoor temperature within a predetermined range, and slide friction between the amorphous silicon photoconductor drum and the rotating member and the average primary particle diameter of the titanium oxide particles are set in predetermined ranges.

Abstract: A measuring instrument includes a detector that outputs a measured value, a digital display unit, an analog display unit having a plurality of display segments, and a display controller. The display controller includes: a tolerance range display unit that lights or blinks display segments corresponding to a preset tolerance range relative to a preset value; a first determiner that obtains a difference between the present value and a present measured value and determines whether the difference is within an analog display range wider than the tolerance range; a difference display unit that lights a display segment corresponding to the last one or the last two digits of the present measured value when the first determiner determines that the difference is within the analog display range; a second determiner that determines whether the difference is within the tolerance range; and an acceptance or rejection display unit that displays a result determined by the second determiner.

Abstract: The present invention provides an image forming apparatus and an image forming method capable of effectively suppressing the occurrence of image deletion etc. and thus stably obtaining a high-quality image and stably reducing the influence of titanium oxide particles on image quality. The image forming apparatus includes an amorphous silicon photoconductor drum having a heater provided therein; a charging device; and a rotating member that cleans the surfaces of the amorphous silicon photoconductor drum using titanium oxide particles included in toner particles. In the image forming apparatus and the image forming method using the same, the heater controls a difference between the surface temperature of the amorphous silicon photoconductor drum and the outdoor temperature within a predetermined range, and slide friction between the amorphous silicon photoconductor drum and the rotating member and the average primary particle diameter of the titanium oxide particles are set in predetermined ranges.

Abstract: A circuit substrate comprises a lamination of plural resin insulation films and includes, on a surface and in an interior of the circuit substrate, plural interconnection layers. One of the plural resin insulation films is formed on a first conductor pattern constituting one of the plural interconnection layers in such a manner that a bottom principal surface of the resin insulation film makes a contact with a surface of the first conductor pattern, the resin insulation film including an opening defined by a sloped surface and exposing the first conductor pattern at the bottom principal surface. A ceramic high-K dielectric film is formed at a bottom of the opening in contact with the surface of the first conductor pattern, wherein there is formed a second conductor pattern constituting one of the plural interconnection layers on the resin insulation film so as to cover the sloped surface and in contact with a surface of the ceramic high-K dielectric film.

Abstract: When a drive gear (a driving rotary assembly) is actuated and rotates the rotor (a driven rotary assembly), agitator blades rotate and agitate a base compound (a fluid) and a cure agent (a fluid) in an agitation cavity thereby shearing them. This agitation results in the base compound and the cure agent being mixed into a coating material. Furthermore, magnet force is used for giving rotation force to the rotor 50, and therefore any rotation force transmitting member that penetrates a cylindrical assembly is unnecessary. Therefore, such a rotation trouble caused by the fluids that enter into a gap between the transmitting member and the penetration, increases the viscosity therein, and adhere thereto does not occur.

Abstract: A communication radio-frequency module is provided that has a semiconductor device to which an antenna element is connected. This communication radio-frequency module includes: a supporting body that has a waveguide formed therein; a wiring board that is fixed onto a surface of the supporting body; the semiconductor device that is flip-chip mounted onto the wiring board by ultrasonic bonding; and the antenna element that is disposed on the other surface of the supporting body. In this module, the wiring board includes a board core member that is made of a resin material, and the supporting body includes a supporting body core member that is also made of a resin material.

Abstract: The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, a resin 18 buried in the through-hole 12 with the insulation layer 14 formed in, wirings 22a, 22b formed on the upper surface and the undersurface of the conductive core material 10 with the insulation layer 14 formed on, and an wiring 22d formed in the through-hole 20 formed in the resin 18 and electrically connected to the wirings 22a, 22b.

Abstract: A printed wiring board is made of first and second substrates superimposed on each other. The first and second substrates respectively include a core layer made of resin containing carbon fibers. The second substrate has the outline different from that of the first substrate. A stepped surface is defined on the front surface at least of the first substrate. Electrodes can be formed on the stepped surface as well as on the back surface of the first substrate and the front surface of the second substrate. This structure enables detection of an electric signal from the stepped surface. A further flexibility can thus be achieved in locating electrodes as compared with a conventional printed wiring board having uniform substrates simply superimposed on each other. This results in an expanded use or purpose for a printed wiring board.

Abstract: The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, a resin 18 buried in the through-hole 12 with the insulation layer 14 formed in, wirings 22a, 22b formed on the upper surface and the undersurface of the conductive core material 10 with the insulation layer 14 formed on, and an wiring 22d formed in the through-hole 20 formed in the resin 18 and electrically connected to the wirings 22a, 22b.

Abstract: A circuit substrate comprises a lamination of plural resin insulation films and includes, on a surface and in an interior of the circuit substrate, plural interconnection layers. One of the plural resin insulation films is formed on a first conductor pattern constituting one of the plural interconnection layers in such a manner that a bottom principal surface of the resin insulation film makes a contact with a surface of the first conductor pattern, the resin insulation film including an opening defined by a sloped surface and exposing the first conductor pattern at the bottom principal surface. A ceramic high-K dielectric film is formed at a bottom of the opening in contact with the surface of the first conductor pattern, wherein there is formed a second conductor pattern constituting one of the plural interconnection layers on the resin insulation film so as to cover the sloped surface and in contact with a surface of the ceramic high-K dielectric film.

Abstract: A multilayer wiring board (X1) comprises a core portion (100) and out-core wiring portion (30). The core portion (100) comprises a carbon fiber reinforced portion (10) composed of a carbon fiber material (11) and resin composition (12), and an in-core wiring portion (20) which has a laminated structure of at least one insulating layer (21) containing a glass fiber material (21a) and a wiring pattern (22) composed of a conductor having an elastic modulus of 10 to 40 GPa and which is bonded to the carbon fiber reinforced portion (10). The out-core wiring portion (30) has a laminated structure of at least one insulating layer (31) and a wiring pattern (32) and is bonded to the core portion (100) at the in-core wiring portion (20).

Abstract: The present invention provides a method for manufacturing a semiconductor wafer capable of manufacturing a wafer without ring-like sag in an outer peripheral portion thereof when polishing an alkali etched wafer, and a wafer without the ring-like sag in an outer peripheral portion thereof. The present invention comprises: a back surface part polishing and edge polishing step for performing back surface part polishing and edge polishing such that mirror polishing is performed on a chamfered portion and an inner part extending inward from a boundary between the chamfered portion and a back surface of a starting wafer; and a front surface polishing step for mirror polishing a front surface of the wafer subjected to the back surface part polishing and edge polishing step holding the wafer by the back surface thereof.

Abstract: A high-frequency module includes a stiffener (a support substrate), a resin base member of which one surface is fixed to the stiffener, a first conductive pattern formed on said one surface of the resin base member, a second conductive pattern formed on the other surface of the resin base member for constituting a waveguide in combination with the first conductive pattern to pass a high-frequency signal through the resin base member and including a window for allowing the high-frequency signal to pass therethrough, a cap for covering a semiconductor element and for absorbing or reflecting the high-frequency signal, an adopter (a waveguide tube) fixed onto the second conductive pattern such that one open end thereof surrounds the window, and an antenna fixed to the other open end of the adaptor.

Abstract: A data processing system including a processor LSI and a DRAM divided into banks, for increasing a ratio of using a fast operation mode for omitting transfer of a row address to the DRAM and for minimizing the amount of logics external to the processor LSI. The processor LSI includes row address registers for holding recent row addresses corresponding to the banks. The contents of the row address registers are compared with an accessed address by a comparator to check for each bank whether the fast operation mode is possible. As long as the row address does not change in each bank, the fast operation mode can be used, thus making it possible to speed up operations, for example in block copy processing.