Patents by Inventor Nobuyuki Ikeguchi
Nobuyuki Ikeguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9211592Abstract: A lubricant sheet suitable for use in a process of drilling a laminate or a plastic board, comprising a metal foil or an organic film, and a lubricant resin composition layer or a primer layer and the lubricant resin composition layer, the lubricant resin composition layer or the primer layer and the lubricant resin composition layer being formed on at least one surface of the metal foil or the organic film, wherein at least one layer of the primer layer and the lubricant resin composition layer contains a colorant, and a drilling method using the above lubricant sheet.Type: GrantFiled: March 10, 2008Date of Patent: December 15, 2015Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Nobuyuki Ikeguchi, Takuya Hasaki, Shinya Komatsu, Toshihiko Kobayashi, Mitsuo Ejiri
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Patent number: 8997340Abstract: A method of manufacturing an insulating sheet, the method including providing a reinforcement material having a thermoplastic resin layer stacked thereon; stacking the thermoplastic resin layer stacked on the reinforcement material over a core substrate; and hot pressing the reinforcement material and the thermoplastic resin layer onto the core substrate.Type: GrantFiled: September 21, 2011Date of Patent: April 7, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Keungjin Sohn, Nobuyuki Ikeguchi, Joung-Gul Ryu, Ho-Sik Park, Sang-Youp Lee, Joon-Sik Shin, Jung-Hwan Park
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Patent number: 8647926Abstract: A method of fabricating a semiconductor plastic package can include: providing a core board, which includes at least one pad, and which has a coefficient of thermal expansion of 9 ppm/° C. or lower; stacking a build-up insulation layer over the core board; forming an opening by removing a portion of the build-up insulation layer such that the pad is exposed to the exterior; and placing a semiconductor chip in the opening and electrically connecting the semiconductor chip with the pad. This method can be utilized to provide higher reliability in the connection between the semiconductor chip and the circuit board.Type: GrantFiled: August 31, 2010Date of Patent: February 11, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Joon-Sik Shin, Nobuyuki Ikeguchi, Keungjin Sohn, Joung Gul Ryu, Sang-Youp Lee, Jung-Hwan Park, Ho-Sik Park
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Patent number: 8377544Abstract: A copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin formed of prepreg obtained by impregnating a glass fabric base material made of a glass woven fabric having a thickness of 25 to 150 ?m, a weight of 15 to 165 g/m2 and a gas permeability of 1 to 20 cm3/cm2/sec. with a thermosetting resin composition and drying it.Type: GrantFiled: October 19, 2010Date of Patent: February 19, 2013Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Morio Gaku, Hidenori Kimbara, Nobuyuki Ikeguchi, Masakazu Motegi
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Publication number: 20120174393Abstract: A method of fabricating a multilayered printed circuit board, the method including: providing a core substrate having an outer circuit, the core substrate having a thermal expansion coefficient of 10 to 20 ppm/° C. at ?60 to 150° C.; stacking a stress-relieving insulation layer on either side of the core substrate, the stress-relieving insulation layer having a thermal expansion coefficient of ?20 to 6 ppm/° C.; and forming a metal layer on the insulation layer and forming at least one pad by removing at least one portion of the metal layer and electrically connecting the pad with the outer circuit.Type: ApplicationFiled: March 21, 2012Publication date: July 12, 2012Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Nobuyuki IKEGUCHI, Keungjin Sohn, Joon-Sik Shin
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Patent number: 8174128Abstract: A method of manufacturing a semiconductor package that includes: forming a first board; forming second boards, in each of which at least one cavity is formed; attaching the second boards to both sides of the first board, such that the second boards are electrically connected with the first board; and connecting at least one component with the first board by a flip chip method by embedding the component in the cavity. The method can prevent damage to the semiconductor chips and lower manufacturing costs, while the connection material may also mitigate stresses, to prevent cracking in the boards and semiconductor chips, while preventing defects such as bending and warpage. Defects caused by temperature changes may also be avoided. Furthermore, it is not necessary to use an underfill in the portions where the semiconductor chips are connected with the printed circuit board, which allows for easier reworking and lower costs.Type: GrantFiled: July 22, 2010Date of Patent: May 8, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Nobuyuki Ikeguchi, Keungjin Sohn, JoonSik Shin, Jung-Hwan Park
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Publication number: 20120012247Abstract: A method of manufacturing an insulating sheet, the method including providing a reinforcement material having a thermoplastic resin layer stacked thereon; stacking the thermoplastic resin layer stacked on the reinforcement material over a core substrate; and hot pressing the reinforcement material and the thermoplastic resin layer onto the core substrate.Type: ApplicationFiled: September 21, 2011Publication date: January 19, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Keungjin Sohn, Nobuyuki Ikeguchi, Joung-Gul Ryu, Ho-Sik Park, Sang-Youp Lee, Joon-Sik Shin, Jung-Hwan Park
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Patent number: 8030752Abstract: A method of manufacturing a semiconductor package may include: forming a first board; forming second boards, in each of which at least one cavity is formed; attaching the second boards to both sides of the first board, such that the second boards are electrically connected with the first board; and connecting at least one component with the first board by a flip chip method by embedding the component in the cavity. The method can prevent damage to the semiconductor chips and lower manufacturing costs, while the connection material may also mitigate stresses, to prevent cracking in the boards and semiconductor chips, while preventing defects such as bending and warpage. Defects caused by temperature changes may also be avoided. Furthermore, it is not necessary to use an underfill in the portions where the semiconductor chips are connected with the printed circuit board, which allows for easier reworking and lower costs.Type: GrantFiled: June 24, 2008Date of Patent: October 4, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Nobuyuki Ikeguchi, Keungjin Sohn, JoonSik Shin, Jung-Hwan Park
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Patent number: 7893527Abstract: A semiconductor plastic package and a method of fabricating the semiconductor plastic package are disclosed. A method of fabricating a semiconductor plastic package can include: providing a core board, which includes at least one pad, and which has a coefficient of thermal expansion of 9 ppm/° C. or lower; stacking a build-up insulation layer over the core board; forming an opening by removing a portion of the build-up insulation layer such that the pad is exposed to the exterior; and placing a semiconductor chip in the opening and electrically connecting the semiconductor chip with the pad. This method can be utilized to provide higher reliability in the connection between the semiconductor chip and the circuit board.Type: GrantFiled: July 2, 2008Date of Patent: February 22, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Joon-Sik Shin, Nobuyuki Ikeguchi, Keungjin Sohn, Joung-Gul Ryu, Sang-Youp Lee, Jung-Hwan Park, Ho-Sik Park
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Publication number: 20110033659Abstract: A copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin formed of prepreg obtained by impregnating a glass fabric base material made of a glass woven fabric having a thickness of 25 to 150 ?m, a weight of 15 to 165 g/m2 and a gas permeability of 1 to 20 cm3/cm2/sec. with a thermosetting resin composition and drying it.Type: ApplicationFiled: October 19, 2010Publication date: February 10, 2011Inventors: Morio Gaku, Hidenori Kimbara, Nobuyuki Ikeguchi, Masakazu Motegi
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Publication number: 20100330747Abstract: A method of fabricating a semiconductor plastic package can include: providing a core board, which includes at least one pad, and which has a coefficient of thermal expansion of 9 ppm/° C. or lower; stacking a build-up insulation layer over the core board; forming an opening by removing a portion of the build-up insulation layer such that the pad is exposed to the exterior; and placing a semiconductor chip in the opening and electrically connecting the semiconductor chip with the pad. This method can be utilized to provide higher reliability in the connection between the semiconductor chip and the circuit board.Type: ApplicationFiled: August 31, 2010Publication date: December 30, 2010Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Joon-Sik Shin, Nobuyuki Ikeguchi, Keungjin Sohn, Joung-Gul Ryu, Sang-Youp Lee, Jung-Hwan Park, Ho-Sik Park
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Publication number: 20100291737Abstract: A method of manufacturing a semiconductor package that includes: forming a first board; forming second boards, in each of which at least one cavity is formed; attaching the second boards to both sides of the first board, such that the second boards are electrically connected with the first board; and connecting at least one component with the first board by a flip chip method by embedding the component in the cavity. The method can prevent damage to the semiconductor chips and lower manufacturing costs, while the connection material may also mitigate stresses, to prevent cracking in the boards and semiconductor chips, while preventing defects such as bending and warpage. Defects caused by temperature changes may also be avoided. Furthermore, it is not necessary to use an underfill in the portions where the semiconductor chips are connected with the printed circuit board, which allows for easier reworking and lower costs.Type: ApplicationFiled: July 22, 2010Publication date: November 18, 2010Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Nobuyuki Ikeguchi, Keungjin Sohn, JoonSik Shin, Jung-Hwan Park
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Publication number: 20090242248Abstract: A method of manufacturing an insulating sheet can include: providing a reinforcement material on which a thermoplastic resin layer is stacked, stacking the thermoplastic resin layer stacked on the reinforcement material over a core substrate, and hot pressing the reinforcement material and the thermoplastic resin layer onto the core substrate. This method can be used to produce an insulation board that has a coefficient of thermal expansion close to that of the semiconductor chip, and thereby prevent bending or warpage in the printed circuit board using the insulation board. Furthermore, the stress in the connecting material can be reduced, so that cracking or delamination in the connecting material may be avoided, while heat-releasing performance may also be improved.Type: ApplicationFiled: December 23, 2008Publication date: October 1, 2009Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Keungjin Sohn, Nobuyuki Ikeguchi, Joung-Gul Ryu, Ho-Sik Park, Sang-Youp Lee, Joon-Sik Shin, Jung-Hwan Park
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Publication number: 20090236038Abstract: A method for manufacturing an insulating sheet, a method for manufacturing a metal clad laminate, and a method for manufacturing a printed circuit board are disclosed. The method for manufacturing an insulating sheet may include stacking a thermoplastic resin layer over a reinforcement material, and hot pressing the thermoplastic resin layer into the reinforcement material to impregnate and attach the thermoplastic resin layer into the reinforcement material. Certain embodiments of the invention can be utilized to produce an insulation board that has a coefficient of thermal expansion close to that of the semiconductor chip, and thereby prevent bending or warpage in the multi-layer printed circuit board using the insulation board. Furthermore, the stress in the material connecting the semiconductor chip with the printed circuit board can be reduced, so that cracking or delamination in the connecting material, such as lead-free solder, may be avoided.Type: ApplicationFiled: August 20, 2008Publication date: September 24, 2009Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTDInventors: Nobuyuki Ikeguchi, Keungjin Sohn, Joon-Sik Shin, Joung-Gul Ryu, Jung-Hwan Park, Ho-Sik Park
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Publication number: 20090159318Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method may include forming at least one first bump over a first metal layer by selectively printing an alloy paste, stacking an insulation layer over the first metal layer such that the first bump penetrates the insulation layer, and stacking a second metal layer over the insulation layer. Embodiments of the invention can shorten the manufacturing process and lower manufacturing costs, while effectively implementing signal transfers.Type: ApplicationFiled: June 24, 2008Publication date: June 25, 2009Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Nobuyuki Ikeguchi, Eung-Suek Lee
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Publication number: 20090152742Abstract: A method of manufacturing a semiconductor package may include: forming a first board; forming second boards, in each of which at least one cavity is formed; attaching the second boards to both sides of the first board, such that the second boards are electrically connected with the first board; and connecting at least one component with the first board by a flip chip method by embedding the component in the cavity. The method can prevent damage to the semiconductor chips and lower manufacturing costs, while the connection material may also mitigate stresses, to prevent cracking in the boards and semiconductor chips, while preventing defects such as bending and warpage. Defects caused by temperature changes may also be avoided. Furthermore, it is not necessary to use an underfill in the portions where the semiconductor chips are connected with the printed circuit board, which allows for easier reworking and lower costs.Type: ApplicationFiled: June 24, 2008Publication date: June 18, 2009Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Nobuyuki Ikeguchi, Keungjin Sohn, JoonSik Shin, Jung-Hwan Park
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Publication number: 20090026604Abstract: A semiconductor plastic package and a method of fabricating the semiconductor plastic package are disclosed. A method of fabricating a semiconductor plastic package can include: providing a core board, which includes at least one pad, and which has a coefficient of thermal expansion of 9 ppm/° C. or lower; stacking a build-up insulation layer over the core board; forming an opening by removing a portion of the build-up insulation layer such that the pad is exposed to the exterior; and placing a semiconductor chip in the opening and electrically connecting the semiconductor chip with the pad. This method can be utilized to provide higher reliability in the connection between the semiconductor chip and the circuit board.Type: ApplicationFiled: July 2, 2008Publication date: January 29, 2009Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Joon-Sik Shin, Nobuyuki Ikeguchi, Keungjin Sohn, Joung-Gul Ryu, Sang-Youp Lee, Jung-Hwan Park, Ho-Sik Park
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Publication number: 20090008136Abstract: A multilayered printed circuit board and a method of fabricating the printed circuit board are disclosed. The method of fabricating the multilayered printed circuit board can include: providing a core substrate, which has an outer circuit, and which has a thermal expansion coefficient of 10 to 20 ppm/° C. at ?60 to 150° C.; stacking a stress-relieving insulation layer, which has a thermal expansion coefficient of ?20 to 6 ppm/° C., on either side of the core substrate; and forming a metal layer on the insulation layer and forming at least one pad and electrically connecting the pad with the outer circuit. This method can provide high reliability, as the stress-relieving insulation layers can prevent bending and warpage, etc., in the board overall.Type: ApplicationFiled: June 25, 2008Publication date: January 8, 2009Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Nobuyuki Ikeguchi, Keungjin Sohn, Joon-Sik Shin
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Publication number: 20080166565Abstract: A lubricant sheet suitable for use in a process of drilling a laminate or a plastic board, comprising a metal foil or an organic film, and a lubricant resin composition layer or a primer layer and the lubricant resin composition layer, the lubricant resin composition layer or the primer layer and the lubricant resin composition layer being formed on at least one surface of the metal foil or the organic film, wherein at least one layer of the primer layer and the lubricant resin composition layer contains a colorant, and a drilling method using the above lubricant sheet.Type: ApplicationFiled: March 10, 2008Publication date: July 10, 2008Inventors: Nobuyuki Ikeguchi, Takuya Hasaki, Shinya Komatsu, Toshihiko Kobayashi, Mitsuo Ejiri
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Publication number: 20060089070Abstract: A copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin formed of prepreg obtained by impregnating a glass fabric base material made of a glass woven fabric having a thickness of 25 to 150 ?m, a weight of 15 to 165 g/m2 and a gas permeability of 1 to 20 cm3/cm2/sec. with a thermosetting resin composition and drying it.Type: ApplicationFiled: December 8, 2005Publication date: April 27, 2006Inventors: Morio Gaku, Hidenori Kimbara, Nobuyuki Ikeguchi, Masakazu Motegi