Abstract: Provided is a printed wiring board for a chip size scale package, which overcomes the poor adhesion of solder balls to a base material which poor adhesion is caused by a recent decrease in the size of the solder balls, and in the chip size scale package, the distortion of the printed wiring board is decreased and the distortion of a semiconductor plastic package formed by mounting a semiconductor chip on the printed wiring board by wire bonding or flip chip bonding is decreased.

Abstract: Printed wiring board for a chip size scale package, which overcomes the poor adhesion of solder balls to a base material which poor adhesion is caused by a recent decrease in the size of the solder balls, and in the chip size scale package. The distortion of the printed wiring board is decreased and the distortion of a semiconductor plastic package formed by mounting a semiconductor chip on the printed wiring board by wire bonding or flip chip bonding is decreased. The board has at least two blind via holes in one solder-balls-fixing pad.

Abstract: Disclosed is a semiconductor plastic package having a structure in which a metal sheet having a size nearly equivalent to a printed wiring board is disposed nearly in the central portion in the thickness direction of the printed wiring board. The metal sheet and a signal propagation conductive circuit on a front surface of the printed wiring board are insulated from each other with a thermosetting resin composition. The conductive circuit on the printed wiring board surface is connected to a conductive circuit formed on an opposite surface of the printed wiring board, or to a conductive circuit pad formed for being connected with solder balls with a conductive through hole. A semiconductor chip, wire and bonding pad are encapsulated with a resin. The semiconductor plastic package has at least one blind via hole made in the opposite surface so as to be directly connected to the metal sheet. The blind via hole has an inner wall rendered thermally conductive.

Abstract: A method of making a small-diameter through hole having high reliability with regard to a hole wall at a high rate with the energy of a high-output carbon dioxide gas laser without pre-making any hole in a copper foil, forming or disposing a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C.

Abstract: Disclosed are a printed wiring board having micro-via holes highly reliable for conduction and a method of making the micro-via hole by providing a coating or sheet of an organic substance containing 3 to 97% by volume of at least one selected from a metal compound powder, a carbon powder or a metal powder having a melting point of at least 900° C.

Abstract: There is provided a semiconductor plastic package in the form in which at least one semiconductor chip is mounted on a small-sized printed wiring board, a metal plate for the above package and a method of producing a copper-clad board for the above package. More particularly, there is provided a semiconductor plastic package suitable for relatively high-watt, multi-terminal and high-density semiconductor plastic packages such as a microprocessor, a micro-controller, ASIC and graphic, and a method of producing the same.

Abstract: There is provided a semiconductor plastic package in the form in which at least one semiconductor chip is mounted on a small-sized printed wiring board, a metal plate for the above package and a method of producing a copper-clad board for the above package. More particularly, there is provided a semiconductor plastic package suitable for relatively high-watt, multi-terminal and high-density semiconductor plastic packages such as a microprocessor, a micro-controller, ASIC and graphic, and a method of producing the same.

Abstract: An adhesive composition comprising at least(A) at least one cyanate ester compound selected from the group consisting of:(i) polyfunctional aromatic cyanate ester monomers having the formulaR--O--C.tbd.N).sub.nwherein n is integer of 2-10 and R is an aromatic organic group, the cyanate groups being bonded to an aromatic ring or said aromatic organic group;(ii) homoprepolymers of (i) and(iii) coprepolymer of (i) and an amine, and(B) at least one thermoplastic saturated polyester resin which is non-crystalline, substantially non-crystalline or of low crystallinity is disclosed. The adhesive composition has excellent heat resistance, moisture resistance and chemical resistance.

Abstract: An adhesive composition comprising at least(A) at least one cyanate ester compound selected from the group consisting of:(i) polyfunctional aromatic cyanate ester monomers having the formulaR--O--C.tbd.N).sub.nwherein n is integer of 2-10 and R is an aromatic organic group, the cyanate groups being bonded to an aromatic ring or said aromatic organic group;(ii) homoprepolymers of (i) and(iii) coprepolymer of (i) and an amine, and(B) at least one thermoplastic saturated polyester resin which is non-crystalline, substantially non-crystalline or of low crystallinity is disclosed. The adhesive composition has excellent heat resistance, moisture resistance and chemical resistance.

Abstract: An electrically conductive resin composition comprising 15-35 parts by weight of a cyanate ester compound and 65-85 parts by weight of an electrically conductive powder selected from the group consisting of a copper powder, a copper alloy powder and a silver powder and mixtures thereof, the cyanate ester component content in the cyanate ester compound being more than 50% by weight in terms of monomer, characterized in that the composition contains 0.5-15 parts by weight of acetylacetone or its derivatives is disclosed. The electrically conductive resin composition is useful as a conductive ink.

Abstract: A curable resin composition comprising a mixture and/or a preliminary reaction product of (a) at least one cyanate compound selected from the group consisting of polyfunctional cyanate esters, prepolymers of the cyanate esters, coprepolymers of the cyanate esters and an amine and mixtures thereof, (b) a polyhydantoin resin and optionally (c) at least one maleimide compound selected from the group consisting of polyfunctional maleimides, prepolymer of the maleimides, coprepolymers of the maleimides and an amine and mixtures thereof is disclosed.

Abstract: A curable resin composition comprising a mixture and/or a preliminary reaction product of (a) polyfunctional cyanate ester, prepolymer of the cyanate ester, or coprepolymer of the cyanate ester and an amine, and (b) cyclopentadiene or polycyclopentadiene and a curable resin composition comprising a mixture or a preliminary reaction product of above component (a), above component (b) and (c), a polyfunctional maleimide, prepolymer of the maleimide or coprepolymer of the maleimide and an amine are disclosed. Cured resin having excellent impact-resistance, adhesive power, heat-resistance and chemical-resistance can be prepared from the compositions.

Abstract: A curable resin composition comprising a mixture and/or a preliminary reaction product of (a) at least one cyanate compound selected from the group consisting of polyfunctional cyanate esters, prepolymers of the cyanate esters, coprepolymers of the cyanate esters and an amine and mixtures thereof, (b) a polyhydantoin resin and optionally (c) at least one maleimide compound selected from the group consisting of polyfunctional maleimides, prepolymer of the maleimides, coprepolymers of the maleimides and an amine and mixtures thereof is disclosed.

Abstract: A process for producing a colloidal solution of a curable resin which comprises:blending (a) 5 to 90% by weight of a polyfunctional maleimide component and (b) 95 to 10% by weight of at least one thermosetting resin,heating them to form a composition, andblending the resulting composition with at least one low boiling point solvent having a boiling point of more than room temperature and less than 150.degree. C., in which the thermosetting resin is rich soluble, but the maleimide component is poor soluble, thereby forming a colloidal solution of a curable resin is disclosed. The colloidal solution is used as a coating, as an impregnating agent for a coil, or for preparing prepreg.

Abstract: A curable resin composition comprising a mixture and/or a preliminary reaction product of (a) at least one cyanate compound selected from the group consisting of polyfunctional cyanate esters, prepolymers of said cyanate esters, coprepolymers of said cyanate esters and an amine and mixtures thereof, (b) at least one polymeric material selected from the group consisting of terpolymer of acrylonitrile, butadiene and isoprene, copolymers of acrylonitrile and one of butadiene and isoprene, reaction products of the terpolymer or the copolymer and a compound selected from the group consisting of isocyanate compounds, epoxy compounds, acrylates, methacrylates and unsaturated acid anhydrides and the terpolymer or copolymer modified by introducing methacryloyl group, acryloyl group or acid anhydride moiety thereinto and optionally (c) at least one compound selected from the group consisting of polyfunctional maleimides, prepolymers of the maleimides or coprepolymers of the maleimides and an amine is disclosed.

Abstract: A curable resin composition comprising a mixture and/or a preliminary reaction product of (a) at least one cyanate compound selected from the group consisting of polyfunctional cyanate esters, prepolymers of said cyanate esters, coprepolymers of said cyanate ester and an amine and mixtures thereof, (b) at least one polymeric material selected from the group consisting of polybutadiene having molecular weight of 500-1,000,000, reaction products of the polybutadiene and a compound selected from the group consisting of isocyanate compounds, acrylates, methacrylates and unsaturated acid anhydrides and the polybutadiene modified by introducing methacryloyl group, acryloyl group or acid anhydride moiety thereinto and optionally (c) at least one compound selected from the group consisting of polyfunctional maleimides, prepolymers of the maleimides or coprepolymers of the maleimides and an amine is disclosed.

Abstract: A plastic article in which a semi-cured or cured product of a curable resin composition comprising a mixture and/or a preliminary reaction product of (a) at least one cyanate compound selected from the group consisting of polyfunctional cyanate esters, prepolymers of said cyanate esters, coprepolymers of said cyanate esters and an amine and mixtures thereof, (b) at least one diene-type rubber and optionally (c) at least one compound selected from the group consisting of polyfunctional maleimides, prepolymers of the maleimides or coprepolymers of the maleimides and an amine is formed on a plastic substrate is disclosed.

Abstract: A curable resin composition comprising a mixture and/or a preliminary reaction product of (a) at least one cyanate compound selected from the group consisting of polyfunctional cyanate esters, prepolymers of the cyanate esters, coprepolymers of the cyanate esters and an amine and mixtures thereof, (b) at least one rubber, which is liquid at room temperature or elastic, selected from the group consisting of styrene butadiene rubber, isoprene rubber, polychloroprene rubber, butyl rubber, acrylic rubber, natural rubbers, a preliminary reaction product of an epoxy compound and isoprene rubber, a preliminary reaction product of a natural rubber and an epoxy compound, rubbers obtained by introducing acryloyl or methacryloyl group into isoprene, and acid anhydride moiety-containing rubbers obtained by adding double bond of an unsaturated acid anhydride to isoprene and mixtures thereof and optionally (c) at least one compound selected from the group consisting of polyfunctional maleimides, prepolymers of the maleimid

Abstract: A curable resin composition comprising a mixture and/or a preliminary reaction product of (a) polyfunctional cyanate ester, prepolymer of the cyanate ester, or coprepolymer of the cyanate ester and an amine, and (b) acrylic epoxy esters, methacrylic epoxy esters, prepolymers of acrylic epoxy esters, prepolymers methacrylic epoxy esters, coprepolymers of acrylic epoxy esters and methacrylic epoxy esters and mixtures thereof, and a curable resin composition comprising a mixture or a preliminary reaction product of above component (a), above component (b) and (c) a polyfunctional maleimide, prepolymer of the maleimide or coprepolymer of the maleimide and an amine are disclosed. Cured resin having excellent impact-resistance, adhesive power, heat-resistance and chemical resistance can be prepared from the compositions.

Abstract: A photo-curable resin composition is disclosed comprising (i) a mixture and/or a preliminary reaction product of (a) at least one cyanate compound selected from the group consisting of polyfunctional cyanate esters, prepolymers of the cyanate esters, coprepolymers of the cyanate esters and an amine and mixtures thereof, (b) at least one compound selected from the group consisting of monomers having at least one olefinically double bond prepolymers of the monomers, liquid rubbers having one or more acryloyl or methacryloyl groups and mixtures thereof and optionally (c) at least one maleimide compound selected from the group consisting of polyfunctional maleimides, prepolymers of the maleimides, coprepolymers of the maleimides and an amine and mixtures thereof and (ii) a photo polymerization initiator or a photo sensitizer.