Abstract: A multi-zone heater includes an outer circumferential zone heater and first and second elemental wire portions. The outer circumferential zone heater is a coil that is provided in an outer circumferential zone of a ceramic substrate in the same plane as a plane in which a central zone heater is provided and that is routed throughout the outer circumferential zone in a unicursal manner from one end portion to the other end portion in the outer circumferential portion. The first elemental wire portion extends from a first terminal, passes through a central portion, is connected to the one end portion of the outer circumferential zone heater, and has a meandering shape in plan view. The second elemental wire portion extends from a second terminal, passes through the central portion, is connected to the other end portion of the outer circumferential zone heater, and has a meandering shape in plan view.

Abstract: An electrostatic chuck has a structure in which an electrostatic electrode is embedded in a disk-like ceramic plate and attracts a wafer that is placed on the ceramic plate and that has a diameter smaller than that of the ceramic plate by Johnsen-Rahbek force. The electrostatic chuck includes an insulating film that has an electric resistance larger than that of the ceramic plate in an annular region of a front surface of the ceramic plate from an outer circumferential edge of the ceramic plate to the inside of an outer circumferential edge of the wafer that is placed on the ceramic plate.

Abstract: A multi-zone heater includes an outer circumferential zone heater and first and second elemental wire portions. The outer circumferential zone heater is a coil that is provided in an outer circumferential zone of a ceramic substrate in the same plane as a plane in which a central zone heater is provided and that is routed throughout the outer circumferential zone in a unicursal manner from one end portion to the other end portion in the outer circumferential portion. The first elemental wire portion extends from a first terminal, passes through a central portion, is connected to the one end portion of the outer circumferential zone heater, and has a meandering shape in plan view. The second elemental wire portion extends from a second terminal, passes through the central portion, is connected to the other end portion of the outer circumferential zone heater, and has a meandering shape in plan view.

Abstract: An electrostatic chuck has a structure in which an electrostatic electrode is embedded in a disk-like ceramic plate and attracts a wafer that is placed on the ceramic plate and that has a diameter smaller than that of the ceramic plate by Johnsen-Rahbek force. The electrostatic chuck includes an insulating film that has an electric resistance larger than that of the ceramic plate in an annular region of a front surface of the ceramic plate from an outer circumferential edge of the ceramic plate to the inside of an outer circumferential edge of the wafer that is placed on the ceramic plate.

Abstract: A video projector including a cooling current discharging structure capable of providing a high-speed cooling current and a low-speed cooling current to an optical component of an optical system serving as a cooling subject. The cooling current discharging structure discharges the high-speed cooling current toward a high-temperature region of the optical component and discharges the low-speed cooling current toward a low-temperature region having a relatively low temperature.

Abstract: A projection display apparatus includes a housing case housing a plurality of light sources, a reflective light valve, and a projection unit. The housing case has a base plate and a ceiling plate. The ceiling plate is provided with a transmission area and a projection-plane-side shield plate, the transmission area being an area through which light emitted from the projection unit passes, the projection-plane-side shield plate being placed closer to the projection plane than the transmission area. The projection-plane-side shield plate is configured to shield unwanted light being other than light forming an image among light passed through the transmission area.

Abstract: An illuminating device includes a plurality of light source portions having a light source and condenser optics for condensing light from the light source, a plurality of optical fibers each connected to a corresponding one of the light source portions and into which the light from the corresponding condenser optics is incident, and a bundling portion for bundling the plurality of optical fibers. The plurality of light source portions are arranged on a plane approximately parallel to a bundling-central axis of the bundling portion, and the farther the light source portion is arranged from the bundling portion, the more the optical axis of the condenser optics is tilted toward the bundling portion from a direction vertical to the plane.

Abstract: A guide convex portion is formed on a base plate in parallel to an illumination optical axis. Further, a fixed-side supporting member is provided in the base plate. A first opening is formed in an upright portion of the fixed-side supporting member. A slide supporting member can be provided on the base plate. A second opening is formed in the upright portion of the slide supporting member. By inserting a tapered rod into the second opening at its light incidence side and by moving the slide supporting member along the aforementioned guide convex portion, the slide supporting member is stopped at a predetermined position and, at this position, the slide supporting member is fixed.

Abstract: A guide convex portion is formed on a base plate in parallel to an illumination optical axis. Further, a fixed-side supporting member is provided in the base plate. A first opening is formed in an upright portion of the fixed-side supporting member. A slide supporting member can be provided on the base plate. A second opening is formed in the upright portion of the slide supporting member. By inserting a tapered rod into the second opening at its light incidence side and by moving the slide supporting member along the aforementioned guide convex portion, the slide supporting member is stopped at a predetermined position and, at this position, the slide supporting member is fixed.

Abstract: A substrate heating apparatus includes a ceramic base having a concave heating surface on which a substrate is placed, and a resistance heating element buried in the ceramic base. The central part of the concave heating surface defines the lowest point of the heating surface and the peripheral part of the concave heating surface defines the highest point of the heating surface.

Abstract: The present invention provides a method for cleaning a ceramic member for use in a system for producing semiconductors. The method has the step of cleaning the ceramic member with an organic acid or a weak acid. Preferably, the ceramic member is cleaned with a strong acid before the cleaning with an organic acid or a weak acid. The ceramic member may be subjected to a blasting treatment before the cleaning with an organic acid or a weak acid. According to the method, the amount of metal transferred from the ceramic member to a semiconductor may be considerably reduced.

Abstract: a liquid cooling apparatus provided on an apparatus having a heat unit generating heat, and configured to cool the heat unit by coolant includes; a coolant tank configured to store the coolant; a radiator configured to cool the coolant; and a coolant pipe which is a flow path of the coolant and connecting the coolant tank and the radiator. The coolant tank is arranged adjacent to the radiator in a horizontal direction when the apparatus disposed statically. A size of the coolant tank in a vertical direction is larger than a size of the coolant tank in a horizontal direction when the apparatus is disposed statically.

Abstract: A substrate heater is provided including a plate-shaped ceramic base having a first side defining a convex heating surface on at least a portion of which a substrate is placed, a resistance-heating element embedded in the ceramic base, and a tubular member joined to a central portion on an opposed second side of the ceramic base. The convex heating surface has a central portion and a peripheral portion, wherein the height of the heating surface decreases from the central portion toward the peripheral portion thereof.

Abstract: A substrate heating apparatus comprises a ceramic base including a heating surface on which a substrate is placed, and a resistance heating element buried in the ceramic base, wherein the heating surface is a concave which a central part is the lowest point and a peripheral part is the highest point.

Abstract: A wafer heating system 1 has a substrate portion 2a having a mounting face 2c for mounting and heating a wafer “W” and a side wall portion 2b surrounding the side edge of the wafer “W”. The height “D” of the side wall portion 2b from the mounting face 2c is not smaller than the thickness “C” of the wafer “W”.

Abstract: The present invention provides a method for cleaning a ceramic member for use in a system for producing semiconductors. The method has the step of cleaning the ceramic member with an organic acid or a weak acid. Preferably, the ceramic member is cleaned with a strong acid before the cleaning with an organic acid or a weak acid. The ceramic member may be subjected to a blasting treatment before the cleaning with an organic acid or a weak acid. According to the method, the amount of metal transferred from the ceramic member to a semiconductor may be considerably reduced.