Abstract: The invention provides a lighting device (100) comprising a plurality of light source packages (110) each light source package (110) comprising a light source (10) and a polarizer (20) configured to polarize light source light (11) of said light source (10), wherein the light source packages (110) are individually controllable, wherein the light source packages (110) are configured to provide polarized light source light (11) with at least two different polarization states (p1,p2), and wherein the light source packages (110) share a light exit window (120) for escape of the light source light (11) from said lighting device (100).

Abstract: A method comprises forming a mask on a first surface of a substrate. The mask is patterned to form openings on the first surface of the substrate. Notches are formed in the first surface of the substrate in the openings. The mask is removed from the first surface of the substrate A plurality of LEDs are provided on the first surface of the substrate and between notches. A second surface of the substrate is thinned to expose the notches and separate the LEDs. The second surface of the substrate is opposite of the first surface of the substrate.

Abstract: The invention provides a system (1) comprising a fan assembly (100) with a plurality of nozzle openings (115a, 115b, . . . ) for creating air flows (111a, 111b, . . . ), the fan assembly (100) configured to provide the air flows (111a, 111b, . . . ) in at least two non-parallel directions (112a, 112b, . . . ), wherein the at least two non-parallel directions (112a, 112b, . . . ) are configured within a virtual cone (30) having an apex angle (?) selected from the range of 10-170° and having a cone axis (31), a control system (200) configured to control the air flows (11a, 111b, . . . ), the system (1) further comprising a light source (10) configured to generate light source light (11), and the system (1) further comprising heating elements (113a, 113b, . . . ) for heating the respective flows (111a, 111b, . . . ).

Abstract: An elongated lead frame (100) for a plurality of solid state light emitters (116), an elongated lighting assembly and a method of manufacturing an elongated lead frame are provided. The elongated lead frame comprises a first patterned layer (310) of an electrically conductive material and a second patterned layer (320) of an electrically isolating material. The first patterned layer comprising two electrically conductive tracks (102) that comprise first structures (316, 316?) for a first layer of a stack of light emitter islands and two electrically conductive connections between the first structures, at least one of the electrically conductive tracks comprises in between pairs of neighboring first structures a winded portion for forming a flexible electrically conductive connection in between the pairs of neighboring first structures.

Abstract: A LED module is disclosed comprising a LED chip including at least one LED arranged to direct a luminous output centered about an optical axis towards a light exit surface; an optical layer separated from the light exit surface by a spacing region having a lower refractive index than the optical layer and a material comprising the light exit surface, the optical layer being arranged to redirect the luminous output in a direction under a non-zero angle with the optical axis; and a collimating element over the optical layer, the collimating element being arranged to collimate the redirected luminous output in said direction. A lighting module including one or more of such LED modules is also disclosed.

Abstract: Proposed is a light source comprising: a plurality of LED light sources, each of the plurality of LED light sources having: a semiconductor diode structure adapted to generate light; and a light output section above the semiconductor diode structure adapted to output light from the semiconductor diode structure, the area of the light output section being less than the area of the semiconductor diode structure; and an optically transmissive structure overlapping the light output sections of the plurality of LED light sources so as to receive light from the light output sections of the plurality of LED light sources and having a light exit section adapted to output the received light. The area of the light exit section of the optically transmissive structure is less than the footprint area of the plurality of LED light sources.

Abstract: A method according to embodiments of the invention includes providing a light emitting semiconductor structure grown on a substrate. The substrate has a front side and a back side opposite the front side. Notches are formed in the substrate. The notches extend from the front side of the substrate into the substrate. After forming notches in the substrate, the back side of the substrate is thinned to expose the notches.

Abstract: The invention describes a method of manufacturing an LED module, comprising the steps of providing a translucent encapsulant comprising a number of layers to enclose a number of LEDs of the LED module; modifying the surface structure of an outer surface of a layer to form at least one dense scattering region corresponding to the position of an LED of the LED module; to form at least one sparse scattering region that does not correspond to the position of an LED of the LED module; and to form a transition scattering region between a dense scattering region and a sparse scattering region. The invention further describes an LED module, and a device comprising a device housing and at least one such LED module.

Abstract: The invention provides a horticulture arrangement (2) configured for support of a plant part (6) of a plant (5), comprising a horticulture lighting system (1) for horticulture lighting, the horticulture lighting system (1) comprising a light generating device (10) and an element (100), the element (100) having an elongated shape with an element length (L1), the element (100) comprising a plurality of light emitting regions (200) adapted to provide horticulture light (201) during operation of the light generating device (10), wherein an arrangement of positions of the light emitting regions (200) along the length (L1) of the element (100) is controllable.

Abstract: The invention provides a lighting device (100) comprising a plurality of light source packages (110) each light source package (110) comprising a light source (10) and a polarizer (20) configured to polarize light source light (11) of said light source (10), wherein the light source packages (110) are individually controllable, wherein the light source packages (110) are configured to provide polarized light source light (11) with at least two different polarization states (p1,p2), and wherein the light source packages (110) share a light exit window (120) for escape of the light source light (11) from said lighting device (100).

Abstract: The invention provides an LED module having a concentrated light output window. Light output from a first output window of an LED assembly (e.g. from a plurality of LEDs) is passed to an input window of a light directing element and redirected to be emitted from a second, smaller output window of a light directing element. This difference in size thereby concentrates the light output by the light directing element. The second output window (of the light directing element) is substantially perpendicular to the first output window, allowing for the size of the LED assembly in a particular dimension to not be necessarily constrained by the size of the second output window.

Abstract: A method according to embodiments of the invention includes providing a light emitting semiconductor structure grown on a substrate. The substrate has a front side and a back side opposite the front side. Notches are formed in the substrate. The notches extend from the front side of the substrate into the substrate. After forming notches in the substrate, the back side of the substrate is thinned to expose the notches.

Abstract: The invention describes a method of manufacturing an LED module, comprising the steps of providing a translucent encapsulant comprising a number of layers to enclose a number of LEDs of the LED module; modifying the surface structure of an outer surface of a layer to form at least one dense scattering region corresponding to the position of an LED of the LED module; to form at least one sparse scattering region that does not correspond to the position of an LED of the LED module; and to form a transition scattering region between a dense scattering region and a sparse scattering region. The invention further describes an LED module, and a device comprising a device housing and at least one such LED module.

Abstract: A light source includes first and second semiconductor diode structures adapted to generate light, a light output section at least partially overlapping both of the first and the second semiconductor diode structures and being adapted to output light from the first and the second semiconductor diode structures, and a light reflecting structure at least partially enclosing side surfaces of the first and the second semiconductor diode structures and the light output section and being adapted to reflect light from the first and the second semiconductor diode structures towards the light output section. The area of the light output section is less than the combined area of the first and the second semiconductor diode structures.

Abstract: An elongated lead frame (100) for a plurality of solid state light emitters (116), an elongated lighting assembly and a method of manufacturing an elongated lead frame are provided. The elongated lead frame comprises a first patterned layer (310) of an electrically conductive material and a second patterned layer (320) of an electrically isolating material. The first patterned layer comprising two electrically conductive tracks (102) that comprise first structures (316, 316?) for a first layer of a stack of light emitter islands and two electrically conductive connections between the first structures, at least one of the electrically conductive tracks comprises in between pairs of neighboring first structures a winded portion for forming a flexible electrically conductive connection in between the pairs of neighboring first structures.

Abstract: A light emitting arrangement is suggested for generating directional projections of light with sharply defined beam profile. Light from a top-emitting solid state light source (12), having reflective side-coating (34), is pre-collimated via a beam-shaping optic (16), before being propagated through a secondary collimating funnel (18), capturing any light rays with still too great an escape angle. Chip-scale package dimensions may be achieved through the use of a thin-film side-coating and undersized phosphor layers. Substrate level process flow further allows for parallel processing of a plurality of devices.

Abstract: A method according to embodiments of the invention includes growing on a first surface of a sapphire substrate a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. The semiconductor structure is formed into a plurality of LEDs. Cracks are formed in the sapphire substrate. The cracks extend from the first surface of the sapphire substrate and do not penetrate an entire thickness of the sapphire substrate. After forming cracks in the sapphire substrate, the sapphire substrate is thinned from a second surface of the sapphire substrate. The second surface is opposite the first surface.

Abstract: A light emitting device such as luminaire includes one or more light emitting device chips mounted on a board. The light emitting device chips have electrical contacts and are flip chip mounted to board with the electrical contacts connected to contact pads. Sidewall metallizations on the sidewalls of the light emitting device chips are connected by metal heat transfer elements to heat dissipation regions of board. The metal heat transfer elements may be of solder which may be deposited using equipment conventionally used for attaching surface mount devices.

Abstract: The invention provides an LED module having a concentrated light output window. Light output from a first output window of an LED assembly (e.g. from a plurality of LEDs) is passed to an input window of a light directing element and redirected to be emitted from a second, smaller output window of a light directing element. This difference in size thereby concentrates the light output by the light directing element. The second output window (of the light directing element) is substantially perpendicular to the first output window, allowing for the size of the LED assembly in a particular dimension to not be necessarily constrained by the size of the second output window.

Abstract: The present invention relates to a lighting device, in particular a headlamp for vehicles, at least comprising an array of light sources, consisting of first and second light sources being mounted within the same flat or curved plane, and a projecting optical system arranged to project light emitted by the light sources in a forward direction of the lighting device. At least one shifting element is arranged in front of said first light sources. The shifting element generates real or virtual emission positions of the light of said first light sources shifted towards or away from the projecting optical system with respect to emission positions of said second light sources. With the proposed lighting device, in addition to the main lighting function of illumination, a pattern or signature can be projected at one or several additional image planes. The lighting device thus e.g. allows the additional projection of branding or safety patterns.