Abstract: A three-dimensional measurement device includes: an illuminator that irradiates a measured object with a predetermined light; an imaging device that comprises: an imaging sensor displaceable at least in a vertical direction; and a both-sided telecentric optical system that causes the imaging sensor to form an image of a predetermined area on the measured object irradiated with the predetermined light; a conveyor that moves the illuminator and the imaging device relative to the measured object; and a controller that: executes three-dimensional measurement of a predetermined measurement object on the measured object, based on the taken image; measures a height of the predetermined area at least at a time prior to imaging of the predetermined area under the predetermined light; and changes a height position of the imaging sensor based on a measurement result to adjust an interval between the predetermined area and the imaging sensor to a predetermined distance.

Abstract: An inspection device includes: an irradiator that irradiates an object with near-infrared light; a spectroscope that disperses reflected light from the irradiated object; an imaging device that takes a spectroscopic image of the reflected light; a processor that: obtains spectral data of a plurality of points on the object, based on the spectroscopic image; defines a group of similar spectral data from among the spectral data of the plurality of points; extracts a group having a largest number of spectral data from the defined group; calculates an average of the spectral data of the extracted group; and detects a type of the object using a predetermined analysis of the object, based on the average.

Abstract: An inspection device includes: an irradiator that irradiates an object with near-infrared light; a spectroscope that has a slit where reflected light enters and that disperses the reflected light into wavelength component lights; an imaging device that comprises an imaging element that takes a spectroscopic image of the wavelength component lights; and a processor that: obtains spectral data based on the spectroscopic image; and detects a type of the object using a predetermined analysis based on the spectral data. Each of the wavelength component lights is a single wavelength light, the inspection device satisfies L?2P, where L is a width of each of the wavelength component lights in a wavelength dispersion direction on a light receiving surface of the imaging element and P is a width of a pixel in the wavelength dispersion direction on the light receiving surface.

Abstract: A component mounting system includes: a component mounting machine that mounts an electronic component having a predetermined electrode portion on a solder printed on a substrate, the electronic component being fixed to the substrate with a thermosetting adhesive; and an adhesive inspection device. The component mounting machine: sets, with regard to the electronic component to be fixed with the adhesive that cures at a temperature lower than a melting temperature of the solder, a target mounting height along a height direction perpendicular to a face of the substrate on which the adhesive is applied; and mounts the electronic component at the target mounting height. The target mounting height is: an ideal mounting height based on design data; or a height lower than the ideal mounting height by a value that corresponds to a sinking of the electronic component as a result of melting of the solder.

Abstract: A measurement apparatus includes an illumination device irradiating an object with a first and a second pattern, a camera taking image data of the object, a motor displacing the object, and a processor measuring the object, obtaining a first value of the object based on a first number of image data taken with the first pattern at a first number of phases at a first position, obtaining a gain and/or offset based on the first number of image data, obtaining a second value of the object based on the gain and/or offset and a second number of image data taken with the second pattern at a second number of phases at a second position, obtaining height data of the object based on the first and the second value, and obtaining the second value with an average of the gain and/or offset of pixels adjacent to each pixel.

Abstract: A three-dimensional measurement device includes: a projector including: a light source that emits a predetermined light; a grid that converts the light from the light source into a predetermined striped pattern; and a driver that moves the grid, and the projector projecting the striped pattern onto a measurement object; an imaging device that takes an image of the measurement object on which the striped pattern is projected; and a controller that: controls the projector and the imaging device to obtain a plurality of image data having different light intensity distributions; executes three-dimensional measurement of the measurement object by phase shifting based on the image data having different light intensity distributions; and obtains each of the image data among the image data having different light intensity distributions.

Abstract: A substrate inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder and a thermosetting adhesive applied on the substrate, the substrate inspection device including: an irradiator that irradiates the solder and the adhesive with light; an imaging device that takes an image of the irradiated solder and the irradiated adhesive; and a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group.

Abstract: A three-dimensional measurement device includes: a projector that includes: a light source that emits predetermined light; and a reflective optical modulator that converts the predetermined light into a predetermined striped pattern, wherein the projector projects the predetermined striped pattern onto a measurement object at a predetermined number of frames per unit time; an imaging device that takes an image of the measurement object projected with the predetermined striped pattern; a processor that: controls the projector and the imaging device to sequentially project a plurality of different ones of the predetermined striped pattern and take images of the plurality of different ones of the predetermined striped pattern to obtain a plurality of image data having different light intensity distributions; and executes three-dimensional measurement of the measurement object based on the plurality of image data.

Abstract: A solder printing inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder on the substrate on which a thermosetting adhesive is applied, the solder printing inspection device including: an irradiator that irradiates the solder with light; an imaging device that takes an image of the irradiated solder; a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group; outputs mounting position adjustment information to the component mounting machine.

Abstract: A board inspection apparatus is disclosed, which includes a surface-side irradiator irradiating a surface of each inspection area of a board, a surface-side camera taking a surface-side image of the surface, a rear face-side irradiator irradiating a rear face of each inspection area, a rear face-side camera taking a rear face-side image of the rear face, and a controller moving the surface-side irradiator and the surface-side camera to a position corresponding to the surface of each inspection area, moving the rear face-side irradiator and the rear face-side camera to a position corresponding to the rear face of each inspection area, and inspecting the surface and the rear face of each inspection area based on the surface-side image and the rear face-side image, respectively.

Abstract: A board inspection apparatus is disclosed, which includes one surface-side irradiator that irradiates a first area on a surface side of a board with first light, a surface-side camera that takes an image of the first area, one rear face-side irradiator that irradiates a second area on a rear face side of the board with second light, a rear face-side camera that takes an image of the second area; and a controller that inspects the first area based on image data obtained from the surface-side camera and the second area based on image data obtained from the rear face-side camera.

Abstract: A three-dimensional measurement device includes: an illuminator that irradiates a measured object with a predetermined light; an imaging device that comprises: an imaging sensor displaceable at least in a vertical direction; and a both-sided telecentric optical system that causes the imaging sensor to form an image of a predetermined area on the measured object irradiated with the predetermined light; a conveyor that moves the illuminator and the imaging device relative to the measured object; and a controller that: executes three-dimensional measurement of a predetermined measurement object on the measured object, based on the taken image; measures a height of the predetermined area at least at a time prior to imaging of the predetermined area under the predetermined light; and changes a height position of the imaging sensor based on a measurement result to adjust an interval between the predetermined area and the imaging sensor to a predetermined distance.

Abstract: A three-dimensional measurement device includes a light source and grid that irradiate a measurement object; a luminance controller that changes luminance levels of the light; a phase controller that changes phase levels of the light pattern; a camera that takes an image of the measurement object; and a processor that three-dimensionally measures a first measurement object area based on different image data taken by radiating a first light pattern in different phases; determines a relationship between a gain and offset determined according to an imaging condition based on the different image data; and three-dimensionally measures a second measurement object area based on two different image data taken by radiating a second light pattern in two different phases by using a gain and offset regarding each pixel determined according to a luminance value of each pixel in the two different image data and the determined relationship.

Abstract: A three-dimensional measurement device includes: a first irradiator that radiates a first light pattern from a first position toward an object; a first grid controller that controls a first grid to change phases of the first light pattern; a second irradiator that radiates a second light pattern from a second position toward the object; a second grid controller that controls the second grid to change phases of the second light pattern; a camera that takes an image of reflected light from the object; and a processor that: performs one of a first imaging process of imaging processes performed by radiation of the first light pattern and a second imaging process of imaging processes performed by radiation of the second light pattern; and subsequently performs the other imaging process without waiting for completion of the transfer or changeover of the first or the second grid involved in the one imaging process.

Abstract: A three-dimensional measurement device includes: a projector including: a light source that emits a predetermined light; a grid that converts the light from the light source into a predetermined striped pattern; and a driver that moves the grid, and the projector projecting the striped pattern onto a measurement object; an imaging device that takes an image of the measurement object on which the striped pattern is projected; and a controller that: controls the projector and the imaging device to obtain a plurality of image data having different light intensity distributions; executes three-dimensional measurement of the measurement object by phase shifting based on the image data having different light intensity distributions; and obtains each of the image data among the image data having different light intensity distributions.

Abstract: A PTP packaging machine includes: a filler that fills a predetermined content into pocket portions formed in a strip-shaped container film; a sealer that is provided on a downstream side of the filler and mounts a strip-shaped cover film to the container film to close the pocket portions and obtain a strip-shaped PTP film including the cover film mounted to the container film; and a puncher that is provided on a downstream side of the sealer and punches out an expected sheet portion of the PTP film that is a region of eventually forming a predetermined PTP sheet and thereby obtain the PTP sheet.

Abstract: A blister sheet includes a container film comprising pockets receiving a content, and a cover film mounted to the container film to close the pockets. The container and the cover film are made of synthetic resins. The cover film is thinner than the container film. One pair of cuts formed for each pocket passes through the container and the cover film and extends to the pocket such that each pocket is placed between the cuts. The container and the cover film are broken from the one pair of cuts toward the pocket. A cutting slit or perforation is formed in the container film to allow for separation of the blister sheet into sheet pieces. The cutting slit or perforation is extended to intersect with the cut and a portion of the cutting slit or perforation that intersects with the cut passes through the container and the cover film.

Abstract: A three-dimensional measurement device includes: a first irradiator that radiates a first light pattern from a first position toward an object; a first grid controller that controls a first grid to change phases of the first light pattern; a second irradiator that radiates a second light pattern from a second position toward the object; a second grid controller that controls the second grid to change phases of the second light pattern; a camera that takes an image of reflected light from the object; and a processor that: performs one of a first imaging process of imaging processes performed by radiation of the first light pattern and a second imaging process of imaging processes performed by radiation of the second light pattern; and subsequently performs the other imaging process without waiting for completion of the transfer or changeover of the first or the second grid involved in the one imaging process.

Abstract: A three-dimensional measurement device includes a light source and grid that irradiate a measurement object; a luminance controller that changes luminance levels of the light; a phase controller that changes phase levels of the light pattern; a camera that takes an image of the measurement object; and a processor that three-dimensionally measures a first measurement object area based on different image data taken by radiating a first light pattern in different phases; determines a relationship between a gain and offset determined according to an imaging condition based on the different image data; and three-dimensionally measures a second measurement object area based on two different image data taken by radiating a second light pattern in two different phases by using a gain and offset regarding each pixel determined according to a luminance value of each pixel in the two different image data and the determined relationship.

Abstract: A board inspection apparatus is disclosed, which includes a surface-side irradiator irradiating a surface of each inspection area of a board, a surface-side camera taking a surface-side image of the surface, a rear face-side irradiator irradiating a rear face of each inspection area, a rear face-side camera taking a rear face-side image of the rear face, and a controller moving the surface-side irradiator and the surface-side camera to a position corresponding to the surface of each inspection area, moving the rear face-side irradiator and the rear face-side camera to a position corresponding to the rear face of each inspection area, and inspecting the surface and the rear face of each inspection area based on the surface-side image and the rear face-side image, respectively.