Abstract: A board inspection apparatus is disclosed, which includes one surface-side irradiator that irradiates a first area on a surface side of a board with first light, a surface-side camera that takes an image of the first area, one rear face-side irradiator that irradiates a second area on a rear face side of the board with second light, a rear face-side camera that takes an image of the second area; and a controller that inspects the first area based on image data obtained from the surface-side camera and the second area based on image data obtained from the rear face-side camera.

Abstract: A measurement apparatus includes an illumination device irradiating an object with a first and a second pattern, a camera taking image data of the object, a motor displacing the object, and a processor measuring the object, obtaining a first value of the object based on a first number of image data taken with the first pattern at a first number of phases at a first position, obtaining a gain and/or offset based on the first number of image data, obtaining a second value of the object based on the gain and/or offset and a second number of image data taken with the second pattern at a second number of phases at a second position, obtaining height data of the object based on the first and the second value, and obtaining the second value with an average of the gain and/or offset of pixels adjacent to each pixel.

Abstract: A substrate inspection device and a component mounting device are provided. The solder inspection device and the component mounting device respectively have substrate support devices that support a rear face of a printed circuit board. The substrate support device includes backup pins that support the rear surface of the printed circuit board, a location determiner that determines locations of the backup pins, and a backup pin locator that places the backup pins at the locations of the backup pins determined by the location determiner. The location determiner determines positions for supporting areas of the rear face of the printed circuit board where an electrode is covered by a resist film and where neither electronic component nor solder is present, as the locations of the backup pins.

Abstract: A substrate inspection device and a component mounting device are provided. The solder inspection device and the component mounting device respectively have substrate support devices that support a rear face of a printed circuit board. The substrate support device includes backup pins that support the rear surface of the printed circuit board, a location determiner that determines locations of the backup pins, and a backup pin locator that places the backup pins at the locations of the backup pins determined by the location determiner. The location determiner determines positions for supporting areas of the rear face of the printed circuit board where an electrode is covered by a resist film and where neither electronic component nor solder is present, as the locations of the backup pins.