Abstract: A heat dissipation plate having a plate shape, and having a top surface and a bottom surface. At least the bottom surface has a center portion that protrudes in an upward direction at a center of the plate, and has a downward slope from the center portion to an outer edge of the plate, the top surface having the insulated circuit board bonded thereto. The heat dissipation plate has a fastening hole that penetrates the plate in a peripheral area. A peripheral portion of the bottom surface of the plate, provided between the outer edge and the fastening hole, is provided at a position downward relative to an inner portion of an opening edge of the fastening hole. The inner portion lies on a line passing through the center of the plate and a center of the fastening hole.

Abstract: A semiconductor module includes a circuit component including a wiring board on which a semiconductor element is mounted, a case having at a case front surface thereof a recess in which a nut is to be accommodated, and including a frame body surrounding a case opening in which the wiring board is disposed and a lid closing the case opening, and a lead including an external terminal extending in an extending direction along the case front surface, a bonded member bonded to the wiring board, and an intermediate member connecting the bonded member to the external terminal. The case has an abutting member that contacts the lead to prevent the lead from rotating about a boundary between the bonded member and the intermediate member, thereby preventing an increase in an angle between the extending direction of the external terminal portion and the case front surface.

Abstract: A power converter includes a case including an outlet with an outlet opening in a principal surface thereof, and a wiring member having, as an external connection portion, a portion that extends out from the outlet opening and is bent at the outlet opening toward the principal surface. The external connection portion of the wiring member has a first surface facing the principal surface and includes a spacer provided on the first surface at a position adjacent to the outlet opening. The spacer is sandwiched between the first surface of the drawn-out portion and the principal surface of the case.

Abstract: A semiconductor device, including a sealing body portion, a nut and a bus bar. The sealing body portion has a housing portion formed on a front surface thereof, the sealing body portion including a semiconductor chip contained therein and a plurality of pin-shaped external connection terminals electrically connected to the semiconductor chip. The nut has a screw hole and disposed in the housing portion. The bus bar is arranged opposite the housing portion, and includes a fastening area with an opening portion opposite the screw hole of the nut, and a bonding area that is outside the fastening area and is connected to the plurality of external connection terminals. The sealing body portion has a protrusion adjacent to the bonding area of the bus bar.