Semiconductor module

- FUJI ELECTRIC CO., LTD.
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Description

FIG. 1 is a front view of a semiconductor module showing our new design;

FIG. 2 is a rear view of the semiconductor module of FIG. 1;

FIG. 3 is a left side view of the semiconductor module of FIG. 1;

FIG. 4 is a right side view of the semiconductor module of FIG. 1;

FIG. 5 is a top view of the semiconductor module of FIG. 1;

FIG. 6 is a bottom view of the semiconductor module of FIG. 1;

FIG. 7 is a top, front, and right side perspective view of the semiconductor module of FIG. 1; and,

FIG. 8 is a cross sectional view taken along line 8-8 of FIG. 5.

Claims

The ornamental design for a semiconductor module, as shown and described.

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Patent History
Patent number: D827591
Type: Grant
Filed: Apr 20, 2017
Date of Patent: Sep 4, 2018
Assignee: FUJI ELECTRIC CO., LTD. (Kawasaki)
Inventors: Yoshinari Ikeda (Matsumoto), Motohito Hori (Matsumoto), Yuichiro Hinata (Matsumoto), Norihiro Daicho (Matsumoto)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/601,253