Abstract: An optical pickup device is provided which includes a first diffraction grating (45) that splits a light beam emitted from a light-emitting/-detecting element (31) into a zero-order light beam and positive and negative first-order light beams, a second diffraction grating (46) that diffracts return light from an optical disk (2) for traveling along a light path separate from that of the outgoing light, and a third diffraction grating (47) that corrects the deviation of the light path by diffracting the positive first-order light beam diffracted by the second diffraction grating (46). The light-emitting/-detecting element (31) provides a focusing error signal FE by detecting the negative first-order light beam, and a tracking error signal by detecting return portions of the positive and negative first-order light beams from the first diffraction grating (45).

Abstract: A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer surface or a stepped surface on a top edge part such that the external shock or stress applied to such an edge part is dissipated by the chamfer surface of the stepped surface.

Abstract: A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer surface or a stepped surface on a top edge part such that the external shock or stress applied to such an edge part is dissipated by the chamfer surface of the stepped surface.

Abstract: This invention is an optical pickup device having a composite optical element (32) which has a first diffraction grating (45) for splitting a light beam emitted from a light source (31) into zeroth-order light, plus-first-order light and minus-first-order light, a second diffraction grating (46) for diffracting the optical path of a return light beam from an optical disc (2), and a split prism (47) arranged at a position where the minus-first-order light diffracted by the second diffraction grating (46) is incident and adapted for splitting the minus-first-order light into a plurality of light beams. It also has a light receiving unit (35) for acquiring a focusing error signal FE by receiving each return light beam split by the split prism (47) and for acquiring a tracking error signal by receiving return light beams from the optical disc (2) of the plus-first-order light and the minus-first-order light split by the first diffraction grating (45).

Abstract: A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer surface or a stepped surface on a top edge part such that the external shock or stress applied to such an edge part is dissipated by the chamfer surface of the stepped surface.

Abstract: An optical pickup apparatus and an optical disc apparatus are adapted to raise the efficiency of utilization of the lasers of the apparatus for accurately detecting tracking errors by raising the intensity ratio of the beam of the 0-th order to the beams of the ±1st orders produced by splitting of the laser beam of the wavelength to be subjected to division by three.

Abstract: An optical pickup device is provided which includes a double-wavelength objective lens (34) that collects a light beam selectively emitted from a light-emitting/-detecting element (31) that selectively emits a plurality of light beams different in wavelength from each other, and also return light from an optical disk (2), a first diffraction grating (45) that splits the light beam emitted from a light-emitting/-detecting element (31) into three beams including a zero-order light beam and positive and negative first-order light beams, a second diffraction grating (46) that diffracts the return light for traveling along a light path separate from that of the outgoing light, and a third diffraction grating (47) that corrects a light-path deviation by diffracting the positive first-order light beam diffracted by the second diffraction grating (46).

Abstract: This invention is an optical pickup device having a composite optical element (32) which has a first diffraction grating (45) for splitting a light beam emitted from a light source (31) into zeroth-order light, plus-first-order light and minus-first-order light, a second diffraction grating (46) for diffracting the optical path of a return light beam from an optical disc (2), and a split prism (47) arranged at a position where the minus-first-order light diffracted by the second diffraction grating (46) is incident and adapted for splitting the minus-first-order light into a plurality of light beams. It also has a light receiving unit (35) for acquiring a focusing error signal FE by receiving each return light beam split by the split prism (47) and for acquiring a tracking error signal by receiving return light beams from the optical disc (2) of the plus-first-order light and the minus-first-order light split by the first diffraction grating (45).

Abstract: An optical pickup device is provided which includes a first diffraction grating (45) that splits a light beam emitted from a light-emitting/-detecting element (31) into a zero-order light beam and positive and negative first-order light beams, a second diffraction grating (46) that diffracts return light from an optical disk (2) for traveling along a light path separate from that of the outgoing light, and a third diffraction grating (47) that corrects the deviation of the light path by diffracting the positive first-order light beam diffracted by the second diffraction grating (46). The light-emitting/-detecting element (31) provides a focusing error signal FE by detecting the negative first-order light beam, and a tracking error signal by detecting return portions of the positive and negative first-order light beams from the first diffraction grating (45).

Abstract: A method includes a resin sealing step of placing, in a cavity 28 of a mold 20, a substrate 16 to which semiconductor elements 11 on which bumps 12 are arranged, a resin sealing step of supplying resin 35 to positions of the bumps 12 so that a resin layer 13 sealing the bumps 12 is formed, a protruding electrode exposing step of exposing at least ends of the bumps 12 sealed by the resin layer 13 so that ends of the bumps 12 are exposed from the resin layer 13, and a separating step of cutting the substrate 16 together with the resin layer 13 so that the semiconductor elements 11 are separated from each other.

Abstract: Disclosed is an optical head in which position adjustment of a photodetector light receiving surface or component parts may be simplified, production costs may be reduced and operational reliability may be improved. The optical head includes a light source 22, radiating light of a preset wavelength, an objective lens 27 for condensing the outgoing light from the light source 22 on an optical disc 2 and for condensing the return light from the optical disc 2, a beam splitter 25 for branching the optical path of the return light reflected by the optical disc 2, and for collimating the branched return light so as to be parallel to the outgoing light from the light source 22, a composite optical component including a splitting prism 30 arranged on a site of incidence of the branched return light for spatially splitting the return light, and a light receiving unit for receiving plural return light beams spatially split by the splitting prism 30 for producing focusing error signals.

Abstract: A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer surface or a stepped surface on a top edge part such that the external shock or stress applied to such an edge part is dissipated by the chamfer surface of the stepped surface.

Abstract: A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer surface or a stepped surface on a top edge part such that the external shock or stress applied to such an edge part is dissipated by the chamfer surface of the stepped surface.

Abstract: A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer surface or a stepped surface on a top edge part such that the external shock or stress applied to such an edge part is dissipated by the chamfer surface of the stepped surface.

Abstract: A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer surface or a stepped surface on a top edge part such that the external shock or stress applied to such an edge part is dissipated by the chamfer surface of the stepped surface.

Abstract: This invention is an optical pickup device having a composite optical element (32) which has a first diffraction grating (45) for splitting a light beam emitted from a light source (31) into zeroth-order light, plus-first-order light and minus-first-order light, a second diffraction grating (46) for diffracting the optical path of a return light beam from an optical disc (2), and a split prism (47) arranged at a position where the minus-first-order light diffracted by the second diffraction grating (46) is incident and adapted for splitting the minus-first-order light into a plurality of light beams. It also has a light receiving unit (35) for acquiring a focusing error signal FE by receiving each return light beam split by the split prism (47) and for acquiring a tracking error signal by receiving return light beams from the optical disc (2) of the plus-first-order light and the minus-first-order light split by the first diffraction grating (45).

Abstract: A semiconductor test apparatus tests a semiconductor device having plate connection terminals. The apparatus includes a test substrate having deformable connection parts connected with the plate connection terminals, and an upholding substrate which has upholding parts formed to project at a position that faces the connection part and which urges, in cooperation with the test substrate, the connection parts toward the plate connection terminals of the semiconductor device so as to electrically connect the connection parts to the plate connection terminals.

Abstract: A wafer level semiconductor device including a wafer having a plurality of semiconductor elements formed on an upper surface thereof, a sealing resin including a first part for sealing the upper surface of the wafer and a second part for sealing a side surface of wafer, the second part having a lower edge surface flush with a lower surface of the wafer, and a film for covering the lower surface of wafer and the lower edge surface of the second part of the sealing resin and conducting the process using the wafer level semiconductor device in which the film is bonded. This structure prevents warping of the wafer level semiconductor device after the sealing resin is formed on the device and it is then taken out from the mold dies.

Abstract: A method of producing semiconductor devices which have an excellent separability from a metal mold after resin encapsulation and thus eliminates the need to clean the metal mold. A metal mold for producing such semiconductor devices is also provided. According to the method of the present invention, the metal mold is first opened, and two separation sheets are disposed on dividing surfaces including cavity forming surfaces of a first metal mold and a second metal mold. A substrate is then placed on one of the separation sheets, with its semiconductor chip formed surface facing the second metal mold. An encapsulation resin is provided on the substrate placed on one of the separation sheets. The metal mold in a heated state is closed and pressed to form a resin layer for encapsulating electrodes formed on the substrate. The metal mold is again opened, and the resin-encapsulated substrate is taken out of the metal mold.

Abstract: A semiconductor device is provided, which device includes a semiconductor chip including external terminals formed on a surface thereof and a sealing resin formed on the surface of the semiconductor chip. A contaminant film formed on the surface of said semiconductor chip has a laser-processed edge so that a peripheral portion of the surface of said semiconductor chip is bonded to the sealing resin.