Abstract: A mold for press-molding a resin package body includes a lower mold and an upper mold, wherein the upper mold includes a press plate held in a tiltable manner with respect to a press head used for urging the upper mold against the lower mold and a lock mechanism for locking the press plate. The lower mold includes an inner die carrying a semiconductor device and a resin tablet and an outer die surrounding the inner die in a manner movable up and down with respect to the inner die. In operation, the press plate is first engaged with the outer die in the unlocked state to achieve an exact parallelism with respect to the inner die, and after locking the press plate and melting the resin tablet, the press plate is urged further toward the inner die while simultaneously lowering the outer die such that the space formed by the lower die, outer die and the press plate for accommodating a semiconductor chip is collapsed.

Abstract: In a semiconductor device of the present invention and a production method thereof, an electronic circuit is provided in a semiconductor substrate, the electronic circuit having terminals. An internal wiring pattern is provided in the substrate, the internal wiring pattern being connected to the electronic circuit terminals. A protective layer is provided on the substrate, the protective layer covering the substrate. Vias are provided on the substrate so as to project from the protective layer, the vias being connected to the internal wiring pattern at arbitrary positions on the substrate. An external wiring pattern is provided on the protective layer, the external wiring pattern being connected to the vias. Projection electrodes are connected to the external wiring pattern, the projection electrodes having a predetermined height above the external wiring pattern.

Abstract: A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer surface or a stepped surface on a top edge part such that the external shock or stress applied to such an edge part is dissipated by the chamfer surface of the stepped surface.

Abstract: A semiconductor device includes a semiconductor element having a circuit surface on which a projection electrode is formed, a seal resin which seals the circuit surface of the semiconductor element while exposing at least an end part of the projection electrode, a connect surface that is to face a board when the semiconductor device is implemented on the board, a back surface which is opposite to the connect surface, a side surface arranged between the connect surface and the back surface, and an organic material layer formed on the side surface.

Abstract: A semiconductor device is provided, which device includes a semiconductor substrate including a plurality of signal pads and ground pads, an insulating film formed on the semiconductor substrate, a conductive metal film formed on the insulating film and electrically connected to the ground pads and a plurality of first interconnection lines electrically connected to the signal pads and insulated from the conductive metal film. The conductive metal film is formed over a region including the first interconnection lines in a plan view of the semiconductor device.

Abstract: A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer surface or a stepped surface on a top edge part such that the external shock or stress applied to such an edge part is dissipated by the chamfer surface of the stepped surface.

Abstract: A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer surface or a stepped surface on a top edge part such that the external shock or stress applied to such an edge part is dissipated by the chamfer surface of the stepped surface.

Abstract: A semiconductor inspection apparatus performs a test on a to-be-inspected device which has a spherical connection terminal. This apparatus includes a conductor layer formed on a supporting film. The conductor layer has a connection portion. The spherical connection terminal is connected to the connection portion. At least a shape of the connection portion is changeable. The apparatus further includes a shock absorbing member, made of an elastically deformable and insulating material, for at least supporting the connection portion.

Abstract: A semiconductor test apparatus tests a semiconductor device having plate connection terminals. The apparatus includes a test substrate having deformable connection parts connected with the plate connection terminals, and an upholding substrate which has upholding parts formed to project at a position that faces the connection part and which urges, in cooperation with the test substrate, the connection parts toward the plate connection terminals of the semiconductor device so as to electrically connect the connection parts to the plate connection terminals.

Abstract: A method includes a resin sealing step of placing, in a cavity 28 of a mold 20, a substrate 16 to which semiconductor elements 11 on which bumps 12 are arranged, a resin sealing step of supplying resin 35 to positions of the bumps 12 so that a resin layer 13 sealing the bumps 12 is formed, a protruding electrode exposing step of exposing at least ends of the bumps 12 sealed by the resin layer 13 so that ends of the bumps 12 are exposed from the resin layer 13, and a separating step of cutting the substrate 16 together with the resin layer 13 so that the semiconductor elements 11 are separated from each other.

Abstract: A semiconductor test apparatus tests a semiconductor device having plate connection terminals. The apparatus includes a test substrate having deformable connection parts connected with the plate connection terminals, and an upholding substrate which has upholding parts formed to project at a position that faces the connection part and which urges, in cooperation with the test substrate, the connection parts toward the plate connection terminals of the semiconductor device so as to electrically connect the connection parts to the plate connection terminals.

Abstract: A semiconductor device is provided, which device includes a semiconductor substrate including a plurality of signal pads and ground pads, an insulating film formed on the semiconductor substrate, a conductive metal film formed on the insulating film and electrically connected to the ground pads and a plurality of first interconnection lines electrically connected to the signal pads and insulated from the conductive metal film. The conductive metal film is formed over a region including the first interconnection lines in a plan view of the semiconductor device.

Abstract: A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer surface or a stepped surface on a top edge part such that the external shock or stress applied to such an edge part is dissipated by the chamfer surface of the stepped surface.

Abstract: A semiconductor inspection apparatus performs a test on a to-be-inspected device which has a spherical connection terminal. This apparatus includes a conductor layer formed on a supporting film. The conductor layer has a connection portion. The spherical connection terminal is connected to said connection portion. At least a shape of said connection portion is changeable. The apparatus further includes a shock absorbing member, made of an elastically deformable and insulating material, for at least supporting said connection portion.

Abstract: A semiconductor inspection apparatus performs a test on a to-be-inspected device which has a spherical connection terminal. This apparatus includes a conductor layer formed on a supporting film. The conductor layer has a connection portion. The spherical connection terminal is connected to the connection portion. At least a shape of the connection portion is changeable. The apparatus further includes a shock absorbing member, made of an elastically deformable and insulating material, for at least supporting the connection portion.

Abstract: A method includes a resin sealing step of placing, in a cavity 28 of a mold 20, a substrate 16 to which semiconductor elements 11 on which bumps 12 are arranged, a resin sealing step of supplying resin 35 to positions of the bumps 12 so that a resin layer 13 sealing the bumps 12 is formed, a protruding electrode exposing step of exposing at least ends of the bumps 12 sealed by the resin layer 13 so that ends of the bumps 12 are exposed from the resin layer 13, and a separating step of cutting the substrate 16 together with the resin layer 13 so that the semiconductor elements 11 are separated from each other.

Abstract: An optical lens composed of a transparent material, wherein one surface thereof on a light source side is a convex aspherical surface of rotation symmetry defined by a function relative to the radial distance from an optical axis. The aspherical surface is shaped to be a curved one without any stepped region with regard to the radial direction in the defined area, and has a portion where the derivatives of the function are discontinuous at a predetermined radial position. Although not equipped with an iris diaphragm, this optical lens is capable of eliminating an incident light beam outside the optical effective surface thereof without deteriorating the optical characteristics.

Abstract: A semiconductor device including a semiconductor chip; a plurality of electrodes provided on a surface of the semiconductor chip; an insulative board which includes a plurality of conductive patterns, one end of each of the plurality of conductive patterns being protruded from a periphery of the insulative board so as to function as an outer terminal; a connecting element for electrically connecting the outer terminal to a corresponding one of the plurality of electrodes; and a conductive element which is in electrical contact with a corresponding one of the plurality of conductive patterns.

Abstract: A semiconductor device includes a semiconductor element; a wiring board including a base film on which a plurality of leads are provided; projecting electrodes, provided in an array, projecting from a lower surface of the wiring board; a plurality of leads, each of which has an inner lead portion connected to the semiconductor element and an outer lead portion connected to the projecting electrodes; a mounting hole provided in the base film for mounting the semiconductor element; and a supporting member supporting the wiring board and having a cavity for accommodating the semiconductor element in a position corresponding to the mounting hole. A pad portion for measurement is provided at a position spaced from the outer lead portion.