Abstract: A microelectronic device includes a substrate, a variable capacitor including a driving mechanism for varying capacitance stored by a pair of electrodes formed in a main surface of the substrate, a plurality of fixed capacitors having fixed capacitance stored by a plurality of pairs of electrodes formed in an opposite side of the main surface, wiring for electrically connecting the variable capacitor and the fixed capacitors, and switches disposed in the main surface of the substrate to electrically connect the variable capacitor and a capacitor or capacitors selected from the plurality of fixed capacitors.

Abstract: Means for forming a package is disclosed on which is mounted a semiconductor chip with a high-speed LSI formed thereon, using a wire bonding method. The package comprises a semiconductor chip, a die pad smaller than a main surface of the semiconductor chip, a sealing member, plural leads each comprising an outer terminal portion and an inner lead portion, and plural bonding wires for connection between bonding pads formed on the semiconductor chip and the inner lead portions of the leads, each of the inner lead portions being bent in a direction away from a mounting surface of the sealing member, thereby approximating the height of the chip-side bonding pads and that of a bonding position of the inner lead portions to each other, whereby the wire length can be made shorter and it is possible to suppress an increase in inductance of the wire portions and attain impedance matching at various portion of a high-frequency signal input/output transmission path.

Abstract: A high-frequency signal from a tape-shaped line section having a surface layer signal lead and surface layer GND lead disposed on both sides thereof is directly inputted to a semiconductor chip via a signal surface layer wiring of a package substrate and through solder bump electrodes. Alternatively, a high-frequency signal from the semiconductor chip is outputted to the outside via the tape-shaped line section in reverse. Owing to the transmission of the high-frequency signal by only a microstrip line at the whole surface layer of the package substrate, the high-frequency signal can be transmitted by only the microstrip line at the surface layer without through vias or the like. Accordingly, the high-frequency signal can be transmitted without a loss in frequency characteristic, and a high-quality high-frequency signal can be transmitted with a reduction in loss at high-frequency transmission.

Abstract: A high-frequency signal from a tape-shaped line section having a surface layer signal lead and surface layer GND lead disposed on both sides thereof is directly inputted to a semiconductor chip via a signal surface layer wiring of a package substrate and through solder bump electrodes. Alternatively, a high-frequency signal from the semiconductor chip is outputted to the outside via the tape-shaped line section in reverse. Owing to the transmission of the high-frequency signal by only a microstrip line at the whole surface layer of the package substrate, the high-frequency signal can be transmitted by only the microstrip line at the surface layer without through vias or the like. Accordingly, the high-frequency signal can be transmitted without a loss in frequency characteristic, and a high-quality high-frequency signal can be transmitted with a reduction in loss at high-frequency transmission.

Abstract: A magnetic head supporting apparatus having a magnetic head for reading and writing information on a magnetic disc, a slider for mounting the magnetic head, and a suspension for supporting the slider. An IC chip for controlling a signal of the magnetic head is mounted on a heat insulating substrate which substantially prevents conduction of heat therethough, and the heat insulating substrate is mounted to the suspension.

Abstract: A method of measuring a thermal resistance of laminated resin sandwiched by a first member and a second member according to the present invention includes measuring, as thermal resistance of resin, a sum of thermal resistance of an interface between the resin and the first member, thermal restistance of an interface between the resin and the second member, and thermal resistance caused by conduction of heat through the resin.

Abstract: A magnetic head supporting apparatus having a magnetic head for reading and writing information on a magnetic disc, a slider for mounting said magnetic head, and a suspension for supporting the slider. An IC chip for controlling a signal of the magnetic head is mounted on a heat insulating substrate, and the heat insulating substrate is mounted to the suspension.

Abstract: Conventionally, in the wavelength locking optical system, the wavelength as detected is deviated from a targeted range owing to the change of the peripheral temperature resulting from the temperature characteristics of the wavelength error detection device. To solve this prior issue, it is arranged such that a portion of the wavelength error detection device, through which portion light-beams passes, contacts a material of high heat conductivity.

Abstract: A magnetic head supporting apparatus includes a magnetic head for reading and writing information on a magnetic disc, a slider having the magnetic head, and a suspension for supporting the slider. An IC chip for controlling a signal of the magnetic head is mounted on a first surface of a heat insulating substrate, and a second surface of the heat insulating substrate opposite to the first surface thereof is mounted to the suspension.

Abstract: A multilayer wiring board having board having through holes in a thickness-wise direction, in which wiring board a semiconductor substrate mounted on the multi-layer wiring board has through holes in a thickness-wise direction, and entire areas, which the through holes in the semiconductor substrate occupy, in a plane orthogonal to the thickness-wise direction of the multilayer wiring board and of the semiconductor substrate are included in areas, which the through holes in the multilayer wiring board occupy.

Abstract: An electronic device comprises a substrate having electronic parts, electric conductive wires for electrically connecting between the electronic parts, a front surface on which the electronic parts and electric conductive wires are mounted, a reverse surface and at least one electronic part back portion opposite to the electronic parts; and at least one high thermal conductivity member, a thermal conductivity coefficient thereof being higher than that of the substrate, the high thermal conductivity member being connected to the electronic part back portion while the high thermal conductivity member is opposite to the electronic parts in a substrate width direction to decrease a difference in temperature between the electronic parts.

Abstract: Agitator blades formed by connecting a plurality of frame members are provided in a cylindrical or conical container to realize the agitator blade structure without rotary shaft. Therefore, less liquids being treated adhere onto the rotary shaft or the agitator blades and less residue of the liquids is formed, making it possible to obtain a final high viscosity polymer using the same agitator vessel preventing the quality from being deteriorated.

Abstract: Agitator blades formed by connecting a plurality of frame members are provided in a cylindrical or conical container to realize the agitator blade structure without rotary shaft. Therefore, less liquids being treated adhere onto the rotary shaft or the agitator blades and less residue of the liquids is formed, making it possible to obtain a final high viscosity polymer using the same agitator vessel preventing the quality from being deteriorated.

Abstract: A semiconductor device is fabricated by forming first metal balls on electrode pads of a semiconductor chip. The first metal balls each can have a sharp tipped anchor. All of the anchors simultaneously flattened slightly only to the extent of equalizing the height thereof. The first metal balls are bonded to electrodes formed on a substrate with wirings by embedding the anchors into the electrodes. Alternatively, second metal balls can be formed on the electrodes which are then flattened to equalize the height thereof. The first metal balls, either with or without the anchors, are bonded to the second metal balls. The first and second metal balls are preferably heated during the bonding step to soften the second metal balls.

Abstract: A vacuum processing unit and apparatus comprises a buffer chamber that can be evacuated, a processing chamber that can be communicated with said buffer chamber a first sample carrier installed in said buffer chamber, a vacuum opening/closing device provided in the buffer chamber to correspond to the first sample carrier, a vacuum prechamber provided for the buffer chamber via the vacuum opening/closing device, a second sample carrier which carries the sample between the vacuum prechamber and the first sample carrier via the vacuum opening/closing device, and a third sample carrier which carries the sample between said first sample carrier and the processing chamber. The vacuum processing units can be connected in groups via vacuum opening/closing devices provided for the buffer chambers in locations corresponding to the end of the first sample carriers therein. The number of connected processing chambers can be freely changed to meet a change in the process or the manufacturing line.

Abstract: The present invention relates to a plasma processor, and the plasma processor comprises a processing chamber, means to reduce a pressure in the processing chamber so as to evacuate the interior thereof, means to introduce a processing gas into the processing chamber, means to generate an electric field within the processing chamber, and means to establish a magnetic field orthogonal to the electric field, this means being rotatable relative to a surface to-be-processed of a sample which is processed in a plasma arising under the action of the electric field and the magnetic field, whereby a space required for the movement of the means to establish the magnetic field orthogonal to the electric field can be reduced to miniaturize the processor, and the uniform processing of the sample can be attained using rotatable plasma.

Abstract: The present invention is concerned with a dry-etching method wherein a gaseous mixture of boron trichloride, chlorine and a hydrocarbon, to be used as an etching gas, is converted into plasma to etch aluminum or its alloys with ions or radicals formed thereby. The invention makes it possible to accomplish the anisotropic etching of aluminum or its alloys at high speeds with a low RF power density.

Abstract: This invention relates to a method and apparatus for controlling temperature of a sample and is intended to prevent a sample from being deformed by the pressure of a heat transmission gas by mounting and fixing the sample being mounted and processed in a vacuum on and to the sample stand and supplying the heat transmission gas to the gap between the under surface of the sample thus fixed and the sample stand; effectively control the temperature of the sample being processed in a vacuum by limiting the size of the gap between the under surface of the sample and the sample stand; and make the heat transmission gas least affect the process by limiting the flow of the heat transmission gas in the vacuum process chamber.

Abstract: This invention relates to an air separation method and apparatus for liquefying and separating feed air into oxygen and nitrogen by use of a single rectification column. The temperature of the feed air, which is liquefied, is reduced to the temperature necessary for the condensation and liquefaction of pure vaporous nitrogen inside the single rectification column and is used to condense and liquefy the pure vaporous nitrogen and vaporize the feed air. After the pressure of the feed air thus vaporized is raised to the pressure necessary for the condensation and liquefaction of the pure vaporous nitrogen inside the single rectification column, the vaporized feed air is introduced into the single rectification column so that pure gaseous nitrogen can be withdrawn from the top of the single rectification column, pure gaseous oxygen from a lower portion of the column and waste gas rich in nitrogen from an intermediate portion of the column.

Abstract: A temperature control method for a reversing type heat exchanger group wherein an outlet temperature of reheating gas of an arbitrarily selected reversing type heat exchanger which serves as a reference in the reversing heat exchanger group is rendered equal in value to a reference control temperature set beforehand in such a manner so as to satisfy the sweeping temperature difference. The outlet temperatures of the reheating gas in the other reversing type heat exchangers of the reversing type heat exchanger group are rendered equal in value to the outlet temperature of the reheating gas in the reversing type heat exchanger serving as the reference. Thus, the temperature of the cold end of all of the reversing type heat exchangers of the reversing type heat exchanger group are caused to be balanced equally whereby ice and dry ice deposited on the feed water channels can be effectively removed by a sweeping action.