Abstract: An electrostatic chuck includes a plurality of ceramic substrates each having a step formed at a peripheral edge portion of one surface, the ceramic substrates being arranged adjacent to each other so that the steps face each other, electrodes each embedded in each of the plurality of ceramic substrates, and a filling portion that fills a groove portion formed by the facing steps of the adjacent ceramic substrates.

Abstract: An electrostatic chuck includes a plurality of ceramic substrates each having a step formed at a peripheral edge portion of one surface, the ceramic substrates being arranged adjacent to each other so that the steps face each other, electrodes each embedded in each of the plurality of ceramic substrates, and a filling portion that fills a groove portion formed by the facing steps of the adjacent ceramic substrates.

Abstract: An electrostatic chuck includes, a chuck function portion including a plurality of chuck regions on which an attractable object is placed respectively, and a concave surface portion provided in an outer region of the chuck regions, and electrodes arranged in an inner part of the chuck function portion corresponding to the chuck regions and an inner part of the chuck function portion corresponding to the concave surface portion, respectively.

Abstract: A wafer holding apparatus includes an electrostatic chuck configured to clamp an object, a baseplate made of aluminum and configured to support the electrostatic chuck, a water pathway portion disposed in contact with or inside the baseplate and made of a metal having higher corrosion resistance than aluminum, and a water pathway disposed inside the water pathway portion and having an entire wall surface thereof constituted by the water pathway portion, wherein the baseplate and the water pathway portion are directly bonded to each other.

Abstract: A substrate fixture includes a monopolar chuck main body comprising an insulated plate and an electrode embedded in the insulated plate, a tray placed on the chuck main body, having an upper surface in which a plurality of concave parts for accommodating therein a plurality of substrates is formed, and formed of an insulator having a volume resistivity equal to or lower than a volume resistivity of the insulated plate, and an yttrium oxide layer formed on the upper surface of the tray.

Abstract: An electrostatic chuck device includes a base plate, an electrostatic chuck plate coupled to an upper surface of the base plate and including a mount region on which an attraction subject is mounted, an electrostatic electrode embedded in the chuck plate, a focus ring that is located on the upper surface of the base plate and covers an outer side surface and a portion of an upper surface of the chuck plate. A groove is located in the upper surface of the chuck plate at a portion that corresponds to a region between the focus ring and the mount region in a plan view. The groove is filled with a protective layer. The groove is located at a position separated from the electrostatic electrode in a plan view. The protective layer is formed from a material having a higher plasma resistance than a material forming the chuck plate.

Abstract: An electrostatic chuck includes a base plate including a penetration hole, a cylindrical insulating component inserted in the penetration hole, the cylindrical insulating component including a protruding portion protruding from an upper end of the penetration hole, a placing table arranged on the base plate, a dent portion formed in a lower face of the placing table, the dent portion in which the protruding portion of the cylindrical insulating component is fitted, a concave portion formed in the dent portion of the placing table, an electrode formed in the concave portion of the placing table, and a power feeding terminal arranged in an inner part of the cylindrical insulating component, the power feeding terminal connected to the electrode.

Abstract: A substrate fixture includes a monopolar chuck main body comprising an insulated plate and an electrode embedded in the insulated plate, a tray placed on the chuck main body, having an upper surface in which a plurality of concave parts for accommodating therein a plurality of substrates is formed, and formed of an insulator having a volume resistivity equal to or lower than a volume resistivity of the insulated plate, and an yttrium oxide layer formed on the upper surface of the tray.

Abstract: A wafer holding apparatus includes an electrostatic chuck configured to clamp an object, a baseplate made of aluminum and configured to support the electrostatic chuck, a water pathway portion disposed in contact with or inside the baseplate and made of a metal having higher corrosion resistance than aluminum, and a water pathway disposed inside the water pathway portion and having an entire wall surface thereof constituted by the water pathway portion, wherein the baseplate and the water pathway portion are directly bonded to each other.

Abstract: A tray includes a support base having both a first face on which a clamp object is placed and a second face opposite the first face, an upper electrode embedded in the support base and situated toward the first face, a lower electrode embedded in the support base and situated further toward the second face than the upper electrode is, and one or more interconnect lines configured to provide an electrical connection between the upper electrode and the lower electrode.

Abstract: An electrostatic chuck includes a pedestal part formed of metal and including a gas passage, an insulation substrate mounted on the pedestal part and including a first surface facing the pedestal part and a second surface on an opposite side of the first surface, the first surface including a first hole part communicating with the gas passage, the second surface including a second hole part having a bore diameter less than that of the first hole part and communicating with the first hole part, and an insulation flow part formed of an insulating material and including a first end provided in the first hole part and a second end provided in the gas passage. The insulation flow part is configured to allow a gas supplied from the gas passage to flow into the second hole part.

Abstract: An electrostatic chuck device includes a base plate, an electrostatic chuck plate coupled to an upper surface of the base plate and including a mount region on which an attraction subject is mounted, an electrostatic electrode embedded in the chuck plate, a focus ring that is located on the upper surface of the base plate and covers an outer side surface and a portion of an upper surface of the chuck plate. A groove is located in the upper surface of the chuck plate at a portion that corresponds to a region between the focus ring and the mount region in a plan view. The groove is filled with a protective layer. The groove is located at a position separated from the electrostatic electrode in a plan view. The protective layer is formed from a material having a higher plasma resistance than a material forming the chuck plate.

Abstract: An electrostatic chuck apparatus includes a pedestal part including a side surface, an electrostatic chuck including a side surface and provided on the pedestal part, an adhesive part including a side surface and provided between the pedestal part and the electrostatic chuck, the adhesive part containing a resin adhesive agent that adheres the pedestal part and the electrostatic chuck together, a recess part provided in a portion of the side surface of the pedestal part and a portion of the side surface of the electrostatic chuck, the recess part being provided in an area that includes a side surface of the adhesive part, the recess part being provided along an outer periphery of the pedestal part, an outer periphery of the adhesive part, and an outer periphery of the electrostatic chuck, and a focus ring engaged with the recess part and covering the side surface of the adhesive part.

Abstract: An electrostatic chuck includes a base having a first through hole extending through the base. An electrostatic chuck attraction plate is bonded to the base. An attraction electrode is incorporated in the electrostatic chuck attraction plate to generates electrostatic charge and electrostatically attract an attraction subject. A recess is formed in the electrostatic chuck attraction plate in alignment with the first through hole. The recess partially exposes the attraction electrode. An adhesive layer is formed between the electrostatic chuck attraction plate and the base. The adhesive layer covers an inner surface of the recess. A tubular insulator is arranged in the recess. The tubular insulator includes a second through hole. A power supply terminal is arranged in the first through hole and the second through hole. The power supply terminal includes a distal portion electrically connected to the attraction electrode.

Abstract: A tray includes a support base having both a first face on which a clamp object is placed and a second face opposite the first face, an upper electrode embedded in the support base and situated toward the first face, a lower electrode embedded in the support base and situated further toward the second face than the upper electrode is, and one or more interconnect lines configured to provide an electrical connection between the upper electrode and the lower electrode.

Abstract: An electrostatic chuck includes a base plate including a penetration hole, a cylindrical insulating component inserted in the penetration hole, the cylindrical insulating component including a protruding portion protruding from an upper end of the penetration hole, a placing table arranged on the base plate, a dent portion formed in a lower face of the placing table, the dent portion in which the protruding portion of the cylindrical insulating component is fitted, a concave portion formed in the dent portion of the placing table, an electrode formed in the concave portion of the placing table, and a power feeding terminal arranged in an inner part of the cylindrical insulating component, the power feeding terminal connected to the electrode.

Abstract: A dielectric layer for an electrostatic chuck is formed of a ceramic material having a first phase including aluminum oxide and a second phase including composite carbonitride (Ti, Me)(C, N) that contains titanium as fine grains. The Me represents a transition element and metals of Group 4 to Group 6 such as Mo and W. The ceramic material that includes the second phase by 0.05 vol % to 2.5 vol % has a volume resistivity value of about 108 to 1013 (?·cm) necessary for a Johnsen-Rahbek type electrostatic chuck.

Abstract: An electrostatic chuck apparatus includes a pedestal part including a side surface, an electrostatic chuck including a side surface and provided on the pedestal part, an adhesive part including a side surface and provided between the pedestal part and the electrostatic chuck, the adhesive part containing a resin adhesive agent that adheres the pedestal part and the electrostatic chuck together, a recess part provided in a portion of the side surface of the pedestal part and a portion of the side surface of the electrostatic chuck, the recess part being provided in an area that includes a side surface of the adhesive part, the recess part being provided along an outer periphery of the pedestal part, an outer periphery of the adhesive part, and an outer periphery of the electrostatic chuck, and a focus ring engaged with the recess part and covering the side surface of the adhesive part.

Abstract: A disclosed substrate temperature adjusting-fixing device includes an electro static chuck attracting and holding an attractable object onto a base body having a built-in electrode by applying a voltage to the electrode, a base plate fixing the electro static chuck via an adhesive layer, a power supplying portion electrically connected to the electrode, and a retaining portion holding the power supplying portion, wherein the retaining portion includes a main body and a sealing portion, the main body is fixed to the base plate and has recesses opened on an opposite side of the adhesive layer and a through hole penetrating through the main body, the power supplying portion includes an electrode pin and an electric wire, the electric wire is wired inside the adhesive layer, the through hole and the recesses to electrically connect the electrode with the electrode pin, and the sealing portion fills the recesses.

Abstract: A dielectric layer for an electrostatic chuck is formed of a ceramic material having a first phase including aluminum oxide and a second phase including composite carbonitride (Ti, Me)(C, N) that contains titanium as fine grains. The Me represents a transition element and metals of Group 4 to Group 6 such as Mo and W. The ceramic material that includes the second phase by 0.05 vol % to 2.5 vol % has a volume resistivity value of about 108 to 1013 (?·cm) necessary for a Johnsen-Rahbek type electrostatic chuck.