Patents by Inventor Norio Wada
Norio Wada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11932696Abstract: The present invention provides a pharmaceutical composition for cancer treatment comprising an antibody against CCR8.Type: GrantFiled: December 28, 2020Date of Patent: March 19, 2024Assignees: SHIONOGI & CO., LTD., OSAKA UNIVERSITYInventors: Tetsuya Yoshida, Yujiro Kidani, Mitsunobu Matsumoto, Takayuki Kanazawa, Satomi Shinonome, Kanji Hojo, Naganari Ohkura, Shimon Sakaguchi, Atsushi Tanaka, Hisashi Wada, Atsunari Kawashima, Norio Nonomura
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Patent number: 11894246Abstract: A bonding apparatus includes a first holder, a second holder, an attracting pressure generator and a lift pin. The first holder is configured to hold a first substrate. The second holder, disposed at a position facing the first holder, has an attraction surface configured to attract a second substrate to be bonded to the first substrate. The attracting pressure generator is configured to generate an attracting pressure in the attraction surface. The lift pin is configured to space the second substrate on the attraction surface apart from the second holder. The second holder is provided with a space including an opening through which the lift pin passes, and the space is controlled to have a pressure lower than an atmospheric pressure.Type: GrantFiled: August 2, 2022Date of Patent: February 6, 2024Assignee: TOKYO ELECTRON LIMITEDInventors: Norio Wada, Shintaro Sugihara
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Publication number: 20230039173Abstract: A bonding apparatus includes a first holder, a second holder, an attracting pressure generator and a lift pin. The first holder is configured to hold a first substrate. The second holder, disposed at a position facing the first holder, has an attraction surface configured to attract a second substrate to be bonded to the first substrate. The attracting pressure generator is configured to generate an attracting pressure in the attraction surface. The lift pin is configured to space the second substrate on the attraction surface apart from the second holder. The second holder is provided with a space including an opening through which the lift pin passes, and the space is controlled to have a pressure lower than an atmospheric pressure.Type: ApplicationFiled: August 2, 2022Publication date: February 9, 2023Inventors: Norio Wada, Shintaro Sugihara
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Publication number: 20230014665Abstract: A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member.Type: ApplicationFiled: September 21, 2022Publication date: January 19, 2023Inventors: Kimio Motoda, Norifumi Kohama, Norio Wada, Yosuke Omori, Kenji Sugakawa
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Patent number: 11482431Abstract: A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member.Type: GrantFiled: January 11, 2019Date of Patent: October 25, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Kimio Motoda, Norifumi Kohama, Norio Wada, Yosuke Omori, Kenji Sugakawa
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Patent number: 10964563Abstract: A local deformation which is generated on bonded substrates can be reduced. A bonding apparatus includes a first holding unit configured to attract and hold a first substrate from above; a second holding unit configured to attract and hold a second substrate from below; a striker configured to bring the first substrate into contact with the second substrate by pressing a central portion of the first substrate from above; a moving unit configured to move the second holding unit between a non-facing position where the second holding unit does not face the first holding unit and a facing position where the second holding unit faces the first holding unit; and a temperature control unit disposed to face the second holding unit placed at the non-facing position and configured to locally adjust a temperature of the second substrate attracted to and held by the second holding unit.Type: GrantFiled: May 1, 2018Date of Patent: March 30, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Norio Wada, Norifumi Kohama, Kimio Motoda
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Publication number: 20210035827Abstract: A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member.Type: ApplicationFiled: January 11, 2019Publication date: February 4, 2021Inventors: Kimio Motoda, Norifumi Kohama, Norio Wada, Yosuke Omori, Kenji Sugakawa
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Publication number: 20180323089Abstract: A local deformation which is generated on bonded substrates can be reduced. A bonding apparatus includes a first holding unit configured to attract and hold a first substrate from above; a second holding unit configured to attract and hold a second substrate from below; a striker configured to bring the first substrate into contact with the second substrate by pressing a central portion of the first substrate from above; a moving unit configured to move the second holding unit between a non-facing position where the second holding unit does not face the first holding unit and a facing position where the second holding unit faces the first holding unit; and a temperature control unit disposed to face the second holding unit placed at the non-facing position and configured to locally adjust a temperature of the second substrate attracted to and held by the second holding unit.Type: ApplicationFiled: May 1, 2018Publication date: November 8, 2018Inventors: Norio Wada, Norifumi Kohama, Kimio Motoda
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Patent number: 9469093Abstract: A bonding apparatus according to an exemplary embodiment of the present disclosure includes a first holding unit, a second holding unit, a pressing mechanism and a holding mechanism. The first holding unit is provided with a first heating mechanism and holds a first substrate. The second holding unit disposed facing the first holding unit and provided with a second heating mechanism, holds a second substrate. The pressing mechanism relatively moves the first holding unit and the second holding unit in order to contact and press the first substrate and the second substrate. The holding mechanism elastically holds an outer periphery of the first holding unit and the second holding unit.Type: GrantFiled: April 10, 2014Date of Patent: October 18, 2016Assignee: Tokyo Electron LimitedInventors: Norio Wada, Goro Furutani, Satoshi Ookawa
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Patent number: 9165803Abstract: A bonding method according to an exemplary embodiment of the present disclosure includes a first holding processing, a second holding processing, a temporary bonding processing, a temperature increasing processing and a main bonding processing. In the first holding processing, a target substrate is held. In the second holding processing, a glass substrate held by electrostatic adsorption. In the temporary bonding processing, the target substrate and the glass substrate are temporarily bonded with a pressing force lower than a predetermined pressing force at a temperature lower than a predetermined temperature. In the temperature increasing processing, while releasing the electrostatic adsorption of the glass substrate at the same time as or after the temporary bonding, the temperature is increased to the predetermined temperature. In the main bonding processing, a main bonding of the target substrate and the glass substrate is performed with the predetermined pressing force.Type: GrantFiled: April 17, 2014Date of Patent: October 20, 2015Assignee: Tokyo Electron LimitedInventors: Goro Furutani, Norio Wada, Satoshi Ookawa
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Patent number: 9093222Abstract: Provided is a dye adsorption unit including a processing tank of which the upper surface is opened, in order to perform a batch dye adsorption process for a predetermined number of substrates. The dye adsorption unit further includes, as a moving system around the processing tank, a boat capable of going in and out of the processing tank from the upper opening, a boat transport unit that serves for the boat to go in and out of the processing tank, and a top cover for detachably closing the upper opening. Further, the dye adsorption unit includes a dye solution supply unit for supplying the dye solution into the processing tank, and a flow control unit for controlling the flow of the dye solution in the processing tank during the dye adsorption processing.Type: GrantFiled: September 27, 2011Date of Patent: July 28, 2015Assignee: Tokyo Electron LimitedInventors: Goro Furutani, Takashi Terada, Yoshiteru Fukuda, Norio Wada
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Patent number: 9005385Abstract: A bonding apparatus according to an exemplary embodiment of the present disclosure includes a first holding unit, a second holding unit, a first cooling mechanism, a second cooling mechanism, a third heating mechanism and a fourth heating mechanism. The first holding unit has a first heating mechanism and holds a first substrate. The second holding unit has a second heating mechanism and holds a second substrate. The pressing mechanism contacts and presses the first substrate and the second substrate. The first cooling mechanism cools the first substrate through the first holding unit. The second cooling mechanism cools the second substrate through the second holding unit. The third heating mechanism heats the first cooling mechanism. The fourth heating mechanism heats the second cooling mechanism.Type: GrantFiled: April 10, 2014Date of Patent: April 14, 2015Assignee: Tokyo Electron LimitedInventors: Norio Wada, Goro Furutani, Satoshi Ookawa
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Publication number: 20150072075Abstract: A film-forming apparatus includes an aerosol generation device which generates an aerosol including a solution of a film-forming material dispersed in a carrier gas, a chamber which vaporizes the aerosol such that fine particles of the film-forming material are generated from the aerosol that is generated by the aerosol generation device, a nozzle which discharges the fine particles generated by the chamber toward a substrate, and a moving mechanism which executes relative movement of the nozzle and the substrate along a surface of the substrate. The nozzle has a discharge port which discharges the fine particles to a slit-shaped region extending in a direction orthogonal to a moving direction of the relative movement between the nozzle and the substrate executed by the moving mechanism.Type: ApplicationFiled: November 14, 2014Publication date: March 12, 2015Applicant: TOKYO ELECTRON LIMITEDInventor: Norio WADA
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Publication number: 20140329341Abstract: A bonding method according to an exemplary embodiment of the present disclosure includes a first holding processing, a second holding processing, a temporary bonding processing, a temperature increasing processing and a main bonding processing. In the first holding processing, a target substrate is held. In the second holding processing, a glass substrate held by electrostatic adsorption. In the temporary bonding processing, the target substrate and the glass substrate are temporarily bonded with a pressing force lower than a predetermined pressing force at a temperature lower than a predetermined temperature. In the temperature increasing processing, while releasing the electrostatic adsorption of the glass substrate at the same time as or after the temporary bonding, the temperature is increased to the predetermined temperature. In the main bonding processing, a main bonding of the target substrate and the glass substrate is performed with the predetermined pressing force.Type: ApplicationFiled: April 17, 2014Publication date: November 6, 2014Applicant: Tokyo Electron LimitedInventors: Goro Furutani, Norio Wada, Satoshi Ookawa
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Publication number: 20140318680Abstract: A bonding apparatus according to an exemplary embodiment of the present disclosure includes a first holding unit, a second holding unit, a pressing mechanism and a holding mechanism. The first holding unit is provided with a first heating mechanism and holds a first substrate. The second holding unit disposed facing the first holding unit and provided with a second heating mechanism, holds a second substrate. The pressing mechanism relatively moves the first holding unit and the second holding unit in order to contact and press the first substrate and the second substrate. The holding mechanism elastically holds an outer periphery of the first holding unit and the second holding unit.Type: ApplicationFiled: April 10, 2014Publication date: October 30, 2014Applicant: TOKYO ELECTRON LIMITEDInventors: Norio Wada, Goro Furutani, Satoshi Ookawa
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Publication number: 20140318711Abstract: A bonding apparatus according to an exemplary embodiment of the present disclosure includes a first holding unit, a second holding unit, a first cooling mechanism, a second cooling mechanism, a third heating mechanism and a fourth heating mechanism. The first holding unit has a first heating mechanism and holds a first substrate. The second holding unit has a second heating mechanism and holds a second substrate. The pressing mechanism contacts and presses the first substrate and the second substrate. The first cooling mechanism cools the first substrate through the first holding unit. The second cooling mechanism cools the second substrate through the second holding unit. The third heating mechanism heats the first cooling mechanism. The fourth heating mechanism heats the second cooling mechanism.Type: ApplicationFiled: April 10, 2014Publication date: October 30, 2014Applicant: Tokyo Electron LimitedInventors: Norio Wada, Goro Furutani, Satoshi Ookawa
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Publication number: 20130323934Abstract: [Problem] To significantly reduce processing time of a step of adsorbing dye in a porous semiconductor layer on a substrate surface. [Solution] A flow of a dye solution is formed in a gap between solution guide surface (92L, 92R) of a nozzle (20) and a substrate (G) during the treatment, and a porous semiconductor layer of a treated surface of the substrate is subject to dye adsorption treatment in this flow of the dye solution. Furthermore, impact pressure from slit-like discharge openings (88L, 88R) and pressure of turbulent flow in groove-like uneven sections (92L, 92R) act in the vertical direction in addition to the flow of the dye solution. Thus, aggregation and association of the dye are hardly caused on a surface part of the porous semiconductor layer of the treated surface of the substrate, the dye efficiently penetrates deeply into the porous semiconductor layer, and the dye adsorption into the porous semiconductor layer proceeds at high speed.Type: ApplicationFiled: October 12, 2011Publication date: December 5, 2013Applicant: TOKYO ELECTRON LIMITEDInventors: Norio Wada, Takashi Terada, Yoshiteru Fukuda, Goro Furutani
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Publication number: 20130316485Abstract: [Problem] To significantly reduce the processing time of a step in which a coloring matter is adsorbed onto a porous semiconductor layer formed on the surface to be treated of a substrate. [Solution] A dye adsorption unit (20) includes a processing tank (30) of which the upper surface is opened, in order to perform a batch dye adsorption process for a predetermined number of substrates (G). The dye adsorption unit (20) further includes, as a moving system around the processing tank (30), a boat (32) capable of going in and out of the processing tank (30) from the upper opening, a boat transport unit (34) that serves for the boat (32) to go in and out of the processing tank (30), and a top cover (36) for detachably closing the upper opening. Further, the dye adsorption unit (20) includes a dye solution supply unit for supplying the dye solution into the processing tank (30), and a flow control unit for controlling the flow of the dye solution in the processing tank during the dye adsorption processing.Type: ApplicationFiled: September 27, 2011Publication date: November 28, 2013Applicant: TOKYO ELECTRON LIMITEDInventors: Goro Furutani, Takashi Terada, Yoshiteru Fukuda, Norio Wada
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Publication number: 20080160260Abstract: A friction material for brakes is formed by molding and hardening a raw material composition mainly containing a fibrous substrate, a friction adjuster, an organic filler, an inorganic filler and a binder in the form of a thermosetting resin. The friction material further contains aggregates of fine alumina particles, the aggregates having an average particle diameter of 30 to 60 ?m, and the alumina particles having a particle diameter of 0.2 to 0.9 ?m.Type: ApplicationFiled: November 19, 2007Publication date: July 3, 2008Inventors: Norio Wada, Hiroshi Kobayashi, Hiroya Kishimoto
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Patent number: 5384204Abstract: A tape useful for an automatic bonding process when manufacturing a high-frequency semiconductor device, the tape comprising an insulating flexible film, and circuit patterns consisting of copper or copper-alloy formed on the insulating film, each of the circuit patterns having inner and an outer lead portions. A tin or tin-lead plated film is formed on the pattern, and an intermediate plated film is formed on at least the outer lead portion as an underlayer. The intermediate plated film consists of a metal or metal alloy selected from nickel, cobalt, gold, silver, platinum, palladium, indium or rhodium.Type: GrantFiled: December 14, 1993Date of Patent: January 24, 1995Assignee: Shinko Electric Industries Co. Ltd.Inventors: Kazuhito Yumoto, Norio Wakabayashi, Masao Nakazawa, Shinichi Wakabayashi, Norio Wada, Fumio Kuraishi, Toshihiko Shimada