Abstract: A semiconductor device has a semiconductor element mounted on inner leads of a TAB tape and first and second heat radiator elements having respective first and second peripheral flanges which cooperatively engage and thereby support the TAB tape in a sandwich manner therebetween, at least one heat radiator member having a central portion protruding toward and providing a support for the semiconductor element. A sealing resin fills the space between the heat radiator members and thereby integrally interconnects and hermetically seals interior surfaces of the leads of the TAB tape. A central portion of at least one of the heat radiator members protrudes toward and provides a support for the semiconductor element.

Abstract: A TAB tape or tape-like carrier used for an automatic bonding process when manufacturing high-frequency semiconductor devices has a plurality of electrically conductive circuit patterns on a flexible insulative film having a plurality of holes located in gaps between adjacent circuit patterns. A ground layer is formed on a back surface of the insulative film, and electrically conductive layers or material are formed on inner peripherals walls of the holes or filled in the holes, so that the ground layer is electrically connected to the respective condcutive layers or material.

Abstract: A TAB tape or tape-like carrier used for an automatic bonding process when manufacturing high-frequency semiconductor devices has a plurality of electrically conductive circuit patterns on a flexible insulative film having a plurality of holes located in gaps between adjacent circuit pattterns. A ground layer is formed on a back surface of the insulative film, and electrically conductive layers or material are formed on inner peripherals walls of the holes or filled in the holes, so that the ground layer is electrically connected to the respective conductive layers or material.

Abstract: A nuclear fuel assembly support grid includes a multiplicity of spring structures for engaging fuel rods extending through the cells of the grid. Each spring structure is formed on each cell wall section to form a matrix of fuel rod receiving cells in the grid. Each spring structure is composed of a pair of spaced apart upper and lower opposite outer portions being integrally attached at their outer ends to the respective wall section, and a middle portion disposed between in laterally spaced relation from the outer portions and integrally connected at its outer ends with respective inner ends of the outer portions. The integrally-connected outer and middle portions are defined by a pair of generally U-shaped slots formed in a reverse interlocking relation to one another in the wall section of the one cell.

Abstract: This invention relates to an improvement of the adhesion of a metallic material such as copper, copper alloys and other metals coated therewith with a vulcanizable rubber composition. It is realized by previously adding orthoboric acid or a metal borate to the rubber composition in order to proceed with metal-rubber bonding reaction and vulcanization reaction in good balance, and vulcanizing an assembly of the metallic material and the boric compound containing rubber composition closely contacted therewith.