Abstract: A component-embedded substrate includes a first wiring substrate, an electronic component provided on the first wiring substrate, an intermediate wiring substrate provided around the electronic component on the first wiring substrate and connected to the first wiring substrate via a first connection member, a second wiring substrate provided above the first wiring substrate, the electronic component and the intermediate wiring substrate, and connected to the intermediate wiring substrate via a second connection member, and an encapsulating resin filled between the first wiring substrate and the second wiring substrate and covering the electronic component and the intermediate wiring substrate. Side surfaces of the intermediate wiring substrate are entirely covered by the encapsulating resin.

Abstract: A component-embedded substrate includes a first wiring substrate, an electronic component provided on the first wiring substrate, an intermediate wiring substrate provided around the electronic component on the first wiring substrate and connected to the first wiring substrate via a first connection member, a second wiring substrate provided above the first wiring substrate, the electronic component and the intermediate wiring substrate, and connected to the intermediate wiring substrate via a second connection member, and an encapsulating resin filled between the first wiring substrate and the second wiring substrate and covering the electronic component and the intermediate wiring substrate. Side surfaces of the intermediate wiring substrate are entirely covered by the encapsulating resin.

Abstract: In a precision machine tool wherein a spindle head that is movable in the up and down direction is disposed on a column disposed on a bed and a water storage space for storing temperature-regulated cooling water is formed inside the column, the column has, in a lower part thereof, intake ports through which cooling water is led into the water storage space, the column has, in an upper part thereof, and an air vent hole through which air in the column is discharged is formed at a position higher than the drain opening.

Abstract: In a precision machine tool wherein a spindle head 20 that is movable in the up and down direction is disposed on a column 14 disposed on a bed 10 and a water storage space for storing temperature-regulated cooling water is formed inside the column 14, the column 14 has, in a lower part thereof, intake ports 38a and 38b through which cooling water is led into the water storage space, the column 14 has, in an upper part thereof, a drain opening 40 through which a cooling water is led outside, and an air vent hole 49 through which air in the column is discharged is formed at a position higher than the drain opening 40.

Abstract: In a precision machine tool wherein a spindle head 20 that is movable in the up and down direction is disposed on a column 14 disposed on a bed 10 and a water storage space for storing temperature-regulated cooling water is formed inside the column 14, the column 14 has, in a lower part thereof, intake ports 38a and 38b through which cooling water is led into the water storage space, the column 14 has, in an upper part thereof, a drain opening 40 through which a cooling water is led outside, and an air vent hole 49 through which air in the column is discharged is formed at a position higher than the drain opening 40.

Abstract: A semiconductor package includes a plurality of connection pads, which are electrically connected to connection terminals of a mounted component that is mounted on the semiconductor package, and recognition marks. The recognition marks are formed respectively within the area of each of at least two of the connection pads. Each recognition mark has an area that is smaller than the area of the connection mark in which it is formed.

Abstract: In a manufacturing method of a machine tool including: a table having a workpiece mount face on which a workpiece is placed; a spindle head; and a relative movement mechanism for moving the spindle head relative to the table, the spindle head including: a spindle head body; a spindle rotatably supported by the spindle head body via a bearing mechanism and having a tool at an end thereof; and a rotary drive source for rotating the spindle, a plurality of types of structural members of different shapes being made of a carbon fiber reinforced plastic are prepared in advance and the structural members of the different shapes are combined to provide the spindle head body.

Abstract: In a precision machine tool wherein a spindle head 20 that is movable in the up and down direction is disposed on a column 14 disposed on a bed 10 and a water storage space for storing temperature-regulated cooling water is formed inside the column 14, the column 14 has, in a lower part thereof, intake ports 38a and 38b through which cooling water is led into the water storage space, the column 14 has, in an upper part thereof, a drain opening 40 through which a cooling water is led outside, and an air vent hole 49 through which air in the column is discharged is formed at a position higher than the drain opening 40.

Abstract: A stacked semiconductor device includes a first semiconductor device equipped with a first semiconductor chip 14 having a transistor circuit and protection diodes, and a second semiconductor device equipped with a second semiconductor chip 24 having a transistor circuit and protection diodes, and stacked on the first semiconductor device via a connection portion, wherein a power supply line connected to the first and second semiconductor chips is used in common, and a forward ON voltage of the protection diodes of the first semiconductor chip is set higher than a forward ON voltage of the protection diodes of the second semiconductor chip 24. When a connection test is executed, the forward ON voltage of the protection diodes of the first semiconductor chip or the second semiconductor chip is detected and then normal/open is judged.

Abstract: A semiconductor package includes a plurality of connection pads, which are electrically connected to connection terminals of a mounted component that is mounted on the semiconductor package, and recognition marks. The recognition marks are formed respectively within the area of each of at least two of the connection pads. Each recognition mark has an area that is smaller than the area of the connection mark in which it is formed.

Abstract: A semiconductor apparatus includes: first electronic components; a first circuit board, including first electronic component mounting pads on which the first electronic components are mounted; and a second circuit board located above the first circuit board, wherein the first electronic component mounting pads are arranged on a first face of the first circuit board, opposite the second circuit board, and the first circuit board and the second circuit board are electrically connected by internal connection terminals located between the first circuit board and the second circuit board, and wherein a recessed portion is formed in the second circuit board, opposite the first electronic components, in order to provide space to accommodate portions of the first electronic components.

Abstract: A stacked semiconductor device includes a first semiconductor device equipped with a first semiconductor chip 14 having a transistor circuit and protection diodes, and a second semiconductor device equipped with a second semiconductor chip 24 having a transistor circuit and protection diodes, and stacked on the first semiconductor device via a connection portion, wherein a power supply line connected to the first and second semiconductor chips is used in common, and a forward ON voltage of the protection diodes of the first semiconductor chip is set higher than a forward ON voltage of the protection diodes of the second semiconductor chip 24. When a connection test is executed, the forward ON voltage of the protection diodes of the first semiconductor chip or the second semiconductor chip is detected and then normal/open is judged.

Abstract: A package includes: a package body including a substrate, an electronic component mounted on a first surface of the substrate, and a sealing resin layer for sealing the electronic component; and a shield case for covering the sealing resin layer, the shield case being made of metal and having an inverted U-shape in a cross-sectional view, wherein a bent part of the shield case is formed in such a manner that at least a part of an end of the shield case is bent toward a second surface of the substrate opposite to the first surface, and the bent part abuts on the second surface so that the shield case is attached to the substrate.

Abstract: A semiconductor device includes a first wiring board having a semiconductor element connection pad; a semiconductor element connected to the semiconductor element connection pad; and a second wiring board facing the semiconductor element and the first wiring board, the second wiring board being electrically connect to the first wiring board. The semiconductor element includes an electrode configured to electrically connect a first surface of the semiconductor element and a second surface of the semiconductor element to each other. The first surface of the semiconductor element faces the first wiring board. The second surface of the semiconductor element faces the second wiring board. The first wiring board and the second wiring board are electrically connected to each other via the electrode.

Abstract: A semiconductor apparatus includes: first electronic components; a first circuit board, including first electronic component mounting pads on which the first electronic components are mounted; and a second circuit board located above the first circuit board, wherein the first electronic component mounting pads are arranged on a first face of the first circuit board, opposite the second circuit board, and the first circuit board and the second circuit board are electrically connected by internal connection terminals located between the first circuit board and the second circuit board, and wherein a recessed portion is formed in the second circuit board, opposite the first electronic components, in order to provide space to accommodate portions of the first electronic components.

Abstract: It is an electronic component built-in substrate 100 configured as follows. That is, an electronic component 30 is provided between at least two boards 10 and 20. An electrode 34 of the electronic component 30 is electrically connected to at least one of the board 10. Also, the boards 10 and 20 are electrically connected to each other. Additionally, the gap between the boards 10 and 20 is sealed with a resin. The electronic component built-in substrate 100 is featured in that a solder ball 40 for electrically connecting the boards 10 and 20 to each other is provided on a surface of the electronic component 30, which faces the other board 20.

Abstract: A package includes: a package body including a substrate, an electronic component mounted on a first surface of the substrate, and a sealing resin layer for sealing the electronic component; and a shield case for covering the sealing resin layer, the shield case being made of metal and having an inverted U-shape in a cross-sectional view, wherein a bent part of the shield case is formed in such a manner that at least a part of an end of the shield case is bent toward a second surface of the substrate opposite to the first surface, and the bent part abuts on the second surface so that the shield case is attached to the substrate.

Abstract: An automatic tool changing device (30) has a tool storage device (31) with a plurality of tools stored therein, a tool chucking unit (41) and a tool unchucking unit (51) both capable of advancing/retreating between the tool storage device (31) and a tool changing position (P2), and a tool delivery mechanism (61). The tool chucking unit (41) is provided with a tool fastening mechanism (42) for fastening the tool chucking mechanism (24), and the tool unchucking unit (51) is provided with a tool loosening mechanism (52) for loosening the tool chucking mechanism (24). The tool delivery mechanism (61) delivers the tool positioned at a tool delivery position from the tool storage device into the tool fastening mechanism of the tool chucking unit so that the tool is held by the tool fastening mechanism, and delivers the tool retrieved by the tool unchucking unit from the tool unchucking unit to the tool storage device so that the tool is stored by the tool storage device.

Abstract: A semiconductor device is disclosed that comprises a board, a ground terminal disposed on the board, a connection terminal disposed on the board, a semiconductor chip mounted on the board, and a shield member electrically connected to the ground terminal. The semiconductor chip, the ground terminal, and the connection terminal are disposed on one side of the board, and the shield member is disposed directly on and covers the other side of the board.

Abstract: An automatic tool changing device (30) has a tool storage device (31) with a plurality of tools stored therein, a tool chucking unit (41) and a tool unchucking unit (51) both capable of advancing/retreating between the tool storage device (31) and a tool changing position (P2), and a tool delivery mechanism (61). The tool chucking unit (41) is provided with a tool fastening mechanism (42) for fastening the tool chucking mechanism (24), and the tool unchucking unit (51) is provided with a tool loosening mechanism (52) for loosening the tool chucking mechanism (24). The tool delivery mechanism (61) delivers the tool positioned at a tool delivery position from the tool storage device into the tool fastening mechanism of the tool chucking unit so that the tool is held by the tool fastening mechanism, and delivers the tool retrieved by the tool unchucking unit from the tool unchucking unit to the tool storage device so that the tool is stored by the tool storage device.