Abstract: A curable resin composition, comprising a compound represented by the following general formula (1): wherein X is a functional group comprising a reactive group, and R1 and R2 each independently represent a hydrogen atom, or an aliphatic hydrocarbon group, aryl group or heterocyclic group that may have a substituent; and at least organometallic compound selected from the group consisting of metal alkoxides and metal chelates.

Abstract: A polarizing film has a transparent protective film provided on at least one side of a polarizer through an adhesive layer. The transparent protective film is a cellulose-based resin film. The adhesive layer is formed by a cured layer obtained by irradiating an active energy ray-curable adhesive composition with active energy rays. The composition contains 0.0% by weight to 4.0% by weight of an active energy ray-curable compound (A) having an SP value of 29.0 (MJ/m3)1/2 to 32.0 (MJ/m3)1/2, 5.0% by weight to 98.0% by weight of an active energy ray-curable compound (B) having the SP value of 18.0 (MJ/m3)1/2 to 21.0 (MJ/m3)1/2 (exclusive of 21.0 (MJ/m3)1/2), and 5.0% by weight to 98.0% by weight of an active energy ray-curable compound (C) having the SP value of 21.0 (MJ/m3)1/2 to 26.0 (MJ/m3)1/2 on a basis of 100% by weight of a total amount of the composition.

Abstract: An active energy ray-curable adhesive composition containing active energy ray-curable compounds (A), (B), and (C) as curable components, wherein the active energy ray-curable adhesive composition contains 0.0% by weight to 4.0% by weight of an active energy ray-curable compound (A) having an SP value of 29.0 (MJ/m3)1/2 to 32.0 (MJ/m3)1/2, 5.0% by weight to 98.0% by weight of an active energy ray-curable compound (B) having the SP value of 18.0 (MJ/m3)1/2 to 21.0 (MJ/m3)1/2 (exclusive of 21.0 (MJ/m3)1/2), and 5.0% by weight to 98.0% by weight of an active energy ray-curable compound (C) having the SP value of 21.0 (MJ/m3)1/2 to 26.0 (MJ/m3)1/2 on a basis of 100% by weight of a total amount of the composition.

Abstract: A curable resin composition, comprising a compound represented by the following general formula (1): wherein X is a functional group comprising a reactive group, and R1 and R2 each independently represent a hydrogen atom, or an aliphatic hydrocarbon group, aryl group or heterocyclic group that may have a substituent; and at least organometallic compound selected from the group consisting of metal alkoxides and metal chelates.

Abstract: Provided is a surface protective film including, as an outermost layer, a pressure-sensitive adhesive layer containing a urethane-based pressure-sensitive adhesive as a main component, the surface protective film allowing the contamination of an adherend to be extremely suppressed, and being preferably excellent in wettability and reworkability. The surface protective film of the present invention includes, as an outermost layer, a pressure-sensitive adhesive layer containing, as a main component, a urethane-based pressure-sensitive adhesive containing a polyurethane-based resin; and when a pressure-sensitive adhesive layer side of the surface protective film is attached to a glass plate at 50° C. for 10 days and then the surface protective film is peeled from the glass plate, a residual adhesive strength on the peeled surface side of the glass plate is 3.0 N/19 mm or more.

Abstract: A conductive adhesive tape includes a conductive layer; an adhesive layer formed at one side in the thickness direction of the conductive layer and containing an adhesive and a conductive filler; and a metal layer interposed between the conductive layer and the adhesive layer. The maximum resistance value in the first cycle measured in a heat cycle test is 0.1? or less, and the resistance value increase rate is 100% or less.

Abstract: Provided is an electroconductive pressure-sensitive adhesive tape which can exhibit stable electrical conductivity even when used over a long duration and/or used under severe environmental conditions. The electroconductive pressure-sensitive adhesive tape has a metallic foil and, on one side thereof, a pressure-sensitive adhesive layer, in which the electroconductive pressure-sensitive adhesive tape has a maximum resistance in the first cycle of 1 ? or less and has a maximum resistance in the 200th cycle being 5 times or less the maximum resistance in the first cycle, as measured in a thermo-cycle test.

Abstract: Disclosed is a conductive adhesive tape which can exhibit extremely stable electroconductivity upon use over a long duration and/or use under severe environmental conditions even when applied in a small area. The conductive thermosetting adhesive tape includes a metallic foil; and a thermosetting adhesive layer on one side of the metallic foil. The thermosetting adhesive layer has a bond strength before curing of 2 N/20 mm or more and a bond strength after curing of 10 N/20 mm or more. The conductive thermosetting adhesive tape is preferably one including the metallic foil; the thermosetting adhesive layer on one side of the metallic foil; and a terminal exposed from the surface of the thermosetting adhesive layer, in which the conductive thermosetting adhesive tape has a total area of the terminal present per 30 mm2 of the surface of the thermosetting adhesive layer of from 0.1 to 5 mm2.

Abstract: Provided is an electroconductive pressure-sensitive adhesive tape which is satisfactorily less corrosive and is capable of maintaining stable electrical conductivity over the long term. The electroconductive pressure-sensitive adhesive tape has at least one acrylic pressure-sensitive adhesive layer. The electroconductive pressure-sensitive adhesive tape has a volume resistance of 1×101? or less and has a total amount of acrylic acid ions and methacrylic acid ions extracted from the electroconductive pressure-sensitive adhesive tape of 20 ng/cm2 or less per unit area of the acrylic pressure-sensitive adhesive layer, where the extraction is performed with pure water under conditions of 100° C. for 45 minutes, and the total amount is measured through ion chromatography.

Abstract: The present invention provides a pressure-sensitive adhesive tape for a flexible printed circuit, from which a release liner can be released without being torn off even after being subjected to a high temperature process such as a solder reflow process. The pressure-sensitive adhesive tape of the present invention includes: a pressure-sensitive adhesive layer; and a release liner on at least one surface of the pressure-sensitive adhesive layer, wherein a tensile strength of the release liner in a machine direction is 50 MPa to 150 MPa, and a tensile strength of the release liner in a machine direction after heating at 280° C. for 5 min is 20 MPa to 120 MPa.

Abstract: A conductive adhesive tape includes a conductive layer, and an adhesive layer formed on the surface of the conductive layer. In the adhesive layer, an adhesive layer through-hole penetrating the adhesive layer in the thickness direction thereof is formed. The conductive layer includes a conductive layer passage portion formed in the adhesive layer through-hole. A low melting point metal layer is provided at an end face of the conductive layer passage portion, the end face reaching surface of the adhesive layer.

Abstract: The present invention provides a thermosetting adhesive tape or sheet having a thermosetting adhesive layer, which can be stored stably at room temperature, and, when thermally cured, can exert excellent adhesiveness and high thermal stability after exposure to heat and moist, because the resin in the adhesive rapidly reacts upon curing. The thermosetting adhesive tape or sheet according to the present invention includes a thermosetting adhesive layer which has a gel fraction of less than 70%, a difference in gel fraction between before and after storage at 40° C. for 7 days [(gel fraction after storage at 40° C. for 7 days)?(gel fraction before storage at 40° C. for 7 days)] of 15% or less, and a gel fraction after curing at 150° C. for 1 hour of 90% or more.

Abstract: An object of the present invention is to provide an insulating tape that is superior in less-corrosive property and provides its product containing the insulating tape with favorable reliability even when it is used under severer environment for an extended period of time. The insulating tape according to the present invention includes a plastic film base material and a pressure-sensitive adhesive layer including an acrylic polymer on or above at least one face of the plastic film base material, wherein the pressure-sensitive adhesive layer has a moisture content, as determined after storage in an environment at 60° C. and 90% RH for 24 hours, of less than 0.15 wt % and monomer components constituting the acrylic polymer contain substantially no carboxyl group-containing monomer.

Abstract: The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for use in a wiring circuit board, which includes a pressure-sensitive adhesive layer formed of a pressure-sensitive adhesive composition comprising an acrylic polymer and a tackifier resin containing a phenolic hydroxyl group; and a release liner comprising a releasing treatment layer formed of a silicone release agent. The double-sided pressure-sensitive adhesive tape or sheet of the invention has a good adhesiveness and, even after a high-temperature step, it is capable of exerting an excellent anti-repulsion property. Further, since the release liner can be easily peeled off even after the high-temperature step, the workability is excellent and the productivity is improved.

Abstract: A conductive adhesive member includes a conductive region continuously exposed along one direction, and an adhesive region exposed along the conductive region.

Abstract: Provided is a double-sided pressure-sensitive adhesive tape for fixing a flexible printed circuit board superior in adhesive power after bonding under low pressure and also in repelling resistance after processing in high-temperature steps. The double sided pressure-sensitive adhesive tape for fixing a flexible printed circuit board according to the present invention has a 180° peel adhesion, as determined by bonding the adhesive tape onto a stainless steel plate under pressure by one reciprocation of a 10-g roller, leaving it still for 5 minutes and measuring it at a tensile speed of 300 mm/minute, of 6.5 N/20 mm or more and a terminal separation distance after reflow of 2.5 mm or less.

Abstract: Disclosed is a double-sided pressure-sensitive adhesive sheet for fixing a flexible printed circuit board, which has silicone release liners, but is less polluting and excels in workability. The double-sided pressure-sensitive adhesive sheet for fixing a flexible printed circuit board includes at least a pressure-sensitive adhesive unit including a substrate and pressure-sensitive adhesive layers present on or above both sides of the substrate; and silicone release liners present on or above both surfaces of the pressure-sensitive adhesive unit, in which the pressure-sensitive adhesive layers each include an acrylic polymer based on, as an essential monomer component, an alkyl (meth)acrylate whose alkyl moiety being a linear or branched-chain alkyl group having 1 to 14 carbon atoms, the pressure-sensitive adhesive unit has a thickness of 60 ?m or less, and the adhesive sheet evolves siloxane gas, if any, in an amount of 1 ng/cm2 or less when heated at 120° C. for 10 minutes.

Abstract: Provided is a double-faced pressure-sensitive adhesive tape for solar cell modules superior in processability and workability during operations. The double-faced pressure-sensitive adhesive tape for solar cell modules according to the present invention is a double-faced pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer, characterized in that the frictional force, which is defined as the stress applied when a sample of 2 cm×2 cm in size having a 30 g load fixed is pulled on an aluminum plate in the horizontal direction at a speed of 300 mm/min, is 0.01 to 1.0 N/cm2, on at least one face of the pressure-sensitive adhesive layer.

Abstract: The present invention has an object to provide an electroconductive pressure-sensitive adhesive tape that does not cause separator lifting. In particular, it is an object of the present invention to provide an electroconductive pressure-sensitive adhesive tape that does not cause separator lifting even when the tape is wound into a roll shape or has a long length and that has excellent protective properties for the pressure-sensitive adhesive layer and excellent handling properties. The electroconductive pressure-sensitive adhesive tape of the present invention includes an electroconductive pressure-sensitive adhesive tape main body having a pressure-sensitive adhesive layer on one side of a metal foil and a terminal formed on the metal foil and penetrating the pressure-sensitive adhesive layer, and includes a separator provided on a surface of the pressure-sensitive adhesive layer and having an elongation of 600% or more in the longitudinal direction.

Abstract: The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which comprises a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition containing an acrylic polymer and a chain transfer substance, in which the pressure-sensitive adhesive layer has characteristics that a gel fraction in the initial stage is from 40 to 70% by weight, and a difference between a gel fraction (% by weight) of the pressure-sensitive adhesive layer after the following solder reflow step and the gel fraction (% by weight) of the pressure-sensitive adhesive layer in the initial stage is 10 or less. The solder reflow step satisfies the following heat treatment conditions. Surface temperature of the double-sided pressure-sensitive adhesive tape or sheet reaches 175±10° C. within 130 to 180 seconds, the surface temperature reaches 230±10° C. within 200 to 250 seconds, the surface temperature reaches 255±15° C.