Abstract: A double-sided pressure-sensitive adhesive tape includes a nonwoven fabric substrate and pressure-sensitive adhesive layers present on both sides of the substrate, in which the nonwoven fabric substrate contains at least Manila hemp, has a thickness of 18 ?m or less, and has a tensile strength in a machine direction of 4 N/15 mm or more. The double-sided pressure-sensitive adhesive tape is thin and is effective for the reduction in size and thickness of products to be fixed through the tape. The tape has a high strength in the machine direction and does not break during production and processing processes. In addition, the tape has a nonwoven fabric substrate and thereby excels also in punching quality. The tape is therefore particularly useful as a double-sided pressure-sensitive adhesive tape for fixing a wiring circuit board.

Abstract: Disclosed is a double-coated pressure-sensitive adhesive sheet which includes at least a pressure-sensitive adhesive unit including a plastic base film and, present on or above both surfaces thereof, pressure-sensitive adhesive layers; and non-silicone release liners present on both surfaces of the pressure-sensitive adhesive unit. The pressure-sensitive adhesive layers are each formed from an acrylic polymer containing, as essential monomer components, an alkyl (meth)acrylate whose alkyl moiety being a linear or branched-chain alkyl group having 2 to 14 carbon atoms and a polar-group-containing monomer. The pressure-sensitive adhesive unit has a thickness of 60 to 160 ?m, and each of the two pressure-sensitive adhesive layers of the pressure-sensitive adhesive unit has a thickness of 20 ?m or more. The adhesive sheet excels in processability and fittability around bumps and is usable for fixing a flexible printed circuit board or for fixing a hard disk drive component.

Abstract: Disclosed is a double-coated pressure-sensitive adhesive sheet for fixing a flexible printed circuit board, which includes at least a pressure-sensitive adhesive unit including a plastic base film having a thickness of 13 ?m or less, and pressure-sensitive adhesive layers on both sides of the plastic base film. The pressure-sensitive adhesive layers are formed from an acrylic polymer containing, as essential monomer components, a polar-group-containing monomer and an alkyl (meth)acrylate whose alkyl moiety being a linear or branched-chain alkyl group having 2 to 14 carbon atoms. The pressure-sensitive adhesive unit has a thickness of 60 ?m or less, the double-coated pressure-sensitive adhesive sheet shows an outgassing of 1 ?g/cm2 or less when heated at 120° C. for 10 minutes, and shows a split distance (lifting) of 1.5 mm or less.

Abstract: Provided is a double-faced pressure-sensitive adhesive tape superior in processability and workability during operation in solar cell modules. The double-faced pressure-sensitive adhesive tape according to the present invention is a double-faced pressure-sensitive adhesive tape having an acrylic pressure-sensitive adhesive layer containing bubbles and/or hollow microspheres, characterized in that the frictional force, which is defined as the stress applied when a sample of 2 cm×2 cm in size having a 30 g load fixed on at least one side of the acrylic pressure-sensitive adhesive layer containing bubbles and/or hollow microspheres, is pulled on an aluminum plate in the horizontal direction at a speed of 300 mm/min, is 0.01 to 1.0 N/cm2.

Abstract: Disclosed is a double-coated pressure-sensitive adhesive sheet adopted to fix a hard disk drive component, which includes a pressure-sensitive adhesive unit including a plastic film base having a thickness of 20 ?m or less and pressure-sensitive adhesive layers arranged on or above both sides of the plastic film base; and non-silicone release liners arranged on both surfaces of the pressure-sensitive adhesive unit. The pressure-sensitive adhesive unit has a thickness of 60 ?m or less, and the double-coated pressure-sensitive adhesive sheet shows an outgassing of 1 ?g/cm2 or less when the double-coated pressure-sensitive adhesive sheet is heated at a temperature of 120° C. for 10 minutes. The double-coated pressure-sensitive adhesive sheet is free from silicone, thereby causes less contamination, evolves less outgas, and is superior in workability. It has further improved followability to difference in level by controlling the thickness of the plastic film base to 13 ?m or less.

Abstract: The present invention provides a thermosetting adhesive or pressure-sensitive adhesive tape or sheet including: a thermosetting adhesive or pressure-sensitive adhesive layer formed of a thermosetting adhesive or pressure-sensitive adhesive composition containing an acrylic polymer (X) constituted of, as essential monomer components, an alkyl (meth)acrylate (a) in which the alkyl moiety thereof has from 2 to 14 carbon atoms and a cyano group-containing monomer (b), and a phenol resin (Y); and provided on at least one surface of the thermosetting adhesive or pressure-sensitive adhesive layer, a release liner including a plastic film substrate and a release layer provided on at least one side of the plastic film substrate, the release layer containing low density polyethylene as a major component and having a thickness of 5 ?m or more and less than 20 ?m.

Abstract: The present invention provides a double-sided pressure-sensitive adhesive tape or sheet for use in wiring circuit board, which includes a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition containing an acrylic polymer as a main component, in which the double-sided pressure-sensitive adhesive tape or sheet has an amount of total outgas of 250 ?g/g or less and a diffusion amount of toluene of 10 ?g/g or less. The double-sided pressure-sensitive adhesive tape or sheet has a small generating amount of VOC as well as excellent punching processing property and anti-repulsion property.

Abstract: The present invention provides a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which includes a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition, wherein the pressure-sensitive adhesive composition contains an acrylic polymer as a main component and further contains an electrically conductive filler in a proportion of 5 to 100 parts by weight with respect to 100 parts by weight of a total solid in the pressure-sensitive adhesive composition except the electrically conductive filler. The double-sided pressure-sensitive adhesive tape or sheet is excellent in adhesiveness, electrically conducting property and anti-repulsion property, and thus can be advantageously used for wiring circuit board.

Abstract: The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for use in a wiring circuit board, which includes a pressure-sensitive adhesive layer formed of a pressure-sensitive adhesive composition comprising an acrylic polymer and a tackifier resin containing a phenolic hydroxyl group; and a release liner comprising a releasing treatment layer formed of a silicone release agent. The double-sided pressure-sensitive adhesive tape or sheet of the invention has a good adhesiveness and, even after a high-temperature step, it is capable of exerting an excellent anti-repulsion property. Further, since the release liner can be easily peeled off even after the high-temperature step, the workability is excellent and the productivity is improved.

Abstract: The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which comprises a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition containing an acrylic polymer and a chain transfer substance, in which the pressure-sensitive adhesive layer has characteristics that a gel fraction in the initial stage is from 40 to 70% by weight, and a difference between a gel fraction (% by weight) of the pressure-sensitive adhesive layer after the following solder reflow step and the gel fraction (% by weight) of the pressure-sensitive adhesive layer in the initial stage is 10 or less. The solder reflow step satisfies the following heat treatment conditions. Surface temperature of the double-sided pressure-sensitive adhesive tape or sheet reaches 175±10° C. within 130 to 180 seconds, the surface temperature reaches 230±10° C. within 200 to 250 seconds, the surface temperature reaches 255±15° C.