Patents by Inventor Noriyasu Echigo
Noriyasu Echigo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6611420Abstract: A layered product including a plurality of deposition units, each having a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.Type: GrantFiled: May 1, 2002Date of Patent: August 26, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare, Shinichi Suzawa
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Publication number: 20030157742Abstract: A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.Type: ApplicationFiled: March 4, 2003Publication date: August 21, 2003Inventors: Kazuyoshi Honda, Masaru Odagiri, Kiyoshi Takahashi, Noriyasu Echigo, Nobuki Sunagare
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Publication number: 20030145792Abstract: A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.Type: ApplicationFiled: March 4, 2003Publication date: August 7, 2003Inventors: Kazuyoshi Honda, Masaru Odagiri, Kiyoshi Takahashi, Noriyasu Echigo, Nobuki Sunagare
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Publication number: 20030148038Abstract: A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.Type: ApplicationFiled: March 4, 2003Publication date: August 7, 2003Inventors: Kazuyoshi Honda, Masaru Odagiri, Kiyoshi Takahashi, Noriyasu Echigo, Nobuki Sunagare
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Patent number: 6602559Abstract: A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.Type: GrantFiled: September 25, 2000Date of Patent: August 5, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Masaru Odagiri, Kiyoshi Takahashi, Noriyasu Echigo, Nobuki Sunagare
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Publication number: 20030133249Abstract: Electrode layers (1, 2) are arranged on both sides of a dielectric layer (3) facing each other so as to configure a capacitor. Lead electrodes (4, 5) are formed in the electrode layers (1, 2). A penetrating electrode (6) that is insulated from the electrode layers (1, 2) is formed. An electronic component (10) configured in this manner is mounted on a wiring board, and a semiconductor chip can be mounted thereon. Along with connecting the semiconductor chip to the wiring board via the penetrating electrode (6), the semiconductor chip or the wiring board is connected to the lead electrodes (4, 5). In this manner, while suppressing the size increase of a mounted area, the capacitor or the like can be arranged near the semiconductor chip. Thus, the semiconductor chip is driven with high frequency more easily.Type: ApplicationFiled: February 14, 2003Publication date: July 17, 2003Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Takanori Sugimoto
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Patent number: 6576523Abstract: A method for producing a laminate having resin layers and thin metal layers by repeating a process unit comprising a step of laminating a resin layer by applying a resin material, a step of depositing a patterning material on the resin layer and a step of laminating a thin metal layer, predetermined times on a turning support (511), wherein the patterning material is stuck on the surface of the resin layer in a noncontact way. A laminate comprising a large number of laminate units each comprising a resin layer and a thin metal layer divided at an electric insulation stripe part can be produced stably. The laminate is applicable to production of a high performance small capacitor at low cost.Type: GrantFiled: May 10, 2000Date of Patent: June 10, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare, Shinichi Suzawa
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Patent number: 6577493Abstract: A layered product including a plurality of deposition units, each having a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.Type: GrantFiled: May 1, 2002Date of Patent: June 10, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare, Shinichi Suzawa
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Patent number: 6574087Abstract: Electrode layers (1, 2) are arranged on both sides of a dielectric layer (3) facing each other so as to configure a capacitor. Lead electrodes (4, 5) are formed in the electrode layers (1, 2). A penetrating electrode (6) that is insulated from the electrode layers (1, 2) is formed. An electronic component (10) configured in this manner is mounted on a wiring board, and a semiconductor chip can be mounted thereon. Along with connecting the semiconductor chip to the wiring board via the penetrating electrode (6), the semiconductor chip or the wiring board is connected to the lead electrodes (4, 5). In this manner, while suppressing the size increase of a mounted area, the capacitor or the like can be arranged near the semiconductor chip. Thus, the semiconductor chip is driven with high frequency more easily.Type: GrantFiled: December 21, 2000Date of Patent: June 3, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Takanori Sugimoto
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Publication number: 20030087037Abstract: A method for producing a laminate having resin layers and thin metal layers by repeating a process unit comprising a step of laminating a resin layer by applying a resin material, a step of depositing a patterning material on the resin layer and a step of laminating a thin metal layer, predetermined times on a turning support (511), wherein the patterning material is stuck on the surface of the resin layer in a noncontact way. A laminate comprising a large number of laminate units each comprising a resin layer and a thin metal layer divided at an electric insulation stripe part can be produced stably. The laminate is applicable to production of a high performance small capacitor at low cost.Type: ApplicationFiled: December 6, 2002Publication date: May 8, 2003Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare, Shinichi Suzawa
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Publication number: 20020186522Abstract: A layered product comprising a plurality of deposition units, each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.Type: ApplicationFiled: May 1, 2002Publication date: December 12, 2002Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare, Shinichi Suzawa
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Patent number: 6488985Abstract: A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.Type: GrantFiled: June 28, 2000Date of Patent: December 3, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Masaru Odagiri, Kiyoshi Takahashi, Noriyasu Echigo, Nobuki Sunagare
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Patent number: 6475571Abstract: A method for manufacturing a resin thin film of the present invention includes supplying a liquid resin material and a gas to a two-fluid nozzle by pressure; ejecting the resin material in the form of atomized particles toward a heating member by the two-fluid nozzle, thereby adhering the resin material to the heating member; or mixing a liquid resin material with a gas; ejecting the resin material in form of atomized particles toward a heating member that is provided under reduced pressure, thereby adhering the resin material to the heating member; and evaporating the resin material on the heating member to obtain the evaporated resin material. Thus, the present invention can provide a resin thin film having a uniform thickness stably with simple means at a low cost. The resin thin film obtained by the present invention can be used in a wide range, for example a magnetic recording medium such as a magnetic tape, a wrapping material, and an electronic component.Type: GrantFiled: July 6, 2001Date of Patent: November 5, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Noriyasu Echigo, Kazuyoshi Honda, Masaru Odagiri, Nobuki Sunagare, Toru Miyake, Tomonori Sato
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Publication number: 20020159219Abstract: A layered product comprising a plurality of deposition units, each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.Type: ApplicationFiled: May 1, 2002Publication date: October 31, 2002Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare, Shinichi Suzawa
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Publication number: 20020159220Abstract: A layered product comprising a plurality of deposition units, each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.Type: ApplicationFiled: May 1, 2002Publication date: October 31, 2002Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare, Shinichi Suzawa
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Publication number: 20020158307Abstract: Resin thin films (12) and metal thin films (11a, 11b) are layered in alternation. The metal thin films are set back from the peripheral edges of the resin thin films (12). Via holes (13a, 13b) penetrating the layered product in the layering direction are formed and filled with conductive material (14a, 14b). The conductive material (14a, 14b) electrically connects the metal thin films (11a, 11b) among one another. The metal thin films are not exposed at the periphery, so that corrosion of the metal thin films is not likely to occur. Furthermore, cutting of the metal thin films during the manufacturing process is avoided.Type: ApplicationFiled: November 27, 2001Publication date: October 31, 2002Inventors: Kazuyoshi Honda, Noriyasu Echigo, Yoshiaki Kai, Masaru Odagiri, Nobuki Sunagare
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Publication number: 20020141137Abstract: A layered product comprising a plurality of deposition units, each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.Type: ApplicationFiled: April 5, 2002Publication date: October 3, 2002Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare, Shinichi Suzawa
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Publication number: 20020141138Abstract: A layered product comprising a plurality of deposition units, each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.Type: ApplicationFiled: April 5, 2002Publication date: October 3, 2002Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare, Shinichi Suzawa
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Patent number: 6413456Abstract: In a method for manufacturing electronic parts by laminating metal thin films and insulating thin films on a support, a mold releasing agent is applied to the support before the start of lamination. Alternatively, the mold releasing agent is applied to the surface of the laminate during the lamination step, and then lamination is resumed. Therefore, the laminate can be prevented from cracking when the laminate is separated from the support or divided into plural pieces in the lamination direction. Thus, the reliability and productivity of electronic parts improve.Type: GrantFiled: December 18, 1998Date of Patent: July 2, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare
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Patent number: 6388865Abstract: A layered product including a plurality of deposition units, each having a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.Type: GrantFiled: May 16, 2000Date of Patent: May 14, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuyoshi Honda, Noriyasu Echigo, Masaru Odagiri, Nobuki Sunagare, Shinichi Suzawa