Abstract: An exposure apparatus for exposing an object put on a first stage by irradiating light from a light source onto the object through an exposure optical system includes a partition for isolating a first space where the first stage is arranged and isolating a second space where the exposure optical system is arranged, a first management part that manages a degree of vacuum of the first space, and a second management part that manages a degree of vacuum of the second space.

Abstract: An exposure apparatus includes a projection optical system for projecting a pattern of a mask onto an object using a light with wavelength of 20 nm or less from a light source, and first and second accommodating parts for accommodating the projection optical system and the mask or the object, said first and second accommodating part has different pressures, wherein said a Ps/Po?100 and Ps?10?3 Pa are met, where Po is the pressure of the first accommodating part, and Ps is the pressure of the second accommodating part.

Abstract: An exposure apparatus which projects a pattern formed on a mask onto a substrate by using exposure light. The apparatus includes a shielding member which surrounds a light path space through which exposure light passes and has a passage which makes the light path space communicate with an ambient space, and a gas supply system which supplies inert gas to the light path space surrounded by the shielding member. A direction of the passage coincides with a flow direction of an ambient atmosphere which flows through the ambient space, and the passage includes a first passage and a second passage. The first passage is located at a position upstream, with respect to the flow direction, relative to the second passage, and the first passage is smaller in section than the second passage.

Abstract: An exposure apparatus which projects and transfers a pattern formed on a mask to a substrate using exposure light includes a stage, an optical system, and a gas stream forming mechanism which forms a stream of inert gas in an optical path space including a space which is located between the stage and the optical system and through which the exposure light passes. In addition, a member forms a predetermined space between the optical path space and a peripheral space outside the optical path space in the exposure apparatus, and a gas supply mechanism supplies the inert gas into the predetermined space.

Abstract: An exposure apparatus which projects and transfers a pattern formed on a mask to a substrate using exposure light includes a stage, an optical system, and a gas stream forming mechanism which forms a stream of inert gas in an optical path space including a space which is located between the stage and the optical system and through which the exposure light passes. In addition, a member forms a predetermined space between the optical path space and a peripheral space outside the optical path space in the exposure apparatus, and a gas supply mechanism supplies the inert gas into the predetermined space.

Abstract: Disclosed is an exposure apparatus having a specific structure that includes a cold trap plate for attracting contaminant substances which might cause a decrease of reflectance of a mirror when adhered thereto, and a radiation shield member for preventing excessive cooling of the mirror or the like by the cold trap plate.

Abstract: An exposure apparatus for exposing an object put on a first stage by irradiating light from a light source onto the object through an exposure optical system includes a partition for isolating a first space where the first stage is arranged and isolating a second space where the exposure optical system is arranged, a first management part that manages a degree of vacuum of the first space, and a second management part that manages a degree of vacuum of the second space.

Abstract: This invention shortens a time required to purge, with inert gas, gas in a space (optical path space) through which exposure light passes, such as a space between a projection optical system and a substrate. The exposure apparatus includes a wafer stage (102), a projection optical system (101), and an air supply portion (112) which supplies inert gas at a nonuniform flow velocity to an optical path space (113) through which exposure light passes between the wafer stage (102) and the projection optical system (101). A downward flow of inert gas is formed.

Abstract: An exposure apparatus includes an illumination optical system which illuminates a pattern formed on a mask with light from a light source, a movable mask stage for holding the mask, a projection optical system which guides light from a pattern of the mask to a wafer, a movable wafer stage for holding the wafer, a shielding member which forms an optical path space including an optical path of exposure light and a space surrounding the optical path space at, of a space through which the exposure light passes, at least one portion between the illumination optical system and the mask stage, between the mask stage and the projection optical system, or between the protection optical system and the wafer stage, a first gas supply device for supplying an inert gas to the optical path space, a chamber surrounding the wafer stage, the projection optical system and the shielding member, and a reduction device for reducing a change in total light quantity of the exposure light reaching the wafer that is caused by movemen

Abstract: An exposure apparatus which projects and transfers a pattern formed on a mask to a substrate using exposure light includes a stage, an optical system, a gas stream forming mechanism which forms a stream of an inert gas in an optical path space including a space which is located between the stage and the optical system and through which the exposure light passes, a member which forms a predetermined space between the optical path space and a peripheral space outside the optical path space in the exposure apparatus, and a gas supply mechanism which supplies the inert gas into the predetermined space.

Abstract: An exposure apparatus includes an illumination optical system, a mask stage, a projection optical system, a wafer stage, a shielding member which defines an optical path space between the optical system and stage through which exposure light passes and a space surrounding the optical path space, and a unit which supplies an inert gas to these spaces. When the transmittance in the optical path space changes along with the movement of the stage, the influence of the transmittance on exposure is reduced.

Abstract: This invention shortens a time required to purge, with inert gas, gas in a space (optical path space) through which exposure light passes, such as a space between a projection optical system and a substrate. The exposure apparatus includes a wafer stage (102), a projection optical system (101), and an air supply portion (112) which supplies inert gas at a nonuniform flow velocity to an optical path space (113) through which exposure light passes between the wafer stage (102) and the projection optical system (101). A downward flow of inert gas is formed.

Abstract: This invention shortens a time required to purge, with inert gas, gas in a space (optical path space) through which exposure light passes, such as a space between a projection optical system and a substrate. Shielding members (115) are so arranged as to surround the side planes of an optical path space (113). Inert gas is supplied from a gas supply port (112) to the optical path space (113) to purge gas in the optical path space (113) with the inert gas. The shielding members (115) have passages (116) at portions where the flow of inert gas delays. The passages (116) increase the flow velocity at these portions to shorten the purge time.

Abstract: An exposure apparatus includes an illumination system for illuminating, with pulse light, a reticle having a pattern formed thereon, a reticle stage for scanning the reticle, a projection system for projecting the pattern onto a wafer, a wafer stage for scanning the wafer, an interface into which information related to the reticle is inputted and a controller for changing illumination conditions on the basis of the information inputted to the interface. The reticle is illuminated with the pulse light while the reticle and the wafer are scanned, by which the pattern of the reticle is transferred to the wafer sequentially.

Abstract: An exposure apparatus includes a light source for providing pulse light, a mask scanning machanism for scanning a mask having a pattern, a wafer scanning mechanism for scanning a wafer onto which the pattern is to be projected, wherein the mask scanning machanism and the wafer scanning mechanism serve to scan the mask and the wafer in a timed relation so that the mask is illuminated while superposing portions of an illumination region defined by the pulse light and being narrower than the pattern such that the pattern is lithographically transferred onto the wafer, and a scan speed determining system for determining scan speed of the mask and the wafer, the scan speed being variable on the basis of a tolerance ratio of exposure non-uniformness.

Abstract: An exposure apparatus includes a light source for providing pulse light, a mask scanner for scanning a mask having a pattern, a wafer scanner for projecting a wafer onto which the pattern is to be projected and a light emission period determining device. The mask scanner and the wafer scanner scan the mask and the wafer in a timed relation so that the mask is illuminated while superposing portions of an illumination region defined by the pulse light and being narrower than the pattern such that the pattern is lithographically transferred onto the wafer. The light emission period determining device determines a period of emission of the pulse light, prior to an actual exposure process, wherein the emission period can be changed in accordance with a required precision of an integrated exposure amount.

Abstract: An exposure apparatus and device manufacturing method having structure and steps for projecting, for scan exposure of a substrate through an original, a plurality of light pulses from a pulse light source to the substrate through the original, changing an emitted light intensity of light pulses from the pulse light source during the scan exposure, and changing timing of light emission from the pulse light source during the scan exposure, whereby both the emitted light intensity and the timing of light pulses may be controlled during the scan exposure.

Abstract: An exposure apparatus includes a mask scanning device for scanning a mask on which a pattern is formed, a projection optical system for projecting the pattern on the mask onto a wafer, a wafer scanning device for scanning the wafer, onto which the pattern is projected by the projection optical system, an illuminating device for illuminating the mask in an illumination area narrower than the pattern by synchronously scanning the mask and the wafer relative to each other, using the mask scanning device and the wafer scanning device, so as to expose and transfer the pattern on the wafer, a detection device for detecting information regarding exposure before exposing and transferring the pattern onto the wafer by the illuminating device and for producing detection results, and a display for displaying exposure information obtained from the detection results. Also disclosed are methods of manufacturing semiconductor devices, for example, using such an exposure apparatus.

Abstract: A scanning projection exposure apparatus includes an illumination optical system for illuminating an original with pulse light, a projection optical system for projecting a pattern of the original, illuminated with the pulse light, onto a substrate, a moving device for moving the original and the substrate relative to each other, a position measuring device for measuring a relative positional relation between the original and the substrate, and a controller for discriminating whether the positional relation measured by the position measuring device is in a predetermined range. The discrimination is performed within a period after the moving device initiates the relative movement of the original and the substrate and before the illumination optical system initiates the projection exposure with the pulse light. The controller stops the projection exposure with the pulse light from the illumination optical system when the positional relation is discriminated as being out of a predetermined range.

Abstract: A method of measuring information related to an object, includes the steps of measuring a change of a measurement error with respect to time, and determining the frequency of measurements for measuring the measurement error, to be done during a measurement period, on the basis of the change in measurement error. Then, in the measurement period, a measured value is corrected by using a latest measurement error.