Abstract: A light-emitting module (1) includes a substrate (10), a plurality of light-emitting elements (14) formed on the substrate (10), and phosphor layers (15) covering each of the light-emitting elements (14). Each of the phosphor layers (15) includes a first phosphor region (15a) and a second phosphor region (15b) that are divided in the direction substantially parallel to the surface of the substrate (10). Each of the first phosphor region (15a) and the second phosphor region (15b) includes a phosphor that absorbs light emitted from the light-emitting element (14) and emits fluorescence. The maximum peak wavelength of fluorescence emitted from the first phosphor region (15a) is longer than that of fluorescence emitted from the second phosphor region (15b).

Abstract: A phosphor layer forming apparatus (1) in which a paste (21) containing a phosphor is discharged so as to cover each of a plurality of light-emitting elements (11) mounted on a substrate (10) includes the following: a discharge portion (12) for discharging the paste (21) in the form of droplets onto each of the light-emitting elements (11); a measurement portion (13) for measuring the thickness of individual phosphor layers that are formed of the paste (21) covering each of the light-emitting elements (11); and a discharge control portion (14) for controlling the amount of the paste (21) to be redischarged for each phosphor layer in accordance with the thickness of the individual phosphor layers measured by the measurement portion (13). This phosphor layer forming apparatus can reduce the manufacturing time.

Abstract: A light-emitting module (1) includes a substrate (10), a plurality of light-emitting elements (14) formed on the substrate (10), and phosphor layers (15) covering each of the light-emitting elements (14). Each of the phosphor layers (15) includes a first phosphor region (15a) and a second phosphor region (15b) that are divided in the direction substantially parallel to the surface of the substrate (10). Each of the first phosphor region (15a) and the second phosphor region (15b) includes a phosphor that absorbs light emitted from the light-emitting element (14) and emits fluorescence. The maximum peak wavelength of fluorescence emitted from the first phosphor region (15a) is longer than that of fluorescence emitted from the second phosphor region (15b).

Abstract: A light-emitting device (1) includes a substrate (10), a light-emitting element (12) that is mounted on the substrate (10) and includes a luminous region (12b) and a nonluminous region (12a), and a phosphor layer (13) that is formed to cover the light-emitting element (12). The thickness of the phosphor layer (13a) located on the nonluminous region (12a) is smaller than that of the phosphor layer (13b) located on the luminous region (12b). The light-emitting device (1) can suppress nonuniform luminescent color.

Abstract: In a light emitting apparatus that includes a plurality of semiconductor light emitting devices 2 each having a light emitting face covered with a phosphor layer 3, a semiconductor assembly obtained by assembling a submount and the semiconductor light emitting devices is mounted on the substrate. Accordingly, chromaticity characteristics of the semiconductor assembly can be measured before the semiconductor assembly is mounted on the substrate. Therefore, even if using a plurality of semiconductor light emitting devices, a semiconductor assembly can be prepared on which the semiconductor light emitting devices each having uniform chromaticity characteristics are mounted before the semiconductor assembly is mounted on the substrate. And, a light emitting apparatus having suppressed dispersion of chromaticity can be manufactured.

Abstract: A light-emitting device (1) includes the following: a substrate (10) that includes a base material (11) and a first conductor pattern (12) formed on a principal surface (11a) of the base material (11); a semiconductor light-emitting element (14) that is mounted on the first conductor pattern (12); and a phosphor layer (15) that is formed on the substrate (10) to cover the semiconductor light-emitting element (14) and emits fluorescence as a result of absorption of light emitted from the semiconductor light-emitting element (14). A side (15a) of the phosphor layer (15) and a side (10a) of the substrate (10) are connected continuously. The light-emitting device (1) can suppress color non-uniformity of light to be produced.

Abstract: In a module socket, a connecter and a connector are connected by wiring, and three LED modules are connected in parallel with respect to a constant voltage circuit unit via the wiring. Each module has a constant current circuit unit and an LED mounting unit. The constant current circuit unit includes one resistor and two transistors mounted on a surface of a sub-substrate on which a conductive land is formed. The sub-substrate is bonded to a main substrate.

Abstract: A luminescent light source includes: a light-emitting element (1); a substrate (2) including a conductor pattern (4); and a phosphor layer material (3) containing a phosphor and a light-transmitting base material. In the luminescent light source, the light-emitting element (1) is connected to a conductor pattern (4b), and the phosphor layer material (3) covers the light-emitting element (1). Further, at least the light-transmitting base material in the phosphor layer material (3) is disposed between the light-emitting element (1) and the substrate (2). Thus, a luminescent light source can be provided that allows a gap between a light-emitting element such as a LED bare chip or the like and a substrate to be eliminated, thereby obtaining output light with even chromaticity and achieving high luminous efficiency.

Abstract: A light-emitting device includes a light-emitting element 4, a light-transmitting sealing portion covering the light-emitting element 4, a multilayer substrate 6 on which the light-emitting element 4 is mounted, and a reflecting plate 7 disposed on the multilayer substrate 6, the sealing portion includes a first sealing layer 1 covering an outer surface of the light-emitting element 4, a second sealing layer 2 covering the first sealing layer 1 and a third sealing layer 3 covering the second sealing layer 2, the reflecting plate 7 surrounds the light-emitting element 4, and the third sealing layer 3 covers the reflecting plate 7 and is made to adhere to the multilayer substrate 6. This both suppresses a decrease in luminous flux of the light-emitting device using an LED and improves the reliability of the sealing portion.

Abstract: An LED lamp according to the present invention includes: a substrate 10 having a principal surface 10a; at least one LED 12, which is supported on the principal surface 10a of the substrate 10; a reflector 16, which has an opening that defines a reflective surface 14 surrounding the side surface of the LED 12 and which is supported on the principal surface 10a of the substrate 10; and an encapsulating resin layer 18, which covers the LED 12 and the reflector 16 together. When a portion of the encapsulating resin layer 18 that covers the side surfaces 16w of the reflector 16 has a thickness Dw and another portion of the encapsulating resin layer 18 that covers the upper surface 16h of the reflector 16 has a thickness Dh, the LED lamp has a Dh/Dw ratio of 1.2 to 1.8.

Abstract: An LED lighting source preventing heat deterioration and improving luminous efficiency includes a mounting substrate having a wiring pattern on a first main surface thereof and a plurality of LED bare chips, each composed of a first semiconductor layer and a second semiconductor layer having respectively different conductivity, an active layer disposed therebetween, and a metal electrode on the first semiconductor layer and substantially equal in area thereto, and each LED bare chip being joined to the wiring pattern according to flip chip mounting of the metal electrode to form a junction between the wiring pattern and the metal electrode. Each junction is formed so that an area thereof is at least 20% of the area of the metal electrode. Thermal resistance from the active layers through to a second main surface of the mounting substrate, which is a back surface thereof, is set to 3.0 9C./W or lower.

Abstract: In a module socket, a connecter and a connector are connected by wiring, and three LED modules are connected in parallel with respect to a constant voltage circuit unit via the wiring. Each module has a constant current circuit unit and an LED mounting unit. The constant current circuit unit includes one resistor and two transistors mounted on a surface of a sub-substrate on which a conductive land is formed. The sub-substrate is bonded to a main substrate.

Abstract: An LED lamp according to the present invention includes: a substrate 10 having a principal surface 10a; at least one LED 12, which is supported on the principal surface 10a of the substrate 10; a reflector 16, which has an opening that defines a reflective surface 14 surrounding the side surface of the LED 12 and which is supported on the principal surface 10a of the substrate 10; and an encapsulating resin layer 18, which covers the LED 12 and the reflector 16 together. When a portion of the encapsulating resin layer 18 that covers the side surfaces 16w of the reflector 16 has a thickness Dw and another portion of the encapsulating resin layer 18 that covers the upper surface 16h of the reflector 16 has a thickness Dh, the LED lamp has a Dh/Dw ratio of 1.2 to 1.8.