Patents by Inventor Noriyuki Hirano

Noriyuki Hirano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10696805
    Abstract: One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. The other purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both containing the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition includes the constituent element [A]: An epoxy resin including an aromatic ring and having a functionality of 2 or higher and the following constituent element [B]: An amine-based hardener or an acid anhydride-based hardener, and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95° C.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: June 30, 2020
    Assignee: Toray Industries, Inc.
    Inventors: Ayumi Mori, Noriyuki Hirano, Masayuki Miyoshi
  • Patent number: 10676611
    Abstract: The purpose of the present invention is to provide a prepreg which satisfies one of a)-c): a) having superior storage stability and capable of providing a fiber-reinforced composite material having superior mechanical properties; b) capable of providing a fiber-reinforced composite material having superior mechanical properties, and the obtained fiber-reinforced composite material has superior appearance quality; and c) having superior storage stability, generating less amount of heat when cured, and enabling the cure extent and the viscosity in the B-stage state to be flexibly controlled. To achieve the purpose, the present invention provides a prepreg including reinforced fibers and an epoxy resin composition which contains an epoxy resin and a curing agent represented by a specific chemical formula, and which satisfies a specific condition.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: June 9, 2020
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Eiki Takahashi, Daisuke Konishi, Noriyuki Hirano, Tatsuya Fujita, Shuji Udagawa
  • Publication number: 20200140676
    Abstract: The present invention aims to provide an epoxy resin composition that is high in both fast curability and storage stability, a prepreg prepared by using the epoxy resin composition, and a fiber reinforced composite material prepared by curing the prepreg. The epoxy resin composition contains the following components [A], [B], [C], and [D] and meets the following requirements [a], [b], and [c]: [A]: epoxy resin, [B]: dicyandiamide, [C]: aromatic urea, [D]: borate ester, [a]: 0.014?(content of component [D]/content of component [C])?0.045, [b]: 0.9?(number of moles of active groups in component [A]/number of moles of active hydrogen in component [B])?1.2, and [c]: 14?(content of component [A]/content of component [C])?25.
    Type: Application
    Filed: July 18, 2018
    Publication date: May 7, 2020
    Applicant: Toray Industries, Inc.
    Inventors: Eiki Takahashi, Daisuke Konishi, Masayuki Miyoshi, Noriyuki Hirano
  • Patent number: 10488745
    Abstract: A light source device includes: a light source section emitting excitation light; homogenizer optical element; first condensing element converging the excitation light; wavelength conversion element on which the converged excitation light is incident and that emits fluorescent light; and light separation element. The light source section, homogenizer optical element, and light separation element are disposed on a first illumination optical axis.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: November 26, 2019
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Noriko Imae, Takayuki Matsubara, Katsumitsu Hama, Noriyuki Hirano
  • Publication number: 20190249002
    Abstract: The purpose of the present invention is to provide a prepreg which satisfies one of a)-c): a) having superior storage stability and capable of providing a fiber-reinforced composite material having superior mechanical properties; b) capable of providing a fiber-reinforced composite material having superior mechanical properties, and the obtained fiber-reinforced composite material has superior appearance quality; and c) having superior storage stability, generating less amount of heat when cured, and enabling the cure extent and the viscosity in the B-stage state to be flexibly controlled. To achieve the purpose, the present invention provides a prepreg including reinforced fibers and an epoxy resin composition which contains an epoxy resin and a curing agent represented by a specific chemical formula, and which satisfies a specific condition.
    Type: Application
    Filed: July 20, 2017
    Publication date: August 15, 2019
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Eiki Takahashi, Daisuke Konishi, Noriyuki Hirano, Tatsuya Fujita, Shuji Udagawa
  • Publication number: 20190211201
    Abstract: The present invention provides an epoxy resin composition that serves to produce a cured epoxy resin that simultaneously realizes a high heat resistance, a high elastic modulus, and a low color and to produce a molded article having a good appearance without suffering the formation of white spots on the surface thereof when used as matrix resin in a fiber reinforced composite material. The epoxy resin composition includes an epoxy resin as component [A], an aromatic urea [B1] and/or an imidazole compound [B2] as component [B], and a borate ester compound as component [C], containing dicyandiamide in the amount of 0.5 part by mass or less relative to the total quantity of epoxy resins which accounts for 100 parts by mass, wherein the epoxy resin composition meets certain sets of further requirements with respect to its composition.
    Type: Application
    Filed: June 23, 2017
    Publication date: July 11, 2019
    Applicant: Toray Industries, Inc.
    Inventors: Kentaro Sano, Taiki Kuroda, Reo Takaiwa, Noriyuki Hirano
  • Patent number: 10344117
    Abstract: An epoxy resin composition includes [A] an epoxy resin, [B] dicyandiamide, [C] an aromatic urea and [D] a boric acid ester and satisfies any one of (i) requirements [a] and [b], (ii) requirements [c] and [d] and (iii) requirements [c] and [e]:[a]: the time from when the temperature reaches 100° C. till when the heat flow reaches a peak top is 60 minutes or shorter as determined by a differential scanning calorimetry; [b]: the time from when the temperature reaches 60° C.
    Type: Grant
    Filed: November 27, 2015
    Date of Patent: July 9, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Kentaro Sano, Reo Takaiwa, Noriyuki Hirano
  • Publication number: 20190177470
    Abstract: The present invention provides an epoxy resin composition that serves to produce a cured epoxy resin that simultaneously realizes a high heat resistance, a high elastic modulus, and a low color and to produce a molded article having a good appearance without suffering the formation of white spots on the surface thereof when used as matrix resin in a fiber reinforced composite material.
    Type: Application
    Filed: June 23, 2017
    Publication date: June 13, 2019
    Applicant: Toray Industries, Inc.
    Inventors: Kentaro Sano, Taiki Kuroda, Reo Takaiwa, Noriyuki Hirano
  • Patent number: 10316159
    Abstract: An epoxy resin composition includes: an [A] epoxy resin at least comprising an [A1] isocyanurate epoxy resin and an [A2] glycidyl amine epoxy resin; [B] dicyandiamide; and [C] diaminodiphenyl sulfone, wherein (1) an average epoxy equivalent of the [A] epoxy resin is 115 g/eq to 150 g/eq, and (2) an amount of the component [C] added is an amount of 0.05 equivalent to 0.3 equivalent relative to epoxy groups in the [A] epoxy resin in terms of active hydrogen groups.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: June 11, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Reo Takaiwa, Junko Kawasaki, Kentaro Sano, Noriyuki Hirano
  • Publication number: 20190155135
    Abstract: A light source device includes: a light source section emitting excitation light; homogenizer optical element; first condensing element converging the excitation light; wavelength conversion element on which the converged excitation light is incident and that emits fluorescent light; and light separation element. The light source section, homogenizer optical element, and light separation element are disposed on a first illumination optical axis.
    Type: Application
    Filed: November 16, 2016
    Publication date: May 23, 2019
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Noriko IMAE, Takayuki MATSUBARA, Katsumitsu HAMA, Noriyuki HIRANO
  • Patent number: 10266641
    Abstract: Provided are: an epoxy resin composition for fiber-reinforced composite materials, which has a good balance between storage stability and fast curing properties at high levels; a prepreg; and an epoxy resin composition which exhibits excellent mechanical characteristics as a fiber-reinforced composite material. A resin composition which contains an epoxy resin, dicyandiamide, an imidazole compound and an acidic compound, while satisfying the following conditions (a)-(c): (d) The time until the heat flow rate reaches the peak top after the epoxy resin composition reaches 100° C. is 25 minutes or less as measured by a differential scanning calorimeter at an isothermal temperature of 100° C. in a nitrogen gas stream. (e) The time until the heat flow rate reaches the peak top after the epoxy resin composition reaches 60° C. is 15 hours or more as measured by a differential scanning calorimeter at an isothermal temperature of 60° C. in a nitrogen gas stream.
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: April 23, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Reo Takaiwa, Kentaro Sano, Noriyuki Hirano
  • Patent number: 10253142
    Abstract: An epoxy resin composition is provided including at least the following component [A], component [B], and component [C] or [D] wherein cured product obtained by curing the epoxy resin composition has a rubbery state modulus in dynamic viscoelasticity evaluation of 10 MPa or less, and the cured product has a glass transition temperature of at least 95° C.; [A] an aromatic epoxy resin having a functionality of at least 3, [B] an aromatic diamine having a substituent at ortho position of each amino group or a cycloalkyldiamine wherein the carbon atom adjacent to the carbon atom bonded to each amino group has a substituent, [C] an aliphatic polyamine having an alkylene glycol structure, [D] a straight chain or branched aliphatic polyamine containing 6 to 12 carbon atoms.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: April 9, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Ayumi Matsuda, Masayuki Miyoshi, Noriyuki Hirano
  • Publication number: 20190054706
    Abstract: A method of producing a fiber reinforced composite material satisfies condition 1: a thermosetting resin base material (B) includes a thermosetting resin (a) and a nonwoven fabric-shaped base material (a thermosetting resin base material satisfying the condition 1 is referred to as a thermosetting resin base material (B-1)); and condition 2: the thermosetting resin base material (B) is a base material including the thermosetting resin (a), and a porous sheet-shaped base material (b) or a film-shaped base material (c), the thermosetting resin (a) has a viscosity of 1,000 Pa·s or more at 40° C., and the thermosetting resin (a) has a minimum viscosity of 10 Pa·s or less during heating from 30° C. at a temperature rise rate of 1.5° C./min (a thermosetting resin base material satisfying the condition 2 is referred to as a thermosetting resin base material (B-2)).
    Type: Application
    Filed: February 14, 2017
    Publication date: February 21, 2019
    Inventors: Tomohiro Takehara, Masato Honma, Terry Sakurai Brown, Noriyuki Hirano
  • Patent number: 10175566
    Abstract: A light source device, an illumination device, and a projector which are capable of thinning a bundle of light beams while being low in a focal magnification ratio, and are small in size are to be provided. The light source device includes a first light source unit adapted to emit a first light beam, a second light source unit adapted to emit a bundle of light beams including a second light beam and a third light beam, a reduction optical system adapted to reduce the bundle of light beams, and a combining optical system adapted to combine the first light beam and the reduced bundle of light beams with each other. The combining optical system is provided with a light transmitting area and a light reflecting area.
    Type: Grant
    Filed: March 11, 2016
    Date of Patent: January 8, 2019
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Takayuki Matsubara, Koichi Akiyama, Noriyuki Hirano
  • Patent number: 10146119
    Abstract: A light source device, an illumination device, and a projector which are capable of thinning a bundle of light beams while being low in a focal magnification ratio, and are small in size are to be provided. The light source device includes a first light source unit adapted to emit a first light beam, a second light source unit adapted to emit a bundle of light beams including a second light beam and a third light beam, a reduction optical system adapted to reduce the bundle of light beams, and a combining optical system adapted to combine the first light beam and the reduced bundle of light beams with each other. The combining optical system is provided with a light transmitting area and a light reflecting area.
    Type: Grant
    Filed: March 11, 2016
    Date of Patent: December 4, 2018
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Takayuki Matsubara, Koichi Akiyama, Noriyuki Hirano
  • Patent number: 10132464
    Abstract: A light output apparatus includes a light source that emits light shoving different light orientation distributions in a first direction and a second direction and having a high optical intensity area larger in the first direction than in the second direction, a collimator lens that parallelizes the light emitted from the light source, and a Powell lens that spreads the parallelized light from the collimator lens in the first direction, maintains the parallelized direction provided by the collimator lens in the second direction, and outputs the resultant light along a third direction that is perpendicular to the first and second directions and serves as a central axis.
    Type: Grant
    Filed: October 20, 2014
    Date of Patent: November 20, 2018
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Toshihiko Sakai, Noriyuki Hirano
  • Patent number: 10093777
    Abstract: A fiber-reinforced resin sheet and an integrally molded article are provided. The fiber-reinforced resin sheet comprises a nonwoven fabric made of reinforcing fibers having a thermoplastic resin (A) impregnated on one side of the nonwoven fabric. The fiber-reinforced resin sheet satisfies any one of the following conditions (I) and (II): (I) the nonwoven fabric has an area wherein the reinforcing fibers constituting the nonwoven fabric are exposed on the other side in the thickness direction of the nonwoven fabric, and (II) the nonwoven fabric has a thermoplastic resin (B) impregnated on the other side in thickness direction of the nonwoven fabric, and the nonwoven fabric has a reinforcing fiber volume ratio Vfm of up to 20% by volume, and wherein the thermoplastic resin (A) and the thermoplastic resin (B) form an interface layer in the sheet, and the interface layer has a concave-convex shape with a maximum height Ry of at least 50 ?m and an average roughness Rz of at least 30 ?m.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: October 9, 2018
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yoshiki Takebe, Hiroki Kihara, Noriyuki Hirano
  • Publication number: 20180251617
    Abstract: An epoxy resin composition includes: an [A] epoxy resin at least comprising an [A1] isocyanurate epoxy resin and an [A2] glycidyl amine epoxy resin; [B] dicyandiamide; and [C] diaminodiphenyl sulfone, wherein (1) an average epoxy equivalent of the [A] epoxy resin is 115 g/eq to 150 g/eq, and (2) an amount of the component [C] added is an amount of 0.05 equivalent to 0.3 equivalent relative to epoxy groups in the [A] epoxy resin in terms of active hydrogen groups.
    Type: Application
    Filed: July 20, 2016
    Publication date: September 6, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Reo Takaiwa, Junko Kawasaki, Kentaro Sano, Noriyuki Hirano
  • Publication number: 20180186946
    Abstract: One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. The other purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both containing the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition includes the constituent element [A]: An epoxy resin including an aromatic ring and having a functionality of 2 or higher and the following constituent element [B]: An amine-based hardener or an acid anhydride-based hardener, and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95° C.
    Type: Application
    Filed: June 22, 2016
    Publication date: July 5, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Ayumi Mori, Noriyuki Hirano, Masayuki Miyoshi
  • Publication number: 20180067387
    Abstract: A light source device, an illumination device, and a projector which are capable of thinning a bundle of light beams while being low in a focal magnification ratio, and are small in size are to be provided. The light source device includes a first light source unit adapted to emit a first light beam, a second light source unit adapted to emit a bundle of light beams including a second light beam and a third light beam, a reduction optical system adapted to reduce the bundle of light beams, and a combining optical system adapted to combine the first light beam and the reduced bundle of light beams with each other. The combining optical system is provided with a light transmitting area and a light reflecting area.
    Type: Application
    Filed: March 11, 2016
    Publication date: March 8, 2018
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Takayuki MATSUBARA, Koichi AKIYAMA, Noriyuki HIRANO