Abstract: A light-blocking object processing section produces first and second light-blocking objects to be formed on the front and back surfaces of a print medium, respectively. A first image object is formed on the first light-blocking object and a second image object is formed on the second light-blocking object. If the first and second image objects should be formed in first and second areas, respectively, and the first and second areas defining an overlapping area in which the first image object overlaps the second image object, then the light-blocking object processing section performs one of a first process in which the thickness of the first and second light-blocking objects is smaller in the overlapping area than in a third area outside the overlapping area and a second process in which one of the first and second light-blocking objects is not formed.

Abstract: An image forming apparatus includes an image forming part that forms an image on a print medium with a color colorant, a clear coat agent application part that applies a clear coat agent to the print medium passed through the image forming part, and a clear coat agent application amount determination part that determines an application amount of the clear coat agent.

Abstract: A light-blocking object processing section produces first and second light-blocking objects to be formed on the front and back surfaces of a print medium, respectively. A first image object is formed on the first light-blocking object and a second image object is formed on the second light-blocking object. If the first and second image objects should be formed in first and second areas, respectively, and the first and second areas defining an overlapping area in which the first image object overlaps the second image object, then the light-blocking object processing section performs one of a first process in which the thickness of the first and second light-blocking objects is smaller in the overlapping area than in a third area outside the overlapping area and a second process in which one of the first and second light-blocking objects is not formed.

Abstract: An image forming apparatus includes an image forming part that forms an image on a print medium with a color colorant, a clear coat agent application part that applies a clear coat agent to the print medium passed through the image forming part, and a clear coat agent application amount determination part that determines an application amount of the clear coat agent.

Abstract: A database creation method relating to semiconductor ICs, the database registering function block cells constituting a design data of semiconductor IC and evaluation values corresponding to the function block cells such that the function block cells are associated with the evaluation values, for each of the semiconductor ICs, the creation method includes judging whether or not that function block cells constituting a design data of desired semiconductor IC include an unregistered function block cell which is not registered in the database, calculating an unregistered evaluation value corresponding to the unregistered function block cell when the function block cells constituting the design data of the desired semiconductor IC are judged to include the unregistered function block cell, and updating the database by registering the unregistered function block cell and the unregistered evaluation value such that the unregistered function block cell is associated with the unregistered evaluation value.

Abstract: The present invention is directed to a method of holding a veneer sheet which has been dried to a moisture content lower than the fiber saturation point and also heated to a temperature higher than an ambient temperature of an environment where the veneer sheet is held. The veneer sheet is bent in such way that at least a part of the veneer sheet in the longitudinal section thereof along the grain direction is curved and the same veneer sheet in any transverse section thereof perpendicular to the grain direction is substantially straight. The veneer sheet held bent is held for a predetermined period of time.

Abstract: A device for machining the flange part of a wheel arch, wherein a machining mechanism includes, as general-purpose drive parts, first to third cylinders, and the work bending mold for bending the flange part of the wheel arch, work receiving mold, and work guide of the machining mechanism are replaceable with those of the other types. When a dedicated mold is replaced according to the shape of a work, the entire part of the machining mechanism must not be replaced, but merely the work bending mold, work receiving mold and work guide may be replaced with those of the other types.

Abstract: A database creation method relating to semiconductor ICs, the database registering function block cells constituting a design data of semiconductor IC and evaluation values corresponding to the function block cells such that the function block cells are associated with the evaluation values, for each of the semiconductor ICs, the creation method includes judging whether or not that function block cells constituting a design data of desired semiconductor IC include an unregistered function block cell which is not registered in the database, calculating an unregistered evaluation value corresponding to the unregistered function block cell when the function block cells constituting the design data of the desired semiconductor IC are judged to include the unregistered function block cell, and updating the database by registering the unregistered function block cell and the unregistered evaluation value such that the unregistered function block cell is associated with the unregistered evaluation value.

Abstract: A receiving device is provided. A pulse width is measured, it is selected whether a determination process is performed for a pulse width having the length of one bit in accordance with the measured value of the pulse width or a pulse width having the length of ½ bit, it is discriminated whether a current pulse edge is a pulse edge at the center of the bit or a pulse edge at the boundary between bits while considering the bit data right before the determined bit, and when it is determined that the current pulse edge is the pulse edge at the center of the bit, the bit data is determined by the rising edge or the falling edge of the pulse edge.

Abstract: The present invention is directed to a method of holding a veneer sheet which has been dried to a moisture content lower than the fiber saturation point and also heated to a temperature higher than an ambient temperature of an environment where the veneer sheet is held. The veneer sheet is bent in such way that at least a part of the veneer sheet in the longitudinal section thereof along the grain direction is curved and the same veneer sheet in any transverse section thereof perpendicular to the grain direction is substantially straight. The veneer sheet held bent is held for a predetermined period of time.

Abstract: A method and an apparatus of wood pressing usable in manufacturing glued laminated wood such as laminated veneer lumber (LVL) using a number of wood veneer sheets are disclosed. A hot press used for wood pressing includes a pair of heating plates which are disposed one above the other and have pressing surfaces facing each other. The paired heating plates are both movable toward and away from each other. In operation, firstly one of the heating plates is moved toward the other heating plate to a position where the pressing surface of the one heating plate is spaced from a surface to which a veneer sheet is to be glued by a distance corresponding to the thickness of the veneer sheet. Then, the other heating plate is moved toward the one heating plate until a desired pressure is produced pressing.

Abstract: A receiving device is provided. A pulse width is measured, it is selected whether a determination process is performed for a pulse width having the length of one bit in accordance with the measured value of the pulse width or a pulse width having the length of ½ bit, it is discriminated whether a current pulse edge is a pulse edge at the center of the bit or a pulse edge at the boundary between bits while considering the bit data right before the determined bit, and when it is determined that the current pulse edge is the pulse edge at the center of the bit, the bit data is determined by the rising edge or the falling edge of the pulse edge.

Abstract: A receiving device is provided. A pulse width is measured, it is selected whether a determination process is performed for a pulse width having the length of one bit in accordance with the measured value of the pulse width or a pulse width having the length of ½ bit, it is discriminated whether a current pulse edge is a pulse edge at the center of the bit or a pulse edge at the boundary between bits while considering the bit data right before the determined bit, and when it is determined that the current pulse edge is the pulse edge at the center of the bit, the bit data is determined by the rising edge or the falling edge of the pulse edge.

Abstract: The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection material 100 for electrically connecting an electrical connection portion of a first object 4 and an electrical connection portion of a second object 2. The electrical connection material 100 comprises a first film-like adhesive layer 6 which is a film-like adhesive layer arranged on the first object 4 and is composed of a plurality of conductive particles 7, a first binder 8 containing the conductive particles 7, and a first filler F1 and a second film-like adhesive layer 9 which is arranged on the first film-like adhesive layer 6 and is composed of a second binder 9A whose viscosity is lower than that of the first binder 8 and a second filler F2.

Abstract: A method and apparatus of manufacturing glued laminated wood such as laminated veneer lumber (LVL) are disclosed. The glued laminated wood is made of a number of wood sheets such as veneer sheets which are laminated together by a hot press with a thermosetting adhesive into a continuous length of multiple-layered board of the glued laminated wood wherein wood sheets in each layer of the multiple-layered board are arranged in a staggered relation in the lengthwise direction of the board to wood sheets in an adjacent layer. The hot press has a pair of heating plates arranged substantially in facing relation to each other and an auxiliary heating plate disposed adjacent to one end of each heating plate. The auxiliary heating plate is adapted to press part of wood sheet which extends out beyond the above end of the heating plate.

Abstract: A receiving device is provided. A pulse width is measured, it is selected whether a determination process is performed for a pulse width having the length of one bit in accordance with the measured value of the pulse width or a pulse width having the length of ½ bit, it is discriminated whether a current pulse edge is a pulse edge at the center of the bit or a pulse edge at the boundary between bits while considering the bit data right before the determined bit, and when it is determined that the current pulse edge is the pulse edge at the center of the bit, the bit data is determined by the rising edge or the falling edge of the pulse edge.

Abstract: A device for machining the flange part of a wheel arch, wherein a machining mechanism includes, as general-purpose drive parts, first to third cylinders, and the work bending mold for bending the flange part of the wheel arch, work receiving mold, and work guide of the machining mechanism are replaceable with those of the other types. When a dedicated mold is replaced according to the shape of a work, the entire part of the machining mechanism must not be replaced, but merely the work bending mold, work receiving mold and work guide may be replaced with those of the other types.

Abstract: The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection material 100 for electrically connecting an electrical connection portion of a first object 4 and an electrical connection portion of a second object 2. The electrical connection material 100 comprises a first film-like adhesive layer 6 which is a film-like adhesive layer arranged on the first object 4 and is composed of a plurality of conductive particles 7, a first binder 8 containing the conductive particles 7, and a first filler F1 and a second film-like adhesive layer 9 which is arranged on the first film-like adhesive layer 6 and is composed of a second binder 9A whose viscosity is lower than that of the first binder 8 and a second filler F2.

Abstract: A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100<((?A×F)/H)<125 where ?A represents the top diameter of a bump bonded with an electrode, H the height of a bump projecting from the IC chip and bonded with an electrode, and F the linear thermal expansion coefficient of the sealing resin.

Abstract: A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100<((?A×F)/H)<125 where ?A represents the top diameter of a bump bonded with an electrode, H the height of a bump projecting from the IC chip and bonded with an electrode, and F the linear thermal expansion coefficient of the sealing resin.