Abstract: A method and apparatus of manufacturing glued laminated wood such as laminated veneer lumber (LVL) are disclosed. The glued laminated wood is made of a number of wood sheets such as veneer sheets which are laminated together by a hot press with a thermosetting adhesive into a continuous length of multiple-layered board of the glued laminated wood wherein wood sheets in each layer of the multiple-layered board are arranged in a staggered relation in the lengthwise direction of the board to wood sheets in an adjacent layer. The hot press has a pair of heating plates arranged substantially in facing relation to each other and an auxiliary heating plate disposed adjacent to one end of each heating plate. The auxiliary heating plate is adapted to press part of wood sheet which extends out beyond the above end of the heating plate.

Abstract: The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection material 100 for electrically connecting an electrical connection portion of a first object 4 and an electrical connection portion of a second object 2. The electrical connection material 100 comprises a first film-like adhesive layer 6 which is a film-like adhesive layer arranged on the first object 4 and is composed of a plurality of conductive particles 7, a first binder 8 containing the conductive particles 7, and a first filler F1 and a second film-like adhesive layer 9 which is arranged on the first film-like adhesive layer 6 and is composed of a second binder 9A whose viscosity is lower than that of the first binder 8 and a second filler F2.

Abstract: A method of manufacturing glued laminated wood such as laminated veneer lumber (LVL) is disclosed. The glued laminated wood is made of a number of wood sheets such as veneer sheets which are laminated together by a hot press with a thermosetting adhesive into a continuous length of multiple-layered board wherein the end joints of the wood sheets are disposed in a staggered array. There is provided an initial base material having an end which is shaped in the form of a flight of steps including a series of alternate horizontal surface having a lengthwise dimension smaller than the length of the wood sheet and a vertical surface having a height corresponding to the wood sheet thickness, and the glued laminated wood board is formed extending from the end of such initial base material. The hot press includes a pair of heat plates each having an effective pressing area capable of covering the entire surface of the wood sheet.

Abstract: A method and an apparatus of wood pressing usable in manufacturing glued laminated wood such as laminated veneer lumber (LVL) using a number of wood veneer sheets are disclosed. A hot press used for wood pressing includes a pair of heating plates which are disposed one above the other and have pressing surfaces facing each other. The paired heating plates are both movable toward and away from each other. In operation, firstly one of the heating plates is moved toward the other heating plate to a position where the pressing surface of the one heating plate is spaced from a surface to which a veneer sheet is to be glued by a distance corresponding to the thickness of the veneer sheet. Then, the other heating plate is moved toward the one heating plate until a desired pressure is produced pressing.

Abstract: A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100<((?A×F)/H)<125 where ?A represents the top diameter of a bump bonded with an electrode, H the height of a bump projecting from the IC chip and bonded with an electrode, and F the linear thermal expansion coefficient of the sealing resin.

Abstract: A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100<((?A×F)/H)<125 where ?A represents the top diameter of a bump bonded with an electrode, H the height of a bump projecting from the IC chip and bonded with an electrode, and F the linear thermal expansion coefficient of the sealing resin.

Abstract: The present invention provides an electrical connecting member and an electrical connecting method for achieving electrical connection securely through conductive particles regardless of a slight unevenness of an object matter. An electrical connecting device (10) for electrically connecting an electrical connecting portion (5) of a first object to an electrical connecting portion (3) of a second object comprises an adhesive layer (6) disposed on the first object (4) and constituted of a plurality of conductive particles (7) and a binder (8) containing the plurality of the conductive particles (7) and a paste (9) having a fluidity and disposed on the film-like adhesive layer (6).

Abstract: A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100<((&PHgr;A×F)/H)<125 where &PHgr;A represents the top diameter of a bump bonded with an electrode, H the height of a bump projecting from the IC chip and bonded with an electrode, and F the linear thermal expansion coefficient of the sealing resin.

Abstract: A method of manufacturing glued laminated wood such as laminated veneer lumber (LVL) is disclosed. The glued laminated wood is made of a number of wood sheets such as veneer sheets which are laminated together by a hot press with a thermosetting adhesive into a continuous length of multiple-layered board wherein the end joints of the wood sheets are disposed in a staggered array. There is provided an initial base material having an end which is shaped in the form of a flight of steps including a series of alternate horizontal surface having a lengthwise dimension smaller than the length of the wood sheet and a vertical surface having a height corresponding to the wood sheet thickness, and the glued laminated wood board is formed extending from the end of such initial base material. The hot press includes a pair of heat plates each having an effective pressing area capable of covering the entire surface of the wood sheet.

Abstract: A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied. 100<((&PHgr;A×F)/H)<125 where &PHgr;A represents the top diameter of a bump bonded with an electrode, H the height of a bump projecting from the IC chip and bonded with an electrode, and F the linear thermal expansion coefficient of the sealing resin.

Abstract: A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied.

Abstract: The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection material 100 for electrically connecting an electrical connection portion of a first object 4 and an electrical connection portion of a second object 2. The electrical connection material 100 comprises a first film-like adhesive layer 6 which is a film-like adhesive layer arranged on the first object 4 and is composed of a plurality of conductive particles 7, a first binder 8 containing the conductive particles 7, and a first filler F1 and a second film-like adhesive layer 9 which is arranged on the first film-like adhesive layer 6 and is composed of a second binder 9A whose viscosity is lower than that of the first binder 8 and a second filler F2.

Abstract: The present invention provides an electrical connecting member and an electrical connecting method for achieving electrical connection securely through conductive particles regardless of a slight unevenness of an object matter. An electrical connecting device (10) for electrically connecting an electrical connecting portion (5) of a first object to an electrical connecting portion (3) of a second object comprises an adhesive layer (6) disposed on the first object (4) and constituted of a plurality of conductive particles (7) and a binder (8) containing the plurality of the conductive particles (7) and a paste (9) having a fluidity and disposed on the film-like adhesive layer (6).

Abstract: An electrically connecting device and an electrical connecting method in which electrical connections can be positively realized via electrically conductive particles despite slight irregularities of objects to be eclectically connected to each other. The electrical connecting device 100 electrically connects an electrically connection portion 5 of the first object and the electrically connection portion 3 of the second object. The electrical connecting device 100 is made up of a first film-shaped adhesive layer 6 and a second film-shaped adhesive layer 9. The first film-shaped adhesive layer 6, arranged on the first object 4, is made up of plural electrically conductive particles 7 and a binder 8 containing the electrically conductive particles 7. The second film-shaped adhesive layer 9, arranged on the first film-shaped adhesive layer 6 containing the electrically conductive particles, is made up only of a fluid binder.

Abstract: The present invention provides an electrical connecting member and an electrical connecting method for achieving electrical connection securely through conductive particles regardless of a slight unevenness of an object matter. An electrical connecting device (10) for electrically connecting an electrical connecting portion (5) of a first object to an electrical connecting portion (3) of a second object comprises an adhesive layer (6) disposed on the first object (4) and constituted of a plurality of conductive particles (7) and a binder (8) containing the plurality of the conductive particles (7) and a paste (9) having a fluidity and disposed on the film-like adhesive layer (6).

Abstract: According to a method of transferring a sheet through a working apparatus, a first sheet is moved by feed rolls partially into a working area of the working apparatus, which is followed by moving a second sheet by the same feed rolls to allow the leading end of the second sheet to be brought into abutment with the trailing end of its preceding first sheet and then to push the first sheet to a predetermined position within the working area. After the first sheet is thus placed and the second sheet is moved back out of the working area, the apparatus is operated to work the first sheet, for example, by pressing. The second sheet is moved forward into abutment with the trailing end of the worked first sheet and moved further while pushing the first sheet toward delivery rolls of the apparatus, which then removes the first sheet out of the working area of the apparatus. Such steps of operation is repeated to transfer a series of sheets successively through the working apparatus.

Abstract: A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied.

Abstract: An anisotropic electrically conductive film which reduces a connection resistance value in electrical connection to assure reliable electric connection, and an electrical connecting device employing this anisotropic electrically conductive film. To this end, metal coated particles having a resin (40) as a core material are dispersed in an insulating adhesive (8) to give an anisotropic electrically eonductive film. The resin (40) of the metal coated particles is coated with a metal layer having a thickness of 1000 to 3000 Å.

Abstract: A veneer-pressing apparatus comprising a pressing device provided with at least three pressing bodies disposed movably from a non-pressing position where the pressing bodies are vertically spaced apart from each other to a pressing position where the pressing bodies are close to each other; endless belts each adapted to be intermittently moved in a direction opposite to that of the neighboring endless belt, thereby forming a forward transfer passage between a pair of facing surfaces of the neighboring endless belts and a backward transfer passage which is opposite in transferring direction to the forward transfer passage; and a pressing member which is capable of rendering the pressing bodies provided with the endless belt to move from a non-pressing position to a pressing position to press a veneer with a predetermined pressure.

Abstract: A veneer drying apparatus comprises a pair of upper and lower hot plates connected to a heating unit and a plurality of steam escape grooves formed in the opposing press surfaces of the upper and lower hot plates. The apparatus further comprises intermittently driven endless belts and driving and driven rollers on the unloading and loading ends, respectively, of the lower hot plate. The endless belts are trained over the driving and driven rollers for transferring veneer P over the upper surface of the lower hot plate. Each endless belt has numerous apertures formed in the entire surface thereof in a regular pattern. The driving rollers have numerous protrusions formed on the periphery thereof for engaging in the apertures formed in the endless belts. The endless belts are smoothly driven by rotation of the driving rollers due to the protrusion-aperture engagement.