Patents by Inventor Noriyuki Taguchi
Noriyuki Taguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9190591Abstract: A heat sink is thermally connected to a substrate on which LED elements are mounted. A fan unit is arranged near the distal end of a fin segment of the heat sink. A vent hole is formed in a case so as to expose the base end of the fin segment entirely in a direction in which fins are aligned. The heat sink is configured such that a gap between the fins is substantially blocked in a part except where the vent hole is present. The gap is an opening extending in a width direction perpendicular to the direction in which the fins are aligned. Space between the distal end of the fin segment and the fan unit functions as a pressure chamber that is placed in a positively pressurized condition or a negatively pressurized condition by cooling air traveling from the fan unit.Type: GrantFiled: November 18, 2014Date of Patent: November 17, 2015Assignee: Panasonic Industrial Devices SUNX Co., Ltd.Inventors: Akihiro Tahara, Tsuyoshi Inui, Noriyuki Taguchi, Yoshiyuki Nakazono, Kanto Imai
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Publication number: 20150221844Abstract: A heat sink is thermally connected to a substrate on which LED elements are mounted. A fan unit is arranged near the distal end of a fin segment of the heat sink. A vent hole is formed in a case so as to expose the base end of the fin segment entirely in a direction in which fins are aligned. The heat sink is configured such that a gap between the fins is substantially blocked in a part except where the vent hole is present. The gap is an opening extending in a width direction perpendicular to the direction in which the fins are aligned. Space between the distal end of the fin segment and the fan unit functions as a pressure chamber that is placed in a positively pressurized condition or a negatively pressurized condition by cooling air traveling from the fan unit.Type: ApplicationFiled: November 18, 2014Publication date: August 6, 2015Inventors: Akihiro Tahara, Tsuyoshi Inui, Noriyuki Taguchi, Yoshiyuki Nakazono, Kanto Imai
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Publication number: 20100147464Abstract: The present invention relates to a plasma treatment apparatus for treating an object to be treated by activating a plasma production gas by an electric discharge, and by blowing this activated plasma production gas onto the object to be treated. A covered electrode is formed by embedding a conductive layer in an insulating substrate made of a ceramic sintered body. The covered electrodes are arranged opposed to each other to form an electric discharge space in a space between the covered electrodes. A power supply is included for causing an electric discharge in the electric discharge space by applying a voltage to the conductive layers. Since no ceramic material is sprayed, it is possible to reduce the costs of the material for the covered electrodes, and to simplify the process for manufacturing the covered electrodes.Type: ApplicationFiled: February 13, 2008Publication date: June 17, 2010Applicant: PANASONIC ELECTRIC WORKS CO., LTD.Inventors: Tetsuji Shibata, Noriyuki Taguchi, Yoshiyuki Nakazono
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Patent number: 7543546Abstract: A plasma treatment apparatus is provided, which enables to increase a treatment area and provide good treatment uniformity. This apparatus comprises a pair of electrode plates having a plurality of through holes and an insulating plate having a plurality of through holes. The insulating plate is disposed between the electrode plates such that positions of the through holes of the electrode plates correspond to the positions of the through holes of the insulating plate. A plurality of discharge spaces are formed by the through holes of the electrode plates and the through holes of the insulating plate. By applying a voltage between the electrode plates, while supplying a plasma generation gas into the discharge spaces, plasmas are generated simultaneously in the discharge spaces, and sprayed on an object to efficiently perform a large-area, uniform plasma treatment.Type: GrantFiled: May 26, 2004Date of Patent: June 9, 2009Assignee: Matsushita Electric Works, Ltd.Inventors: Tetsuji Shibata, Keiichi Yamazaki, Noriyuki Taguchi, Yasushi Sawada
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Patent number: 7273652Abstract: Production of hollow carbon fibers and hollow carbon particles includes baking and carbonization of polymer particles having a specified volume after deformation. A metal-deposited carbon fiber with metal deposited inside and/or outside the hollow carbon fiber is applicable to electron discharge devices. The thickness and crystallinity of the graphite layer can be freely controlled. Since almost no by-product is generated, separation and refining using a solvent is not required. A hollow carbon particle of desired shape can be produced at a high yield rate. The hollow carbon fiber represented by a carbon nano-tube can be controlled in such a way that a low resistance and uniform shape are provided so that there is an increase in the amount of electrons discharged from the hollow carbon fiber. Use of this hollow carbon fiber as an electron discharge source provides an excellent electron discharge device characterized by stable pixels.Type: GrantFiled: October 15, 2002Date of Patent: September 25, 2007Assignee: Hitachi Chemical Company, Ltd.Inventors: Shinji Takeda, Noriyuki Taguchi, Kazumi Kokaji, Osamu Hirai
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Patent number: 7239261Abstract: The purpose of the present invention is to provide an easy-to-manufacture electromagnetic wave absorption material usable from submillimeter wave region to millimeter wave region with an excellent radio wave absorbing performance and a variety of usage thereof. The present invention is characterized by an electromagnetic wave absorption material comprised of a dispersions of at least one of the materials: a multi-layer hollow globule of carbon, a schungite carbon, and the schungite ore; mixed into a matter having a high electrical resistivity. The invention is further characterized by an electronic device, an optical transmission module, an optical reception module, a high frequency telecommunication equipment, and a stop-free automated tollgate system, wherein at least a part of their board, electronic element, and circuit wiring are covered with said electromagnetic wave absorption material.Type: GrantFiled: August 9, 2004Date of Patent: July 3, 2007Assignee: Hitachi Ltd.Inventors: Tadashi Fujieda, Kishio Hidaka, Shinzou Ikeda, Mitsuo Hayashibara, Noriyuki Taguchi
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Patent number: 7187072Abstract: A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.Type: GrantFiled: November 10, 2003Date of Patent: March 6, 2007Assignee: Hitachi Chemical Company, Ltd.Inventors: Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara, Noriyuki Taguchi, Hiroshi Nomura
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Publication number: 20060042545Abstract: A plasma treatment apparatus is provided, which enables to increase a treatment area and provide good treatment uniformity. This apparatus comprises a pair of electrode plates having a plurality of through holes and an insulating plate having a plurality of through holes. The insulating plate is disposed between the electrode plates such that positions of the through holes of the electrode plates correspond to the positions of the through holes of the insulating plate. A plurality of discharge spaces are formed by the through holes of the electrode plates and the through holes of the insulating plate. By applying a voltage between the electrode plates, while supplying a plasma generation gas into the discharge spaces, plasmas are generated simultaneously in the discharge spaces, and sprayed on an object to efficiently perform a large-area, uniform plasma treatment.Type: ApplicationFiled: May 26, 2004Publication date: March 2, 2006Inventors: Tetsuji Shibata, Keiichi Yamazaki, Noriyuki Taguchi, Yasushi Sawada
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Publication number: 20050035896Abstract: The purpose of the present invention is to provide an easy-to-manufacture electromagnetic wave absorption material usable from submillimeter wave region to millimeter wave region with an excellent radio wave absorbing performance and a variety of usage thereof. The present invention is characterized by an electromagnetic wave absorption material comprised of a dispersions of at least one of the materials: a multi-layer hollow globule of carbon, a schungite carbon, and the schungite ore; mixed into a matter having a high electrical resistivity. The invention is further characterized by an electronic device, an optical transmission module, an optical reception module, a high frequency telecommunication equipment, and a stop-free automated tollgate system, wherein at least a part of their board, electronic element, and circuit wiring are covered with said electromagnetic wave absorption material.Type: ApplicationFiled: August 9, 2004Publication date: February 17, 2005Inventors: Tadashi Fujieda, Kishio Hidaka, Shinzou Ikeda, Mitsuo Hayashibara, Noriyuki Taguchi
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Publication number: 20050016456Abstract: A plasma treatment apparatus and method are provided, which have the capability of maintaining a stable discharge, achieving a sufficient plasma treatment, and reducing plasma temperature. In this apparatus, electrodes are arranged to define a discharge space therebetween, and a dielectric material is disposed at a discharge-space side of at least one of the electrodes. A voltage is applied between the electrodes, while a plasma generation gas being supplied into the discharge space, to develop the discharge in the discharge space under a pressure substantially equal to atmospheric pressure, and provide the plasma generated by the discharge from the discharge space. A waveform of the voltage applied between the electrodes is an alternating voltage waveform without rest period. At least one of rising and falling times of the alternating voltage waveform is 100 ?sec or less. A repetition frequency is in a range of 0.5 to 1000 kHz. An electric-field intensity applied between the electrodes is in a range of 0.Type: ApplicationFiled: February 20, 2003Publication date: January 27, 2005Inventors: Noriyuki Taguchi, Yasushi Sawada, Kohichi Matsunaga
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Patent number: 6818821Abstract: An electromagnetic wave absorption material includes a dispersions of at least one of the materials: a multi-layer hollow globule of carbon, a schungite carbon, and the schungite ore; mixed into a matter having a high electrical resistivity. The invention is further characterized by an electronic device, an optical transmission module, an optical reception module, a high frequency telecommunication equipment, and a stop-free automated tollgate system, wherein at least a part of their board, electronic element, and circuit wiring are covered with said electromagnetic wave absorption material.Type: GrantFiled: September 6, 2002Date of Patent: November 16, 2004Assignee: Hitachi, Ltd.Inventors: Tadashi Fujieda, Kishio Hidaka, Shinzou Ikeda, Mitsuo Hayashibara, Noriyuki Taguchi
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Publication number: 20040146452Abstract: The purpose of the present invention is to provide an easy-to-manufacture electromagnetic wave absorption material usable from submillimeter wave region to millimeter wave region with an excellent radio wave absorbing performance and a variety of usage thereof.Type: ApplicationFiled: January 14, 2004Publication date: July 29, 2004Inventors: Tadashi Fujieda, Kishio Hidaka, Shinzou Ikeda, Mitsuo Hayashibara, Noriyuki Taguchi
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Publication number: 20040110319Abstract: A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.Type: ApplicationFiled: November 10, 2003Publication date: June 10, 2004Applicant: Hitachi Chemical Company, Ltd.Inventors: Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara, Noriyuki Taguchi, Hiroshi Nomura
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Patent number: 6746897Abstract: A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.Type: GrantFiled: October 23, 2001Date of Patent: June 8, 2004Inventors: Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara, Noriyuki Taguchi, Hiroshi Nomura
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Patent number: 6743500Abstract: Production of hollow carbon fibers and hollow carbon particles includes baking and carbonization of polymer particles having a specified volume after deformation. A metal-deposited carbon fiber with metal deposited inside and/or outside the hollow carbon fiber is applicable to electron discharge devices. The thickness and crystallinity of the graphite layer can be freely controlled. Since almost no by-product is generated, separation and refining using a solvent is not required. A hollow carbon particle of desired shape can be produced at a high yield rate. The hollow carbon fiber represented by a carbon nano-tube can be controlled in such a way that a low resistance and uniform shape are provided so that there is an increase in the amount of electrons discharged from the hollow carbon fiber. Use of this hollow carbon fiber as an electron discharge source provides an excellent electron discharge device characterized by stable pixels.Type: GrantFiled: October 29, 2001Date of Patent: June 1, 2004Assignee: Hitachi Chemical Company, Ltd.Inventors: Shinji Takeda, Noriyuki Taguchi, Kazumi Kokaji, Osamu Hirai
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Patent number: 6670766Abstract: A plasma treatment apparatus and a plasma treatment method having the capability of uniformly treating an object with plasma at a high treatment speed. This apparatus includes a tubular vessel having a laterally elongated cross section, a pair of electrodes arranged such that electric flux lines develop substantially in an axial direction of the tubular vessel when one of an AC voltage and a pulse voltage is applied between the electrodes, a gas supply for supplying a streamer generation gas into the tubular vessel, a power source for applying the voltage between the electrodes to generate plural streamers of the gas in the tubular vessel, and a plasma uniformity mechanism for making the plural streamers uniform in a lateral direction of the laterally elongated cross section of the tubular vessel to provide the plasma from one end of the tubular vessel.Type: GrantFiled: May 24, 2001Date of Patent: December 30, 2003Assignee: Matsushita Electric Works, Ltd.Inventors: Keiichi Yamazaki, Yukiko Inooka, Yasushi Sawada, Noriyuki Taguchi, Yoshiyuki Nakazono, Akio Nakano
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Patent number: 6641792Abstract: Production of hollow carbon fibers and hollow carbon particles includes baking and carbonization of polymer particles having a specified volume after deformation. A metal-deposited carbon fiber with metal deposited inside and/or outside the hollow carbon fiber is applicable to electron discharge devices. The thickness and crystallinity of the graphite layer can be freely controlled. Since almost no by-product is generated, separation and refining using a solvent is not required. A hollow carbon particle of desired shape can be produced at a high yield rate. The hollow carbon fiber represented by a carbon nano-tube can be controlled in such a way that a low resistance and uniform shape are provided so that there is an increase in the amount of electrons discharged from the hollow carbon fiber. Use of this hollow carbon fiber as an electron discharge source provides an excellent electron discharge device characterized by stable pixels.Type: GrantFiled: October 15, 2002Date of Patent: November 4, 2003Assignee: Hitachi Chemical Company, Ltd.Inventors: Shinji Takeda, Noriyuki Taguchi, Kazumi Kokaji, Osamu Hirai
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Publication number: 20030155143Abstract: The purpose of the present invention is to provide an easy-to-manufacture electromagnetic wave absorption material usable from submillimeter wave region to millimeter wave region with an excellent radio wave absorbing performance and a variety of usage thereof.Type: ApplicationFiled: September 6, 2002Publication date: August 21, 2003Inventors: Tadashi Fujieda, Kishio Hidaka, Shinzou Ikeda, Mitsuo Hayashibara, Noriyuki Taguchi
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Publication number: 20030039830Abstract: Production of hollow carbon fibers and hollow carbon particles includes baking and carbonization of polymer particles having a specified volume after deformation. A metal-deposited carbon fiber with metal deposited inside and/or outside the hollow carbon fiber is applicable to electron discharge devices. The thickness and crystallinity of the graphite layer can be freely controlled. Since almost no by-product is generated, separation and refining using a solvent is not required. A hollow carbon particle of desired shape can be produced at a high yield rate. The hollow carbon fiber represented by a carbon nano-tube can be controlled in such a way that a low resistance and uniform shape are provided so that there is an increase in the amount of electrons discharged from the hollow carbon fiber. Use of this hollow carbon fiber as an electron discharge source provides an excellent electron discharge device characterized by stable pixels.Type: ApplicationFiled: October 15, 2002Publication date: February 27, 2003Inventors: Shinji Takeda, Noriyuki Taguchi, Kazumi Kokaji, Osamu Hirai
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Publication number: 20030039829Abstract: Production of hollow carbon fibers and hollow carbon particles includes baking and carbonization of polymer particles having a specified volume after deformation. A metal-deposited carbon fiber with metal deposited inside and/or outside the hollow carbon fiber is applicable to electron discharge devices. The thickness and crystallinity of the graphite layer can be freely controlled. Since almost no by-product is generated, separation and refining using a solvent is not required. A hollow carbon particle of desired shape can be produced at a high yield rate. The hollow carbon fiber represented by a carbon nano-tube can be controlled in such a way that a low resistance and uniform shape are provided so that there is an increase in the amount of electrons discharged from the hollow carbon fiber. Use of this hollow carbon fiber as an electron discharge source provides an excellent electron discharge device characterized by stable pixels.Type: ApplicationFiled: October 15, 2002Publication date: February 27, 2003Inventors: Shinji Takeda, Noriyuki Taguchi, Kazumi Kokaji, Osamu Hirai