Patents by Inventor Noriyuki Taguchi

Noriyuki Taguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9190591
    Abstract: A heat sink is thermally connected to a substrate on which LED elements are mounted. A fan unit is arranged near the distal end of a fin segment of the heat sink. A vent hole is formed in a case so as to expose the base end of the fin segment entirely in a direction in which fins are aligned. The heat sink is configured such that a gap between the fins is substantially blocked in a part except where the vent hole is present. The gap is an opening extending in a width direction perpendicular to the direction in which the fins are aligned. Space between the distal end of the fin segment and the fan unit functions as a pressure chamber that is placed in a positively pressurized condition or a negatively pressurized condition by cooling air traveling from the fan unit.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: November 17, 2015
    Assignee: Panasonic Industrial Devices SUNX Co., Ltd.
    Inventors: Akihiro Tahara, Tsuyoshi Inui, Noriyuki Taguchi, Yoshiyuki Nakazono, Kanto Imai
  • Publication number: 20150221844
    Abstract: A heat sink is thermally connected to a substrate on which LED elements are mounted. A fan unit is arranged near the distal end of a fin segment of the heat sink. A vent hole is formed in a case so as to expose the base end of the fin segment entirely in a direction in which fins are aligned. The heat sink is configured such that a gap between the fins is substantially blocked in a part except where the vent hole is present. The gap is an opening extending in a width direction perpendicular to the direction in which the fins are aligned. Space between the distal end of the fin segment and the fan unit functions as a pressure chamber that is placed in a positively pressurized condition or a negatively pressurized condition by cooling air traveling from the fan unit.
    Type: Application
    Filed: November 18, 2014
    Publication date: August 6, 2015
    Inventors: Akihiro Tahara, Tsuyoshi Inui, Noriyuki Taguchi, Yoshiyuki Nakazono, Kanto Imai
  • Publication number: 20100147464
    Abstract: The present invention relates to a plasma treatment apparatus for treating an object to be treated by activating a plasma production gas by an electric discharge, and by blowing this activated plasma production gas onto the object to be treated. A covered electrode is formed by embedding a conductive layer in an insulating substrate made of a ceramic sintered body. The covered electrodes are arranged opposed to each other to form an electric discharge space in a space between the covered electrodes. A power supply is included for causing an electric discharge in the electric discharge space by applying a voltage to the conductive layers. Since no ceramic material is sprayed, it is possible to reduce the costs of the material for the covered electrodes, and to simplify the process for manufacturing the covered electrodes.
    Type: Application
    Filed: February 13, 2008
    Publication date: June 17, 2010
    Applicant: PANASONIC ELECTRIC WORKS CO., LTD.
    Inventors: Tetsuji Shibata, Noriyuki Taguchi, Yoshiyuki Nakazono
  • Patent number: 7543546
    Abstract: A plasma treatment apparatus is provided, which enables to increase a treatment area and provide good treatment uniformity. This apparatus comprises a pair of electrode plates having a plurality of through holes and an insulating plate having a plurality of through holes. The insulating plate is disposed between the electrode plates such that positions of the through holes of the electrode plates correspond to the positions of the through holes of the insulating plate. A plurality of discharge spaces are formed by the through holes of the electrode plates and the through holes of the insulating plate. By applying a voltage between the electrode plates, while supplying a plasma generation gas into the discharge spaces, plasmas are generated simultaneously in the discharge spaces, and sprayed on an object to efficiently perform a large-area, uniform plasma treatment.
    Type: Grant
    Filed: May 26, 2004
    Date of Patent: June 9, 2009
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Tetsuji Shibata, Keiichi Yamazaki, Noriyuki Taguchi, Yasushi Sawada
  • Patent number: 7273652
    Abstract: Production of hollow carbon fibers and hollow carbon particles includes baking and carbonization of polymer particles having a specified volume after deformation. A metal-deposited carbon fiber with metal deposited inside and/or outside the hollow carbon fiber is applicable to electron discharge devices. The thickness and crystallinity of the graphite layer can be freely controlled. Since almost no by-product is generated, separation and refining using a solvent is not required. A hollow carbon particle of desired shape can be produced at a high yield rate. The hollow carbon fiber represented by a carbon nano-tube can be controlled in such a way that a low resistance and uniform shape are provided so that there is an increase in the amount of electrons discharged from the hollow carbon fiber. Use of this hollow carbon fiber as an electron discharge source provides an excellent electron discharge device characterized by stable pixels.
    Type: Grant
    Filed: October 15, 2002
    Date of Patent: September 25, 2007
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shinji Takeda, Noriyuki Taguchi, Kazumi Kokaji, Osamu Hirai
  • Patent number: 7239261
    Abstract: The purpose of the present invention is to provide an easy-to-manufacture electromagnetic wave absorption material usable from submillimeter wave region to millimeter wave region with an excellent radio wave absorbing performance and a variety of usage thereof. The present invention is characterized by an electromagnetic wave absorption material comprised of a dispersions of at least one of the materials: a multi-layer hollow globule of carbon, a schungite carbon, and the schungite ore; mixed into a matter having a high electrical resistivity. The invention is further characterized by an electronic device, an optical transmission module, an optical reception module, a high frequency telecommunication equipment, and a stop-free automated tollgate system, wherein at least a part of their board, electronic element, and circuit wiring are covered with said electromagnetic wave absorption material.
    Type: Grant
    Filed: August 9, 2004
    Date of Patent: July 3, 2007
    Assignee: Hitachi Ltd.
    Inventors: Tadashi Fujieda, Kishio Hidaka, Shinzou Ikeda, Mitsuo Hayashibara, Noriyuki Taguchi
  • Patent number: 7187072
    Abstract: A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.
    Type: Grant
    Filed: November 10, 2003
    Date of Patent: March 6, 2007
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara, Noriyuki Taguchi, Hiroshi Nomura
  • Publication number: 20060042545
    Abstract: A plasma treatment apparatus is provided, which enables to increase a treatment area and provide good treatment uniformity. This apparatus comprises a pair of electrode plates having a plurality of through holes and an insulating plate having a plurality of through holes. The insulating plate is disposed between the electrode plates such that positions of the through holes of the electrode plates correspond to the positions of the through holes of the insulating plate. A plurality of discharge spaces are formed by the through holes of the electrode plates and the through holes of the insulating plate. By applying a voltage between the electrode plates, while supplying a plasma generation gas into the discharge spaces, plasmas are generated simultaneously in the discharge spaces, and sprayed on an object to efficiently perform a large-area, uniform plasma treatment.
    Type: Application
    Filed: May 26, 2004
    Publication date: March 2, 2006
    Inventors: Tetsuji Shibata, Keiichi Yamazaki, Noriyuki Taguchi, Yasushi Sawada
  • Publication number: 20050035896
    Abstract: The purpose of the present invention is to provide an easy-to-manufacture electromagnetic wave absorption material usable from submillimeter wave region to millimeter wave region with an excellent radio wave absorbing performance and a variety of usage thereof. The present invention is characterized by an electromagnetic wave absorption material comprised of a dispersions of at least one of the materials: a multi-layer hollow globule of carbon, a schungite carbon, and the schungite ore; mixed into a matter having a high electrical resistivity. The invention is further characterized by an electronic device, an optical transmission module, an optical reception module, a high frequency telecommunication equipment, and a stop-free automated tollgate system, wherein at least a part of their board, electronic element, and circuit wiring are covered with said electromagnetic wave absorption material.
    Type: Application
    Filed: August 9, 2004
    Publication date: February 17, 2005
    Inventors: Tadashi Fujieda, Kishio Hidaka, Shinzou Ikeda, Mitsuo Hayashibara, Noriyuki Taguchi
  • Publication number: 20050016456
    Abstract: A plasma treatment apparatus and method are provided, which have the capability of maintaining a stable discharge, achieving a sufficient plasma treatment, and reducing plasma temperature. In this apparatus, electrodes are arranged to define a discharge space therebetween, and a dielectric material is disposed at a discharge-space side of at least one of the electrodes. A voltage is applied between the electrodes, while a plasma generation gas being supplied into the discharge space, to develop the discharge in the discharge space under a pressure substantially equal to atmospheric pressure, and provide the plasma generated by the discharge from the discharge space. A waveform of the voltage applied between the electrodes is an alternating voltage waveform without rest period. At least one of rising and falling times of the alternating voltage waveform is 100 ?sec or less. A repetition frequency is in a range of 0.5 to 1000 kHz. An electric-field intensity applied between the electrodes is in a range of 0.
    Type: Application
    Filed: February 20, 2003
    Publication date: January 27, 2005
    Inventors: Noriyuki Taguchi, Yasushi Sawada, Kohichi Matsunaga
  • Patent number: 6818821
    Abstract: An electromagnetic wave absorption material includes a dispersions of at least one of the materials: a multi-layer hollow globule of carbon, a schungite carbon, and the schungite ore; mixed into a matter having a high electrical resistivity. The invention is further characterized by an electronic device, an optical transmission module, an optical reception module, a high frequency telecommunication equipment, and a stop-free automated tollgate system, wherein at least a part of their board, electronic element, and circuit wiring are covered with said electromagnetic wave absorption material.
    Type: Grant
    Filed: September 6, 2002
    Date of Patent: November 16, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Tadashi Fujieda, Kishio Hidaka, Shinzou Ikeda, Mitsuo Hayashibara, Noriyuki Taguchi
  • Publication number: 20040146452
    Abstract: The purpose of the present invention is to provide an easy-to-manufacture electromagnetic wave absorption material usable from submillimeter wave region to millimeter wave region with an excellent radio wave absorbing performance and a variety of usage thereof.
    Type: Application
    Filed: January 14, 2004
    Publication date: July 29, 2004
    Inventors: Tadashi Fujieda, Kishio Hidaka, Shinzou Ikeda, Mitsuo Hayashibara, Noriyuki Taguchi
  • Publication number: 20040110319
    Abstract: A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.
    Type: Application
    Filed: November 10, 2003
    Publication date: June 10, 2004
    Applicant: Hitachi Chemical Company, Ltd.
    Inventors: Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara, Noriyuki Taguchi, Hiroshi Nomura
  • Patent number: 6746897
    Abstract: A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.
    Type: Grant
    Filed: October 23, 2001
    Date of Patent: June 8, 2004
    Inventors: Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara, Noriyuki Taguchi, Hiroshi Nomura
  • Patent number: 6743500
    Abstract: Production of hollow carbon fibers and hollow carbon particles includes baking and carbonization of polymer particles having a specified volume after deformation. A metal-deposited carbon fiber with metal deposited inside and/or outside the hollow carbon fiber is applicable to electron discharge devices. The thickness and crystallinity of the graphite layer can be freely controlled. Since almost no by-product is generated, separation and refining using a solvent is not required. A hollow carbon particle of desired shape can be produced at a high yield rate. The hollow carbon fiber represented by a carbon nano-tube can be controlled in such a way that a low resistance and uniform shape are provided so that there is an increase in the amount of electrons discharged from the hollow carbon fiber. Use of this hollow carbon fiber as an electron discharge source provides an excellent electron discharge device characterized by stable pixels.
    Type: Grant
    Filed: October 29, 2001
    Date of Patent: June 1, 2004
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shinji Takeda, Noriyuki Taguchi, Kazumi Kokaji, Osamu Hirai
  • Patent number: 6670766
    Abstract: A plasma treatment apparatus and a plasma treatment method having the capability of uniformly treating an object with plasma at a high treatment speed. This apparatus includes a tubular vessel having a laterally elongated cross section, a pair of electrodes arranged such that electric flux lines develop substantially in an axial direction of the tubular vessel when one of an AC voltage and a pulse voltage is applied between the electrodes, a gas supply for supplying a streamer generation gas into the tubular vessel, a power source for applying the voltage between the electrodes to generate plural streamers of the gas in the tubular vessel, and a plasma uniformity mechanism for making the plural streamers uniform in a lateral direction of the laterally elongated cross section of the tubular vessel to provide the plasma from one end of the tubular vessel.
    Type: Grant
    Filed: May 24, 2001
    Date of Patent: December 30, 2003
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Keiichi Yamazaki, Yukiko Inooka, Yasushi Sawada, Noriyuki Taguchi, Yoshiyuki Nakazono, Akio Nakano
  • Patent number: 6641792
    Abstract: Production of hollow carbon fibers and hollow carbon particles includes baking and carbonization of polymer particles having a specified volume after deformation. A metal-deposited carbon fiber with metal deposited inside and/or outside the hollow carbon fiber is applicable to electron discharge devices. The thickness and crystallinity of the graphite layer can be freely controlled. Since almost no by-product is generated, separation and refining using a solvent is not required. A hollow carbon particle of desired shape can be produced at a high yield rate. The hollow carbon fiber represented by a carbon nano-tube can be controlled in such a way that a low resistance and uniform shape are provided so that there is an increase in the amount of electrons discharged from the hollow carbon fiber. Use of this hollow carbon fiber as an electron discharge source provides an excellent electron discharge device characterized by stable pixels.
    Type: Grant
    Filed: October 15, 2002
    Date of Patent: November 4, 2003
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shinji Takeda, Noriyuki Taguchi, Kazumi Kokaji, Osamu Hirai
  • Publication number: 20030155143
    Abstract: The purpose of the present invention is to provide an easy-to-manufacture electromagnetic wave absorption material usable from submillimeter wave region to millimeter wave region with an excellent radio wave absorbing performance and a variety of usage thereof.
    Type: Application
    Filed: September 6, 2002
    Publication date: August 21, 2003
    Inventors: Tadashi Fujieda, Kishio Hidaka, Shinzou Ikeda, Mitsuo Hayashibara, Noriyuki Taguchi
  • Publication number: 20030039830
    Abstract: Production of hollow carbon fibers and hollow carbon particles includes baking and carbonization of polymer particles having a specified volume after deformation. A metal-deposited carbon fiber with metal deposited inside and/or outside the hollow carbon fiber is applicable to electron discharge devices. The thickness and crystallinity of the graphite layer can be freely controlled. Since almost no by-product is generated, separation and refining using a solvent is not required. A hollow carbon particle of desired shape can be produced at a high yield rate. The hollow carbon fiber represented by a carbon nano-tube can be controlled in such a way that a low resistance and uniform shape are provided so that there is an increase in the amount of electrons discharged from the hollow carbon fiber. Use of this hollow carbon fiber as an electron discharge source provides an excellent electron discharge device characterized by stable pixels.
    Type: Application
    Filed: October 15, 2002
    Publication date: February 27, 2003
    Inventors: Shinji Takeda, Noriyuki Taguchi, Kazumi Kokaji, Osamu Hirai
  • Publication number: 20030039829
    Abstract: Production of hollow carbon fibers and hollow carbon particles includes baking and carbonization of polymer particles having a specified volume after deformation. A metal-deposited carbon fiber with metal deposited inside and/or outside the hollow carbon fiber is applicable to electron discharge devices. The thickness and crystallinity of the graphite layer can be freely controlled. Since almost no by-product is generated, separation and refining using a solvent is not required. A hollow carbon particle of desired shape can be produced at a high yield rate. The hollow carbon fiber represented by a carbon nano-tube can be controlled in such a way that a low resistance and uniform shape are provided so that there is an increase in the amount of electrons discharged from the hollow carbon fiber. Use of this hollow carbon fiber as an electron discharge source provides an excellent electron discharge device characterized by stable pixels.
    Type: Application
    Filed: October 15, 2002
    Publication date: February 27, 2003
    Inventors: Shinji Takeda, Noriyuki Taguchi, Kazumi Kokaji, Osamu Hirai