Abstract: The invention has its object to realize compact arrangement of particulate filter 5 and selective reduction catalyst 6 for improved mountability on a vehicle while a sufficient reaction time is ensured for generation of ammonia from urea water. In an exhaust emission control device with the filter 5 and the catalyst 6 capable of selectively reacting NOx with ammonia even in the presence of oxygen being incorporated in an exhaust pipe 4, urea water as reducing agent being addible therebetween, the filter 5 is arranged in a fore-and-aft direction of a vehicle and along a frame 10 of the vehicle. The catalyst 6 is arranged in a vicinity of an inlet end of the filter 5 and directed laterally outward of the vehicle. A communication passage 9 is arranged to guide the exhaust gas 3 discharged from an outlet end of the filter 5 to an inlet end of the catalyst 6 in a forwardly fold-back manner. A urea water adding injector 11 (urea water adding means) for addition of urea water is arranged midway of the passage 9.

Abstract: A semiconductor device of a multi-pin structure using a lead frame is provided. The semiconductor device comprises a tab having a chip supporting surface, the chip supporting surface whose dimension is smaller than a back surface of a semiconductor chip, a plurality of leads arranged around the tab, the semiconductor chip mounted over the chip supporting surface of the tab, a plurality of suspending leads for supporting the tab, four bar leads arranged outside the tab so as to surround the tab and coupled to the suspending leads, a plurality of wires for coupling between the semiconductor chip and the leads, and a sealing body for sealing the semiconductor chip and the wires with resin, with first slits being formed respectively in first coupling portions of the bar leads for coupling with the suspending leads.

Abstract: Chipping of semiconductor chips is to be prevented. A semiconductor device comprises a semiconductor chip having a main surface, a plurality of pads formed over the main surface, a rearrangement wiring formed over the main surface to alter an arrangement of the plurality of pads, and a protective film and an insulating film formed over the main surface, and a plurality of solder bumps each connected to the rearrangement wiring and arranged differently from the plurality of pads. The presence of a bevel cut surface obliquely continuous to the main surface and formed on a periphery of the main surface of the semiconductor chip prevents chipping.

Abstract: The heat-release properties of semiconductor device are to be improved and the reliability thereof is to be improved. The semiconductor device has a wiring substrate, a heat-releasing plate having a convex part inserted into a through-hole of the wiring substrate, a semiconductor chip mounted over the convex part of the heat-releasing plate, and a bonding wire coupling an electrode pad of the semiconductor chip with a bonding lead of the wiring substrate, and further has a sealing portion covering a portion of an upper surface of the wiring substrate, a sealing portion covering a portion of a lower surface of the wiring substrate including the semiconductor chip and the bonding wire, and a solder ball placed over a lower surface of the wiring substrate.

Abstract: To suppress the reduction in reliability of a resin-sealed semiconductor device. A first cap (member) and a second cap (member) with a cavity (space formation portion) are superimposed and bonded together to form a sealed space. A semiconductor including a sensor chip (semiconductor chip) and wires inside the space is manufactured in the following way. In a sealing step of sealing a joint part between the caps, a sealing member is formed of resin such that an entirety of an upper surface of the second cap and an entirety of a lower surface of the first cap are respectively exposed. Thus, in the sealing step, the pressure acting in the direction of crushing the second cap can be decreased.

Abstract: A signal restoration circuit includes a storage configured to store input signals by disposing the input signals in an input order, the input signals being readable from the storage in the disposed order, and a storage controller configured to control delay time from an input of the input signal to an output in the storage based on delay information of the input signal.

Abstract: A semiconductor chip is mounted on a heat sink disposed inside a through-hole of a wiring board, electrodes of the semiconductor chip and connecting terminals of the wiring board are connected by bonding wires, a sealing resin is formed to cover the semiconductor chip and the bonding wires, and solder balls are formed on the lower surface of the wiring board, thereby constituting the semiconductor device. The heat sink is thicker than the wiring board. The heat sink has a protruded portion protruding to outside from the side surface of the heat sink, the protruded portion is located on the upper surface of the wiring board outside the through-hole, and the lower surface of the protruded portion contacts to the upper surface of the wiring board. When the semiconductor device is manufactured, the heat sink is inserted from the upper surface side of the wiring board.

Abstract: On a report making screen, medical images taken from a patient are displayed in a viewer. When an area of concern, such as an abnormal shadow, is designated in any of the displayed medical images, the medical images containing the area of concern are chosen. By drag-and-dropping one of the chosen images to an assigned position in a comment editing zone of the report making screen, a three-dimensional image reconstituted of the chosen images is displayed as a confirmation image, wherein the designated area of concern is displayed distinguishably from other portion, enabling checking whether the choice of the images or the designation of the area of concern is correct or not. When the choice and designation is fixed, group data registering the chosen images as a group and position data relating to positions of the area of concern in the chosen images are memorized in linkage with the assigned position.

Abstract: A medical reporting system includes a display panel for displaying plural CT images. A ROI setting unit designates a region of interest in the CT images. A group setting unit sets a group of specific CT images having the region of interest among the CT images, to generate group information of the group. A report editor displays a note area for inputting a note related to the specific CT images. A memory stores a text location of the note area assigned to the group information, and stores location information of the region of interest in the specific CT images. Furthermore, a first terminal device has the report editor, the ROI setting unit and the group setting unit. A second terminal device communicates with the first terminal device on line. A reporting display panel displays at least the specific CT images and the note.

Abstract: [Objects] To improve productivity and reduce thermal energy consumption in manufacturing of high purity silicon as a raw material for metallurgical grade pure silicon.

Abstract: An electronic file sending method is provided to securely and easily send en electronic file to a receiver. A receiving apparatus receives from a sending apparatus an electronic mail including an encrypted electronic file. The sending apparatus uses a public key of a management server to encrypt a decryption password that is necessary to decrypt the encrypted electronic file and sends the encrypted decryption password to the management server. In association with a file identifier of the electronic file, the management server stores the decryption password and an electronic mail address of a correct receiver, who is a receiver of the receiving apparatus. The receiving apparatus sends to the management server the file identifier of the electronic file and the electronic mail address of the receiver. The management server uses a public key of the receiving apparatus to encrypt the password and sends the encrypted password to the receiving apparatus.

Abstract: A priority control register 104 dynamically controls the internal transition state based on the issuability state of a memory request obtained in the memory request issuability signal generation unit 106 and retaining state of the memory request in the REQ_BUF 102 obtained by each of determination circuits 105 #2 through #5. Thus, the jump control of the priorities corresponding to the access regulation of the DRAM module 109 can be realized.

Abstract: A semiconductor chip is mounted on a heat sink disposed inside a through-hole of a wiring board, electrodes of the semiconductor chip and connecting terminals of the wiring board are connected by bonding wires, a sealing resin is formed to cover the semiconductor chip and the bonding wires, and solder balls are formed on the lower surface of the wiring board, thereby constituting the semiconductor device. The heat sink is thicker than the wiring board. The heat sink has a protruded portion protruding to outside from the side surface of the heat sink, the protruded portion is located on the upper surface of the wiring board outside the through-hole, and the lower surface of the protruded portion contacts to the upper surface of the wiring board. When the semiconductor device is manufactured, the heat sink is inserted from the upper surface side of the wiring board.

Abstract: Chipping of semiconductor chips is to be prevented. A semiconductor device comprises a semiconductor chip having a main surface, a plurality of pads formed over the main surface, a rearrangement wiring formed over the main surface to alter an arrangement of the plurality of pads, and a protective film and an insulating film formed over the main surface, and a plurality of solder bumps each connected to the rearrangement wiring and arranged differently from the plurality of pads. The presence of a bevel cut surface obliquely continuous to the main surface and formed on a periphery of the main surface of the semiconductor chip prevents chipping.

Abstract: The yield of semiconductor devices is to be enhanced. A tray is provided with a plurality of pockets each capable of accommodating a wafer level CSP, and each of the pockets is provided with a base for supporting a plurality of bumps of the wafer level CSP and side walls formed around the base. In the step-to-step carriage in the post-production process of the manufacture of wafer level CSPs and on like occasions, the base supports not the organic film but the plurality of solder bumps. For this reason, it is made possible to prevent the organic film from being flawed or coming off and adhering to the product as foreign matter, and as a result the quality and yield of the wafer level CSPs (semiconductor devices) can be improved.

Abstract: Chipping of semiconductor chips is to be prevented. A semiconductor device comprises a semiconductor chip having a main surface, a plurality of pads formed over the main surface, a rearrangement wiring formed over the main surface to alter an arrangement of the plurality of pads, and a protective film and an insulating film formed over the main surface, and a plurality of solder bumps each connected to the rearrangement wiring and arranged differently from the plurality of pads. The presence of a bevel cut surface obliquely continuous to the main surface and formed on a periphery of the main surface of the semiconductor chip prevents chipping.

Abstract: A multicast data communication system is provided that has high security, and prevents problems such as an attack by a malicious user creating a great number of meaningless tables at nodes in the network. Clients regularly transmit request packets toward a server; a node receives the request packet, and subsequently receives a delivery-table-creation packet or a delivery packet from the server; if the node has no delivery table corresponding to the server, the node creates the delivery table, registers the addresses of the clients, and their request packet arrival times, and regularly transmits the request packet toward the server; when the node has received a delivery packet from the server, the node duplicates and delivers the delivery packet only to those clients whose request packet arrival times, registered in the delivery table, are within a fixed period from the arrival of the delivery packet.

Abstract: A semiconductor chip is mounted on a heat sink disposed inside a through-hole of a wiring board, electrodes of the semiconductor chip and connecting terminals of the wiring board are connected by bonding wires, a sealing resin is formed to cover the semiconductor chip and the bonding wires, and solder balls are formed on the lower surface of the wiring board, thereby constituting the semiconductor device. The heat sink is thicker than the wiring board. The heat sink has a protruded portion protruding to outside from the side surface of the heat sink, the protruded portion is located on the upper surface of the wiring board outside the through-hole, and the lower surface of the protruded portion contacts to the upper surface of the wiring board. When the semiconductor device is manufactured, the heat sink is inserted from the upper surface side of the wiring board.

Abstract: The present invention provides a method of cleaning a storage case to be used for storing or transporting mask substrates such as photomasks and photomask blanks, semiconductor substrates such as semiconductor wafers, pellicles, or the like. The present invention: facilitates a regular cleaning operation, can be used also for a storage case of a complicated shape, does not require a large scale equipment or an expensive equipment to facilitate an environmental countermeasure, and provides high cleaning effect. The method of cleaning a storage case polluted by adhesion of a foreign substance of an organic material, an ionic foreign substances or an ionic crystal foreign substance physically absorbed, comprises a step of placing the storage case still in air flow of cleaned air or an inert gas in a temperature range from room temperature to 80° C. for desorbing and removing the foreign substance adhered to the storage case.

Abstract: The heat-release properties of semiconductor device are to be improved and the reliability thereof is to be improved. The semiconductor device has a wiring substrate, a heat-releasing plate having a convex part inserted into a through-hole of the wiring substrate, a semiconductor chip mounted over the convex part of the heat-releasing plate, and a bonding wire coupling an electrode pad of the semiconductor chip with a bonding lead of the wiring substrate, and further has a sealing portion covering a portion of an upper surface of the wiring substrate, a sealing portion covering a portion of a lower surface of the wiring substrate including the semiconductor chip and the bonding wire, and a solder ball placed over a lower surface of the wiring substrate.