Abstract: This disclosure relates scan chain stitching. In one example, scan chain elements from a scan chain element space can be received for a scan chain partition. The scan chain elements can be grouped based on scan chain element grouping criteria to form scan chain groups. Scan chain data identifying a number of scan chains for the scan chain partition can be received. The scan chains can be scan chain balanced across the scan chain groups to assign each scan chain to one of the scan chain groups. The scan chain elements associated with each scan chain of the scan chains can be scan chain element balanced. Scan chain elements for each associated scan chain can be connected to form a scan chain data test path during a generation of scan chain circuitry in response to the scan chain element balancing.

Abstract: A method for identifying a physical memory(ies) associated with a logical memory(ies) in a memory design can include (a) receiving a generic netlist for the memory design, (b) generating a test mode for the memory using the generic netlist, (c) determining the logical memory(ies); (d) performing a simulation on the test mode for the logical memory(ies); and (e) identifying the physical memory(ies) by tracing chip selects for the physical memory(ies) to the logical memory(ies). The identifying the physical memory(ies) may further include identifying which chip selects are active. The identifying the physical memory(ies) can further include tracing an address and a data pin(s) for the logical memory(ies) in the simulation. The identifying the physical memory(ies) can further include determining an address and a data pin(s) for the logical memory(ies) in the simulation.

Abstract: In one aspect, electronic design automation systems, methods, and non-transitory computer readable media are presented for adding a memory built-in self-test (MBIST) logic at register transfer level (RTL) or at netlist level into an integrated circuit (IC) design. In some embodiments, the MBIST logic is coupled to a physical memory module via a logical boundary of an intermediate level module that contains the physical memory module. The MBIST logic helps to keep intact integrity of the intermediate level module, making it more likely to meet any specified performance of the intermediate level module and reduce area overhead.

Abstract: Aspects of the present disclosure involve insertion of power domain aware memory testing logic into integrated circuit designs to enable efficient testing of the memories embedded therein. In example embodiments, each power domain of the integrated circuit, and the memories included therein, are associated with dedicated test data register (TDR) set and instruction set. Each instruction set causes memory test logic circuitry in the integrated circuit to test the memories included in the corresponding power domain in parallel. Once testing of memories within a particular power domain is over, the test circuitry tests memories belonging to another power domain in parallel, and so on.

Abstract: Testing of memories is done using an optimized memory built-in-self-test (MBIST) approach, including the generation of compact models for memory. Cost functions are constructed from estimated parameters affecting MBIST, and a user is able to assign relative weights to the parameters. Estimated parameters include MBIST area, wiring congestion, and timing overhead, as well as power consumption and timing. The cost functions are minimized using optimization techniques, resulting in an optimized grouping of memory devices and an optimized schedule for MBIST testing. The estimated parameters may be derived from a compact model constructed from data experimentally-derived from various memory devices. This approach allows a circuit designer to generate and revise groupings and schedules prior to running a full design flow, saving time and cost, while still achieving high-quality results.

Abstract: Testing of memories is done using an optimized memory built-in-self-test (MBIST) approach, including the generation of compact models for memory. Cost functions are constructed from estimated parameters affecting MBIST, and a user is able to assign relative weights to the parameters. Estimated parameters include MBIST area, wiring congestion, and timing overhead, as well as power consumption and timing. The cost functions are minimized using optimization techniques, resulting in an optimized grouping of memory devices and an optimized schedule for MBIST testing. The estimated parameters may be derived from a compact model constructed from data experimentally-derived from various memory devices. This approach allows a circuit designer to generate and revise groupings and schedules prior to running a full design flow, saving time and cost, while still achieving high-quality results.

Abstract: Testing of memories is done using an optimized memory built-in-self-test (MBIST) approach, including the generation of compact models for memory. Cost functions are constructed from estimated parameters affecting MBIST, and a user is able to assign relative weights to the parameters. Estimated parameters include MBIST area, wiring congestion, and timing overhead, as well as power consumption and timing. The cost functions are minimized using optimization techniques, resulting in an optimized grouping of memory devices and an optimized schedule for MBIST testing. The estimated parameters may be derived from a compact model constructed from data experimentally-derived from various memory devices. This approach allows a circuit designer to generate and revise groupings and schedules prior to running a full design flow, saving time and cost, while still achieving high-quality results.

Abstract: Testing of memories is done using an optimized memory built-in-self-test (MBIST) approach, including the generation of compact models for memory. Cost functions are constructed from estimated parameters affecting MBIST, and a user is able to assign relative weights to the parameters. Estimated parameters include MBIST area, wiring congestion, and timing overhead, as well as power consumption and timing. The cost functions are minimized using optimization techniques, resulting in an optimized grouping of memory devices and an optimized schedule for MBIST testing. The estimated parameters may be derived from a compact model constructed from data experimentally-derived from various memory devices. This approach allows a circuit designer to generate and revise groupings and schedules prior to running a full design flow, saving time and cost, while still achieving high-quality results.

Abstract: A method and apparatus for depositing conductive paste in openings of a circuitized substrate such as a multilayered printed circuit board to produce effective conductive thru-holes capable of being electrically coupled to selected conductive layers of the substrate. The invention comprises using vacuum to draw from the underside of the substrate while substantially simultaneously applying the paste onto the substrate's opposing surface. One example of means for accomplishing such paste application is a squeegee, and in one embodiment, two such squeegees may be used. A porous member is used to engage the substrate's undersurface during the vacuum draw, this member being positioned atop a base vacuum member through which the vacuum is drawn.

Abstract: A method of plating a circuit pattern on a substrate to produce a circuitized substrate (e.g., a printed circuit board) in which a dual step metallurgy application process is used in combination with a dual step photo-resist removal process. Thru-holes are also possible, albeit not required.

Abstract: A method of making a printed circuit board in which openings of different length are formed using a cover atop one of the openings to prevent dielectric material from an interim layer of heat-deformable dielectric material from entering the opening when the sub-composite having the opening therein is bonded to a second sub-composite. The bonded sub-composites are then provided with a second opening which extends there-through, this second opening being longer than the first. Pins of an electrical component may then be inserted within the first and second openings of different length.