Abstract: Embodiments of inductive communication devices include first and second galvanically isolated IC die and a dielectric structure. Each IC die has a coil proximate to a first surface of the IC die. The IC die are arranged so that the first surfaces of the IC die face each other, and the first coil and the second coil are aligned across a gap between the first and second IC die. The dielectric structure is positioned within the gap directly between the first and second coils, and a plurality of conductive structures are positioned in or on the dielectric structure and electrically coupled with the second IC die. The conductive structures include portions configured to function as bond pads, and the bond pads may be coupled to package leads using wirebonds. During operation, signals are conveyed between the IC die through inductive coupling between the coils.

Abstract: Embodiments of inductive communication devices include first and second galvanically isolated IC die. The first IC die has a first coil proximate to a first surface of the first IC die, and the second IC die has a second coil proximate to a first surface of the second IC die. The first and second IC die are arranged so that the first surfaces of the first and second IC die face each other, and the first coil and the second coil are aligned across a gap between the first and second IC die. One or more dielectric components are positioned within the gap directly between the first and second coils. During operation, a first signal is provided to the first coil, and the first coil converts the signal into a time-varying magnetic field. The magnetic field couples with the second coil, which produces a corresponding second signal.

Abstract: Embodiments of inductive communication devices include first and second galvanically isolated IC die and a dielectric structure. Each IC die has a coil proximate to a first surface of the IC die. The IC die are arranged so that the first surfaces of the IC die face each other, and the first coil and the second coil are aligned across a gap between the first and second IC die. The dielectric structure is positioned within the gap directly between the first and second coils, and a plurality of conductive structures are positioned in or on the dielectric structure and electrically coupled with the second IC die. The conductive structures include portions configured to function as bond pads, and the bond pads may be coupled to package leads using wirebonds. During operation, signals are conveyed between the IC die through inductive coupling between the coils.

Abstract: A system for calibrating pulmonary function test equipment having syringe means, including a syringe having a cylindrically shaped sidewall, a proximal end with an centrally located orifice, a distal end with an output port, an interior cavity, and a plunger with a shaft slidably mounted through the orifice, a piston-type head mounted on one end of the shaft, and a handle mounted on an opposing end of the shaft; an FRC port; a rigid FRC bag connected in flow communication with the FRC port; control means having a plurality of stop mechanisms, including a first stop mechanism, a second stop mechanism structured to enable selective connection of the interior cavity in flow communication with the FRC port, and a third stop mechanism, and connection means structured to connect the syringe means to existing pulmonary function test equipment. A method of utilizing the system is also disclosed.

Abstract: In one embodiment of the invention, a semiconductor component includes: a leadframe (110, 210, 310, 410) having a surface (111, 211, 311, 411); an integrated passive component (120, 220, 320, 420) located above the surface of the leadframe; a semiconductor chip (130, 230, 330, 430) electrically coupled to the integrated passive component and located above the surface of the leadframe; and a mold compound (140, 240, 340, 440) disposed around the semiconductor chip, the integrated passive component, and the leadframe. A portion (112, 212, 312, 412) of the leadframe is exposed outside of the mold compound. The integrated passive component comprises a passive device (121, 221, 321, 421). A direction (190, 290, 390, 490) perpendicular to the surface of the leadframe is a vertical direction, and the semiconductor chip, the integrated passive component, and the leadframe are arranged vertically with respect to each other.

Abstract: Pressure in a cuff on an endotracheal tube is controlled by a fluid circuit that includes a port on the endotracheal tube, a moisture absorbent barrier covering that port, a one-way valve, a pressure manometer as well as a pilot balloon fluidically connected to the cuff. A thumb wheel is included in one form of the invention to control operation of the one-way valve.

Abstract: A semiconductor package having a unique die cavity configuration wherein each side of the die cavity is arced outward from the center of the die cavity. This configuration is especially well suited for use in laminated multilayer ceramic packages.

Abstract: Described herein is a standoff for use with semiconductor packages to prevent chipping. The standoff is designed to fit over a pin of the package and seat on the package surface with a portion extending over the corner of the package.