Semiconductor package

- Motorola, Inc.
Skip to: Description  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a front and upper right perspective view of a semiconductor package showing our new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a side elevational view thereof; and,

FIG. 4 is a bottom plan view thereof.

Referenced Cited
U.S. Patent Documents
D259560 June 16, 1981 Mochizuki et al.
D260986 September 29, 1981 Mochizuki et al.
D288922 March 24, 1987 Olla
D318271 July 16, 1991 Hasegawa et al.
5109269 April 28, 1992 Holzman
Other references
  • Mini-Circuits' YSW-2-50DR semiconductor package on p. 5 of EDN Jan. 1991.
Patent History
Patent number: D345731
Type: Grant
Filed: Dec 3, 1992
Date of Patent: Apr 5, 1994
Assignee: Motorola, Inc. (Schaumburg, IL)
Inventors: Norman L. Owens (Chandler, AZ), Timothy L. Olson (Phoenix, AZ)
Primary Examiner: Wallace R. Burke
Assistant Examiner: Joel Sincavage
Attorneys: Gary W. Hoshizaki, Michael D. Bingham
Application Number: 0/2,224